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Seva S, Rorem B, Chinnathambi K, Estrada D, Guo LJ, Subbaraman H. Nozzle-Free Printing of CNT Electronics Using Laser-Generated Focused Ultrasound. SMALL METHODS 2024:e2301596. [PMID: 38470204 DOI: 10.1002/smtd.202301596] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/18/2023] [Revised: 02/27/2024] [Indexed: 03/13/2024]
Abstract
Printed electronics have made remarkable progress in recent years and inkjet printing (IJP) has emerged as one of the leading methods for fabricating printed electronic devices. However, challenges such as nozzle clogging, and strict ink formulation constraints have limited their widespread use. To address this issue, a novel nozzle-free printing technology is explored, which is enabled by laser-generated focused ultrasound, as a potential alternative printing modality called Shock-wave Jet Printing (SJP). Specifically, the performance of SJP-printed and IJP-printed bottom-gated carbon nanotube (CNT) thin film transistors (TFTs) is compared. While IJP required ten print passes to achieve fully functional devices with channel dimensions ranging from tens to hundreds of micrometers, SJP achieved comparable performance with just a single pass. For optimized devices, SJP demonstrated six times higher maximum mobility than IJP-printed devices. Furthermore, the advantages of nozzle-free printing are evident, as SJP successfully printed stored and unsonicated inks, delivering moderate electrical performance, whereas IJP suffered from nozzle clogging due to CNT agglomeration. Moreover, SJP can print significantly longer CNTs, spanning the entire range of tube lengths of commercially available CNT ink. The findings from this study contribute to the advancement of nanomaterial printing, ink formulation, and the development of cost-effective printable electronics.
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Affiliation(s)
- Sarah Seva
- Electrical and Computer Engineering, Boise State University, 1910 W University Drive, Boise, ID, 83725, USA
| | - Benjamin Rorem
- Applied Physics, University of Michigan, Ann Arbor, MI, 48109, USA
| | - Karthik Chinnathambi
- Micron School of Materials Science and Engineering, Boise State University, 1910 W University Drive, Boise, ID, 83725, USA
| | - David Estrada
- Micron School of Materials Science and Engineering, Boise State University, 1910 W University Drive, Boise, ID, 83725, USA
- Center for Advanced Energy Studies, Idaho National Laboratory, Idaho Falls, ID, 83415, USA
| | - L Jay Guo
- Applied Physics, University of Michigan, Ann Arbor, MI, 48109, USA
- Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, 48109, USA
| | - Harish Subbaraman
- School of Electrical Engineering and Computer Science, Oregon State University, 110 SW Park Terrace Pl, Corvallis, OR, 97331, USA
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Wang G, Meng F, Chen Y, Lotnyk A, Shen X. Boosting Thermoelectric Performance of Bi 2 Te 3 Material by Microstructure Engineering. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2024; 11:e2308056. [PMID: 38059833 PMCID: PMC10853752 DOI: 10.1002/advs.202308056] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/24/2023] [Revised: 11/18/2023] [Indexed: 12/08/2023]
Abstract
Due to the intrinsic contradiction of electrical conductivity and Seebeck coefficient in thermoelectric materials, the enhancement for the power factor (PF) is limited. Since the PF decides the output power, strategies to the enhancement of PF are of paramount importance. In this work, Bi2 Te3 /Sb and Bi2 Te3 /W multilayer films are proposed to enhance the thermoelectric properties. Both systems possess extremely high conductivity of ≈5.6 × 105 S m-1 . Moreover, the electrical conductivity and Seebeck coefficient simultaneously increase as temperature rising, showing the overcome of the intrinsic contradiction. This results in ultrahigh PFs of 1785 µWm-1 K-2 for Bi2 Te3 /W and of 1566 µWm-1 K-2 for Bi2 Te3 /Sb at 600 K. Thermal heating of the Bi2 Te3 /Sb multilayer system shows compositional changes with subsequent formation of Bi-Te-Sb phases, Sb-rich Bi-Te precipitates, and cavities. Contrary, the multilayer structure of the Bi2 Te3 /W films is maintained, while Bi2 Te3 grains of high-crystalline quality are confined between the W layers. In addition, bilayer defects in Bi2 Te3 and smaller cavities at the interface to W layers are also observed. Thus, compositional and confinement effects as well as structural defects result in the ultrahigh PF. Overall, this work demonstrates the strategies on how to obtain ultrahigh PFs of commercial Bi2 Te3 material by microstructure engineering using multilayer structures.
