Molecular dynamics simulation on structure evolution of silica glass in nano-cutting at high temperature

Study on Chip Formation Mechanism of Single Crystal Copper Using Molecular Dynamics Simulations

Nano-cutting is an important development direction of the modern manufacturing technology. However, the research on the mechanism underlying nano-cutting lags far behind the practical application, which restricts the development of this advanced manufacturing technology. The chip formation process is the basic process of nano-cutting, and it is of key importance for the mechanism research of nano-cutting. In this paper, the nano-tensile behavior of single crystal copper was studied based on the molecular dynamics simulations. The toughness and brittleness characteristics of the copper at different temperatures were analyzed. Then, the molecular dynamics simulations of nano-cutting for single crystal copper with different toughness and brittleness were studied. The crystal structure, cutting force, stress-strain distribution and atomic motion characteristics were systematically investigated. The nano-chip formation mechanism of single crystal copper was revealed. The results show that the chip is formed through two ways, namely the shear and extrusion. The material near the free surface of the workpiece undergoes continuous shear slip and periodic long-distance slippage along the primary shear direction, forming the block chip in which the FCC and HCP structures are orderly distributed. The material near the tool-chip interface is extruded by the tool, block chip and stagnation zone to form the flowing chip with amorphous structure. As the temperature increases, the occurrence frequency of long-distance slippage in the block chip increases, while the slippage degree decreases. Besides, with the increase in temperature, the thickness of block chip formed by shear slip decreases, while the thickness of flowing chip formed by extrusion increases.

Determination of the Efficiency of Hot NanoGrinding of Mono-Crystalline Fcc Metals Using Molecular Dynamics Method

Abrasive processes are essential to the manufacturing field, due to their capability of rendering high-quality surfaces with minimum effect on workpiece integrity. As it is especially difficult to perform sufficient experimental work, numerical studies can be successfully employed to evaluate techniques for the improvement of the efficiency of nanometric abrasive processes. In the present study, for the first time, cases of nanogrinding on workpieces of three different fcc metals, namely, copper, nickel, and aluminum are investigated under different preheating temperatures, in order to determine the efficiency of the hot nano-grinding technique. For the simulations, a molecular dynamics model for peripheral nanogrinding is developed including multiple abrasive grains and realistic grain trajectory and grinding forces, and chip characteristics and subsurface alterations are evaluated. The results indicate that using elevated preheating temperatures is beneficial for nanogrinding, as forces can be considerably reduced and material removal can be facilitated, especially for temperatures over 40% of the material melting temperature (T_m). However, the detrimental effect on workpiece integrity is also evident at higher preheating temperatures, due to the high temperature on the whole workpiece, posing limitations to the applicability of the hot nano-grinding technique. Based on the findings of this study, preheating temperatures in the range of 0.4–0.55 T_m are recommended.