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Han J, Mei J, Huang D, Pan K, Zhang Y, Xu Z, Zheng F, Jiang J, Li Y, Huang Y, Wang H, Li Q. SiO2 bridged AlN/methylphenyl silicone resin composite with integrated superior insulating property, high-temperature resistance, and high thermal conductivity. J Colloid Interface Sci 2024;661:91-101. [PMID: 38295706 DOI: 10.1016/j.jcis.2024.01.186] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/24/2023] [Revised: 01/17/2024] [Accepted: 01/26/2024] [Indexed: 02/27/2024]
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