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Jiang B, Mu M, Zhou Y, Zhang J, Li W. Nanoparticle-Empowered Core-Shell Microcapsules: From Architecture Design to Fabrication and Functions. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024:e2311897. [PMID: 38456762 DOI: 10.1002/smll.202311897] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/19/2023] [Revised: 02/27/2024] [Indexed: 03/09/2024]
Abstract
Compartmentalization is a powerful concept to integrate multiscale components with diverse functionalities into miniature architectures. Inspired by evolution-optimized cell compartments, synthetic core-shell capsules enable storage of actives and on-demand delivery of programmed functions, driving scientific progress across various fields including adaptive materials, sustainable electronics, soft robotics, and precision medicine. To simultaneously maximize structural stability and environmental sensitivity, which are the two most critical characteristics dictating performance, diverse nanoparticles are incorporated into microcapsules with a dense shell and a liquid core. Recent studies have revealed that these nano-additives not only enhance the intrinsic properties of capsules including mechanical robustness, optical behaviors, and thermal conductivity, but also empower dynamic features such as triggered release, deformable structures, and fueled mobility. In this review, the physicochemical principles that govern nanoparticle assembly during microencapsulation are examined in detail and the architecture-controlled functionalities are outlined. Through the analysis of how each primary method implants nanoparticles into microcapsules, their distinct spatial organizations within the core-shell structures are highlighted. Following a detailed discussion of the specialized functions enabled by specific nanoparticles, the vision of the required fundamental insights and experimental studies for this class of microcarriers to fulfill its potential are sketched.
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Affiliation(s)
- Bo Jiang
- School of Materials Science and Engineering, China University of Petroleum (East China), Qingdao, 266580, China
| | - Manrui Mu
- School of Materials Science and Engineering, China University of Petroleum (East China), Qingdao, 266580, China
| | - Yan Zhou
- School of Materials Science and Engineering, China University of Petroleum (East China), Qingdao, 266580, China
| | - Jun Zhang
- School of Materials Science and Engineering, China University of Petroleum (East China), Qingdao, 266580, China
| | - Wenle Li
- School of Materials Science and Engineering, China University of Petroleum (East China), Qingdao, 266580, China
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Zhu B, Sun H, Zhu Y, He S, Han X. Self-Healing Properties of Water Tree Damage in Multilayered Shell-Core-Structured Microcapsules/Cross-Linked Polyethylene Composites. Polymers (Basel) 2024; 16:155. [PMID: 38201820 PMCID: PMC10780340 DOI: 10.3390/polym16010155] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/22/2023] [Revised: 12/22/2023] [Accepted: 12/28/2023] [Indexed: 01/12/2024] Open
Abstract
To investigate the effect of the structure of microcapsules on the properties of cross-linked polyethylene (XLPE) composites, three XLPE specimens filled with multilayered shell-core-structured microcapsules are designed. In this paper, the microcapsules are first analyzed morphologically and chemically. In addition, the effect of the microcapsule structure on the typical electrical properties of the composites is explored. Finally, the self-healing ability of XLPE specimens filled with microcapsules is verified. The results show that the SiO2 on the surface of the trilayer shell-core microcapsules can make the microcapsules and the XLPE matrix have a better mechanical interlocking ability, which makes the typical properties of the trilayer shell-core microcapsules slightly better than those of the bilayer shell-core microcapsules. Moreover, when the bilayer shell-core or trilayer shell-core microcapsules rupture under the action of an electric field, the repair material reacts with the water tree under capillary action to consume the residual water while generating organic matter to fill in the cavity, thus repairing the damaged area of the water tree and ultimately achieving the self-healing of the composite water tree.