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Affiliation(s)
- Guoxiang Wang
- Laboratory of Infrared Materials and DevicesThe Research Institute of Advanced TechnologiesNingbo UniversityNingboZhejiang315211China
| | - Fanzheng Meng
- Laboratory of Infrared Materials and DevicesThe Research Institute of Advanced TechnologiesNingbo UniversityNingboZhejiang315211China
| | - Yingqi Chen
- Laboratory of Infrared Materials and DevicesThe Research Institute of Advanced TechnologiesNingbo UniversityNingboZhejiang315211China
| | - Andriy Lotnyk
- Laboratory of Infrared Materials and DevicesThe Research Institute of Advanced TechnologiesNingbo UniversityNingboZhejiang315211China
- Leibniz Institute of Surface Engineering (IOM)Permoserstr. 15D‐04318LeipzigGermany
| | - Xiang Shen
- Laboratory of Infrared Materials and DevicesThe Research Institute of Advanced TechnologiesNingbo UniversityNingboZhejiang315211China
- Institute of Ocean EngineeringNingbo UniversityNingboZhejiang315211China
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3
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Valayil Varghese T, Eixenberger J, Rajabi-Kouchi F, Lazouskaya M, Francis C, Burgoyne H, Wada K, Subbaraman H, Estrada D. Multijet Gold Nanoparticle Inks for Additive Manufacturing of Printed and Wearable Electronics. ACS MATERIALS AU 2024; 4:65-73. [PMID: 38221917 PMCID: PMC10786129 DOI: 10.1021/acsmaterialsau.3c00058] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 07/18/2023] [Revised: 10/01/2023] [Accepted: 10/04/2023] [Indexed: 01/16/2024]
Abstract
Conductive and biofriendly gold nanomaterial inks are highly desirable for printed electronics, biosensors, wearable electronics, and electrochemical sensor applications. Here, we demonstrate the scalable synthesis of stable gold nanoparticle inks with low-temperature sintering using simple chemical processing steps. Multiprinter compatible aqueous gold nanomaterial inks were formulated, achieving resistivity as low as ∼10-6 Ω m for 400 nm thick films sintered at 250 °C. Printed lines with a resolution of <20 μm and minimal overspray were obtained using an aerosol jet printer. The resistivity of the printed patterns reached ∼9.59 ± 1.2 × 10-8 Ω m after sintering at 400 °C for 45 min. Our aqueous-formulated gold nanomaterial inks are also compatible with inkjet printing, extending the design space and manufacturability of printed and flexible electronics where metal work functions and chemically inert films are important for device applications.
