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Xu K, Wang T, Lu C, Song Y, Liu Y, Yu J, Liu Y, Li Z, Meng J, Zhu H, Sun QQ, Zhang DW, Chen L. Novel Two-Terminal Synapse/Neuron Based on an Antiferroelectric Hafnium Zirconium Oxide Device for Neuromorphic Computing. NANO LETTERS 2024; 24:11170-11178. [PMID: 39148056 DOI: 10.1021/acs.nanolett.4c02142] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/17/2024]
Abstract
Functionally diverse devices with artificial neuron and synapse properties are critical for neuromorphic systems. We present a two-terminal artificial leaky-integrate-fire (LIF) neuron based on 6 nm Hf0.1Zr0.9O2 (HZO) antiferroelectric (AFE) thin films and develop a synaptic device through work function (WF) engineering. LIF neuron characteristics, including integration, firing, and leakage, are achieved in W/HZO/W devices due to the accumulated polarization and spontaneous depolarization of AFE HZO films. By engineering the top electrode with asymmetric WFs, we found that Au/Ti/HZO/W devices exhibit synaptic weight plasticity, such as paired-pulse facilitation and long-term potentiation/depression, achieving >90% accuracy in digit recognition within constructed artificial neural network systems. These findings suggest that AFE HZO capacitor-based neurons and WF-engineered artificial synapses hold promise for constructing efficient spiking neuron networks and artificial neural networks, thereby advancing neuromorphic computing applications based on emerging AFE HZO devices.
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Affiliation(s)
- Kangli Xu
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Tianyu Wang
- School of Integrated Circuits, Shandong University, Jinan 250100, China
- Suzhou Research Institute of Shandong University, Suzhou 215123, China
- State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China
| | - Chen Lu
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Yifan Song
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Yongkai Liu
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Jiajie Yu
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Yinchi Liu
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Zhenhai Li
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
| | - Jialin Meng
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
- National Integrated Circuit Innovation Center, Shanghai 201203, China
| | - Hao Zhu
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
- National Integrated Circuit Innovation Center, Shanghai 201203, China
| | - Qing-Qing Sun
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
- National Integrated Circuit Innovation Center, Shanghai 201203, China
| | - David Wei Zhang
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
- National Integrated Circuit Innovation Center, Shanghai 201203, China
- Jiashan Fudan Institute, Jiaxing 314110, China
| | - Lin Chen
- School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai 200433, P. R. China
- National Integrated Circuit Innovation Center, Shanghai 201203, China
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Jiang S, Peng L, Li L, Dai Q, Pei M, Wu C, Su J, Gu D, Zhang H, Guo H, Qiu J, Li Y. Task-Adaptive Neuromorphic Computing Using Reconfigurable Organic Neuristors with Tunable Plasticity and Logic-in-Memory Operations. J Phys Chem Lett 2024; 15:2301-2310. [PMID: 38386516 DOI: 10.1021/acs.jpclett.4c00284] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/24/2024]
Abstract
The brain's function can be dynamically reconfigured through a unified neuron-synapse architecture, enabling task-adaptive network-level topology for energy-efficient learning and inferencing. Here, we demonstrate an organic neuristor utilizing a ferroelectric-electrolyte dielectric interface. This neuristor enables tunable short- to long-term plasticity and reconfigurable logic-in-memory functions by controlling the interfacial interaction between electrolyte ions and ferroelectric dipoles. Notably, the short-term plasticity of the organic neuristor allows for power-efficient reservoir computing in edge-computing scenarios, exhibiting impressive recognition accuracy, including images (90.6%) and acoustic signals (97.7%). For high-performance computing tasks, the neuristor based on long-term plasticity and logic-in-memory operations can construct all of the hardware circuits of a binarized neural network (BNN) within a unified framework. The BNN demonstrates excellent noise tolerance, achieving high recognition accuracies of 99.2% and 86.4% on the MNIST and CIFAR-10 data sets, respectively. Consequently, our research sheds light on the development of power-efficient artificial intelligence systems.
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Affiliation(s)
- Sai Jiang
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu 210093, P. R. China
| | - Lichao Peng
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Longfei Li
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu 210093, P. R. China
| | - Qinyong Dai
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu 210093, P. R. China
| | - Mengjiao Pei
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu 210093, P. R. China
| | - Chaoran Wu
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Jian Su
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Ding Gu
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Han Zhang
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Huafei Guo
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Jianhua Qiu
- School of Microelectronics and Control Engineering, Changzhou University, Changzhou, Jiangsu 213164, P. R. China
| | - Yun Li
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu 210093, P. R. China
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