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Cheng Z, Liang J, Kawamura K, Zhou H, Asamura H, Uratani H, Tiwari J, Graham S, Ohno Y, Nagai Y, Feng T, Shigekawa N, Cahill DG. High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nat Commun 2022; 13:7201. [PMID: 36418359 PMCID: PMC9684120 DOI: 10.1038/s41467-022-34943-w] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/03/2022] [Accepted: 11/14/2022] [Indexed: 11/27/2022] Open
Abstract
High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as both active functional materials and thermal management materials. We report an isotropic high thermal conductivity exceeding 500 W m-1K-1 at room temperature in high-quality wafer-scale cubic silicon carbide (3C-SiC) crystals, which is the second highest among large crystals (only surpassed by diamond). Furthermore, the corresponding 3C-SiC thin films are found to have record-high in-plane and cross-plane thermal conductivity, even higher than diamond thin films with equivalent thicknesses. Our results resolve a long-standing puzzle that the literature values of thermal conductivity for 3C-SiC are lower than the structurally more complex 6H-SiC. We show that the observed high thermal conductivity in this work arises from the high purity and high crystal quality of 3C-SiC crystals which avoids the exceptionally strong defect-phonon scatterings. Moreover, 3C-SiC is a SiC polytype which can be epitaxially grown on Si. We show that the measured 3C-SiC-Si thermal boundary conductance is among the highest for semiconductor interfaces. These findings provide insights for fundamental phonon transport mechanisms, and suggest that 3C-SiC is an excellent wide-bandgap semiconductor for applications of next-generation power electronics as both active components and substrates.
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Affiliation(s)
- Zhe Cheng
- grid.35403.310000 0004 1936 9991Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
| | - Jianbo Liang
- Department of Physics and Electronics, Osaka Metropolitan University, Sugimoto 3-3-138, Sumiyoshi, Osaka, 558-8585 Japan
| | - Keisuke Kawamura
- grid.509474.bSIC Division, Air Water Inc., 2290-1 Takibe, Toyoshina Azumino, Nagano, 399-8204 Japan
| | - Hao Zhou
- grid.223827.e0000 0001 2193 0096Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112 USA
| | - Hidetoshi Asamura
- Specialty Materials Dept., Electronics Unit, Air Water Inc. 4007-3 Yamato, Azusagawa, Nagano 390-1701 Japan
| | - Hiroki Uratani
- grid.509474.bSIC Division, Air Water Inc., 2290-1 Takibe, Toyoshina Azumino, Nagano, 399-8204 Japan
| | - Janak Tiwari
- grid.223827.e0000 0001 2193 0096Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112 USA
| | - Samuel Graham
- grid.213917.f0000 0001 2097 4943George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332 USA
| | - Yutaka Ohno
- grid.69566.3a0000 0001 2248 6943Institute for Materials Research, Tohoku University, 2145-2 Narita, Oarai, Ibaraki 311-1313 Japan
| | - Yasuyoshi Nagai
- grid.69566.3a0000 0001 2248 6943Institute for Materials Research, Tohoku University, 2145-2 Narita, Oarai, Ibaraki 311-1313 Japan
| | - Tianli Feng
- grid.223827.e0000 0001 2193 0096Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112 USA
| | - Naoteru Shigekawa
- Department of Physics and Electronics, Osaka Metropolitan University, Sugimoto 3-3-138, Sumiyoshi, Osaka, 558-8585 Japan
| | - David G. Cahill
- grid.35403.310000 0004 1936 9991Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
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Liu Y, Zhou Y, Xu Y. State-of-the-Art, Opportunities, and Challenges in Bottom-up Synthesis of Polymers with High Thermal Conductivity. Polym Chem 2022. [DOI: 10.1039/d2py00272h] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
Abstract
In contrast to metals, polymers are predominantly thermal and electrical insulators. With their unparalleled advantages such as light weight, turning polymer insulators into heat conductors with metal-like thermal conductivity is...
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