Copper inks for printed electronics: a review

A compact tri-notched flexible UWB antenna based on an inkjet-printable and plasma-activated silver nano ink

The rapid development of ultrawideband (UWB) communication systems has resulted in increasing performance requirements for the antenna system. In addition to a wide bandwidth, fast propagation rates and compact dimensions, flexibility, wearability or portability are also desirable for UWB antennas, as are excellent notch characteristics. Although progress has been made in the development of flexible/wearable antennas desired notch properties are still rather limited. Moreover, most presently available flexible UWB antennas are fabricated using environmentally not attractive subtractive etching-based processes. The usage of facile additive sustainably inkjet printing processes also utilizing low temperature plasma-activated conductive inks is rarely reported. In addition, the currently used tri-notched flexible UWB antenna designs have a relatively large footprint, which poses difficulties when integrated into miniaturized and compact communication devices. In this work, a silver nano ink is used to fabricate the antenna via inkjet printing and an efficient plasma sintering procedure. For the targeted UWB applications miniaturized tri-notched flexible antenna is realized on a flexible polyethylene terephthalate (PET) substrate with a compact size of 17.6 mm × 16 mm × 0.12 mm. The antenna operates in the UWB frequency band (2.9-10.61 GHz), and can shield interferences from WiMAX (3.3-3.6 GHz), WLAN (5.150-5.825 GHz) and X-uplink (7.9-8.4 GHz) bands, as well as exhibits a certain of bendability. Three nested "C" slots of different sizes were adopted to achieve notch features. The simulation and test results demonstrate that the proposed antenna can generate signal radiation in the desired UWB frequency band while retaining the desired notch properties and having acceptable SAR values on-body, making it a viable candidate for usage in flexible or wearable communication transmission devices. The research provides a facile and highly efficient method for fabricating flexible/wearable UWB antennas, that is, the effective combination of inkjet printing processing, flexible substrates, low temperature-activated conductive ink and antenna structure design.

The damage mechanism in copper studied using in situ TEM nanoindentation

Copper (Cu) has a soft-plastic nature, which makes it susceptible to damages from scratching or abrasive machining, such as lapping and polishing. It is a challenge to control these damages as the damage mechanism is elusive. Nonetheless, controlling damages is essential, especially on the atomic surfaces of Cu. To interpret the damage mechanism, in situ transmission electron microscopy (TEM) nanoindentation was performed using a cube-corner indenter with a radius of 57 nm at a loading speed of 5 nm s-1. Experimental results showed that damages originate from dislocations, evolve to stack faults, and then form broken crystallites. When the indentation depth was 45 nm at a load of 20 μN, damages comprised dislocations and stacking faults. After increasing the depth to 67 nm and load to 30 μN, the formation of broken crystallites initiated; and the critical depth was 67 nm. To validate the damage mechanism, fixed-abrasive lapping, mechanical polishing, and chemical mechanical polishing (CMP) were conducted. Firstly, a novel green CMP slurry containing silica, hydrogen peroxide, and aspartic acid was developed. After CMP, a surface roughness Ra of 0.2 nm was achieved with a scanning area of 50 μm × 50 μm; and the thickness of the damaged layer was 3.1 nm, which included a few micro-stacking faults. Lapping and mechanical polishing were carried out using a silicon carbide plate and cerium slurry, with surface roughness Ra values of 16.42 and 1.74 nm, respectively. The damaged layer of the former with a thickness of 300 nm comprised broken crystallites, dislocations, and stacking faults and that of the latter with a thickness of 33 nm involved several stacking faults. This verifies that the damage mechanism derived from in situ TEM nanoindentation is in agreement with lapping and polishing. These outcomes propose new insights into understanding the origin of damages and controlling them, as well as obtaining atomic surfaces using a novel green CMP technique for soft-plastic metals.

Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink

Conductive inks are one of the most important functional materials for printed flexible electronic devices, and their properties determine the methods of subsequent patterning and metallization. In comparison with copper nanoparticle or nanowire inks, copper particle-free inks employing copper(II) formate (Cuf) as a precursor have attracted the interest of researchers due to their flexibility in preparation, excellent stability, and lower conversion temperature. Alkanolamines can provide Cuf with excellent solubility in alcohols while being less toxic and having a certain reducibility, making them preferable ligands in comparison with aliphatic amines and pyridine. However, there have been few studies on the effects of the alkanolamine types on the performance of Cuf inks. Also, the decomposition mechanism of copper-alkanolamine complex inks is not clear. In this work, different kinds of alkanolamines were chosen as ligands to formulate Cuf inks to address the mentioned issues. The influences of amine types on the stability, wettability, thermal decomposition behavior, and electrical performance of the formulated Cuf particle-free inks were investigated in detail. The results show that the utilization of alkanolamines could provide Cuf with excellent solubility in alcohols, resulting in an ink with good stability and favorable wetting properties. The thermal decomposition temperature and electrical performance of the formulated copper ink are largely dependent on the amine used. When amines with a longer carbon chain and more branches were utilized to prepare the ink, a decreased decomposition temperature was observed on the derived inks because of the steric hindrance effect. Copper films with good morphology and conductivity could be obtained at low temperatures by selecting the appropriate alkanolamine. Copper particle-free conductive ink from 2-amino-2-methyl-1-propanol demonstrated better morphology and electrical performance (16.09 μΩ·cm) and was successfully used for conductive circuits by direct-writing.

Seedless wet synthesis of copper-twinned nanocrystals

The wet synthesis of copper (Cu)-twinned nanostructures often requires the addition of noble metal seeds, as twinned Cu seeds are prone to oxidative etching, which inevitably introduces other metal species. In this study, a universal and seedless wet method is proposed for the synthesis of various Cu-twinned nanostructures, such as large Cu decahedrons (with sizes up to 300 nm), singly twinned Cu right bipyramids, and Cu nanorods. The amount of chloride ions (Cl-) and oleylamine and an optimal heating rate at the initial stage were proven to be crucial in this synthesis. Theoretical results revealed that the amount of Cl- could adjust the Gibbs free energy of Cu seeds by promoting the dissociation of oleylamine, which, in turn, determined the structure of thermodynamically favorable seeds based on the thermodynamic model. To the best of our knowledge, this is the first report on large Cu decahedrons and singly twinned Cu right bipyramids. Moreover, they both showed strong localized surface plasmon resonance in the near-infrared region. The photothermal conversion efficiency of large Cu decahedrons increased up to 52.9% upon 808 nm laser irradiation, which is the highest value ever reported for Cu nanocrystals.

Rapid Fabrication of Flexible Cu@Ag Flake/SAE Composites with Exceptional EMIS and Joule Heating Performance

High electromagnetic interference shielding (EMIS) effectiveness and good thermal management properties are both required to meet the rapid development of integrated electronic components. However, it remains challenging to obtain environmentally friendly and flexible films with high EMIS and thermal management performance in an efficient and scalable way. In this paper, an environmentally friendly strategy is proposed to synthesize multifunctional waterborne Cu@Ag flake conductive films using water as the solvent and silicone-acrylic emulsion (SAE) as a matrix. The obtained films show high electrical conductivity and exceptional EMI SE and electrothermal conversion properties. The EMI SE in the X-band is higher than 76.31 dB at a thickness of 60 μm owing to the ultrahigh electrical conductivity of 1073.61 S cm-1. The film warms up quickly to 102.1 °C within 10 s under a low voltage of 2.0 V. In addition, the shielding coating is sufficiently flexible to retain a conductivity of 93.4% after 2000 bending-release cycles with a bending radius of 3 mm. This work presents an alternative strategy to produce high EMIS effectiveness and Joule heating films for highly integrated and flexible electronic components in a green, scalable, and highly efficient way.

Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass

Copper potentially provides a cost-effective replacement for silver in printed electronic circuitry with diverse applications in healthcare, solar energy, IOT devices and automotive applications. The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the sintering process. Photonic sintering offers a means of overcoming the oxidation by which rapid conversion from discrete nano-micro particles to fully or partially sintered products occurs. An experimental study of flash lamp sintering of mixed nano copper and mixed nano/ micro copper thick film screen printed structures on FTO coated glass was carried out. It shows that there may be multiple energy windows which can successfully sinter the thick film copper print preventing detrimental copper oxidation. Under optimum conditions, the conductivities achieved in under 1 s was (3.11-4.3 × 10^-7 Ω m) matched those achieved in 90 min at 250 °C under reducing gas conditions, offering a significant improvement in productivity and reduced energy demand. Also present a good film stability of a 14% increase in line resistance of 100 N material, around 10% for the 50N50M ink and only around 2% for the 20N80M.