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For: Qin S, Sun P, Wu Z, Liu W, Yang C. Foam fractionation for effectively recovering copper from the discarded printed circuit board of personal computer. SEP SCI TECHNOL 2020. [DOI: 10.1080/01496395.2020.1743312] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Submit a Manuscript] [Subscribe] [Scholar Register] [Indexed: 10/24/2022]
Number Cited by Other Article(s)
1
Gu Q, Xue X, Darwesh OM, Habimana P, Liu W, Wu Z, Li Z. Random Packing Performance in Continuous Foam Fractionation. Chem Eng Technol 2021. [DOI: 10.1002/ceat.202100097] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/12/2022]
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