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Affiliation(s)
- Bo Zhu
- MOE Key Laboratory of Engineering Dielectrics and Its Application, Harbin University of Science and Technology, Harbin 150080, China
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Wan B, Dong X, Yang X, Wang J, Zheng MS, Dang ZM, Chen G, Zha JW. Rising of Dynamic Polyimide Materials: A Versatile Dielectric for Electrical and Electronic Applications. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2301185. [PMID: 36906511 DOI: 10.1002/adma.202301185] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/07/2023] [Revised: 03/05/2023] [Indexed: 06/18/2023]
Abstract
Polyimides (PIs) are widely used in circuit components, electrical insulators, and power systems in modern electronic devices and large electrical appliances. Electrical/mechanical damage of materials are important factors that threaten reliability and service lifetime. Dynamic (self-healable, recyclable and degradable) PIs, a promising class of materials that successfully improve electrical/mechanical properties after damage, are anticipated to solve this issue. The viewpoints and perspectives on the status and future trends of dynamic PI based on a few existing documents are shared. The main damage forms of PI dielectric materials in the application process are first introduced, and initial strategies and schemes to solve these problems are proposed. Fundamentally, the bottleneck issues faced by the development of dynamic PIs are indicated, and the relationship between various damage forms and the universality of the method is evaluated. The potential mechanism of the dynamic PI to deal with electrical damage is highlighted and several feasible prospective schemes to address electrical damage are discussed. This study is concluded by presenting a short outlook and future improvements to systems, challenges, and solutions of dynamic PI in electrical insulation. The summary of theory and practice should encourage policy development favoring energy conservation and environmental protection and promoting sustainability.
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Affiliation(s)
- Baoquan Wan
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, P. R. China
- Shunde Graduate School of University of Science and Technology Beijing, Foshan, 528300, P. R. China
| | - Xiaodi Dong
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, P. R. China
- Shunde Graduate School of University of Science and Technology Beijing, Foshan, 528300, P. R. China
| | - Xing Yang
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, P. R. China
- Shunde Graduate School of University of Science and Technology Beijing, Foshan, 528300, P. R. China
| | - Jiangqiong Wang
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, P. R. China
- Shunde Graduate School of University of Science and Technology Beijing, Foshan, 528300, P. R. China
| | - Ming-Sheng Zheng
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, P. R. China
- Shunde Graduate School of University of Science and Technology Beijing, Foshan, 528300, P. R. China
| | - Zhi-Min Dang
- State Key Laboratory of Power System, Department of Electrical Engineering, Tsinghua University, Beijing, 100084, P. R. China
| | - George Chen
- Department of Electronics and Computer Science, University of Southampton, Southampton, SO17 1BJ, UK
| | - Jun-Wei Zha
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, P. R. China
- Shunde Graduate School of University of Science and Technology Beijing, Foshan, 528300, P. R. China
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Zhou Y, Li L, Han Z, Li Q, He J, Wang Q. Self-Healing Polymers for Electronics and Energy Devices. Chem Rev 2023; 123:558-612. [PMID: 36260027 DOI: 10.1021/acs.chemrev.2c00231] [Citation(s) in RCA: 21] [Impact Index Per Article: 21.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/26/2023]
Abstract
Polymers are extensively exploited as active materials in a variety of electronics and energy devices because of their tailorable electrical properties, mechanical flexibility, facile processability, and they are lightweight. The polymer devices integrated with self-healing ability offer enhanced reliability, durability, and sustainability. In this Review, we provide an update on the major advancements in the applications of self-healing polymers in the devices, including energy devices, electronic components, optoelectronics, and dielectrics. The differences in fundamental mechanisms and healing strategies between mechanical fracture and electrical breakdown of polymers are underlined. The key concepts of self-healing polymer devices for repairing mechanical integrity and restoring their functions and device performance in response to mechanical and electrical damage are outlined. The advantages and limitations of the current approaches to self-healing polymer devices are systematically summarized. Challenges and future research opportunities are highlighted.
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Affiliation(s)
- Yao Zhou
- Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Li Li
- Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Zhubing Han
- Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Qi Li
- State Key Laboratory of Power System, Department of Electrical Engineering, Tsinghua University, Beijing 100084, China
| | - Jinliang He
- State Key Laboratory of Power System, Department of Electrical Engineering, Tsinghua University, Beijing 100084, China
| | - Qing Wang
- Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
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