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Affiliation(s)
- Tony Valayil Varghese
- Department
of Electrical and Computer Engineering, Boise State University, Boise, Idaho 83725, United States
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
| | - Josh Eixenberger
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
- Department
of Physics, Boise State University, Boise, Idaho 83725, United States
- Center
for Atomically Thin Multifunctional Coatings, Boise State University, Boise, Idaho 83725, United States
- Center
for Advanced Energy Studies, Boise State
University, Boise, Idaho 83725, United States
| | - Fereshteh Rajabi-Kouchi
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
| | - Maryna Lazouskaya
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
- Idaho
National Laboratory, Idaho Falls, Idaho 83415, United States
| | - Cadré Francis
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
| | - Hailey Burgoyne
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
| | - Katelyn Wada
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
| | - Harish Subbaraman
- School
of Electrical Engineering and Computer Science, Oregon State University, Corvallis ,Oregon 97331, United States
- Inflex
Laboratories LLC, Boise, Idaho 83706, United States
| | - David Estrada
- Micron
School of Material Science and Engineering, Boise State University, Boise, Idaho 83725, United States
- Center
for Atomically Thin Multifunctional Coatings, Boise State University, Boise, Idaho 83725, United States
- Center
for Advanced Energy Studies, Boise State
University, Boise, Idaho 83725, United States
- School of
Science, Department of Chemistry and Biotechnology, Tallinn University of Technology, Ehitajate tee 5, 19086 Tallinn, Estonia
- Inflex
Laboratories LLC, Boise, Idaho 83706, United States
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Gutierrez D, Doshi P, Wong HY, Nordlund D, Gandhiraman RP. Printed graphene and its composite with copper for electromagnetic interference shielding applications. NANOTECHNOLOGY 2024; 35:135202. [PMID: 38055996 DOI: 10.1088/1361-6528/ad12e9] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/21/2023] [Accepted: 12/06/2023] [Indexed: 12/08/2023]
Abstract
Advances in mobile electronics and telecommunication systems along with 5G technologies have been escalating the electromagnetic interference (EMI) problem in recent years. Graphene-based material systems such as pristine graphene, graphene-polymer composites and other graphene-containing candidates have been shown to provide adequate EMI shielding performance. Besides achieving the needed shielding effectiveness (SE), the method of applying the candidate shielding material onto the object in need of protection is of enormous importance due to considerations of ease of application, reduced logistics and infrastructure, rapid prototyping and throughput, versatility to handle both rigid and flexible substrates and cost. Printing readily meets all these criteria and here we demonstrate plasma jet printing of thin films of graphene and its composite with copper to meet the EMI shielding needs. SE over 30 dB is achieved, which represents blocking over 99.9% of the incoming radiation. Graphene and its composite with copper yield higher green index compared to pure copper shields, implying reduced reflection of incoming electromagnetic waves to help reduce secondary pollution.
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Affiliation(s)
- Daniel Gutierrez
- Space Foundry Inc., San Jose, CA 95133, United States of America
| | - Pranay Doshi
- Space Foundry Inc., San Jose, CA 95133, United States of America
| | - Hiu Yung Wong
- Department of Electrical Engineering, San Jose State University, San Jose, CA 95192, United States of America
| | - Dennis Nordlund
- Space Foundry Inc., San Jose, CA 95133, United States of America
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Al-Amri AM. Recent Progress in Printed Photonic Devices: A Brief Review of Materials, Devices, and Applications. Polymers (Basel) 2023; 15:3234. [PMID: 37571128 PMCID: PMC10422352 DOI: 10.3390/polym15153234] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/02/2023] [Revised: 07/26/2023] [Accepted: 07/27/2023] [Indexed: 08/13/2023] Open
Abstract
Printing electronics incorporates several significant technologies, such as semiconductor devices produced by various printing techniques on flexible substrates. With the growing interest in printed electronic devices, new technologies have been developed to make novel devices with inexpensive and large-area printing techniques. This review article focuses on the most recent developments in printed photonic devices. Photonics and optoelectronic systems may now be built utilizing materials with specific optical properties and 3D designs achieved through additive printing. Optical and architected materials that can be printed in their entirety are among the most promising future research topics, as are platforms for multi-material processing and printing technologies that can print enormous volumes at a high resolution while also maintaining a high throughput. Significant advances in innovative printable materials create new opportunities for functional devices to act efficiently, such as wearable sensors, integrated optoelectronics, and consumer electronics. This article provides an overview of printable materials, printing methods, and the uses of printed electronic devices.
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Affiliation(s)
- Amal M Al-Amri
- Physics Department, Collage of Science & Arts, King Abdulaziz University, Rabigh 25724, Saudi Arabia
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