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Zhang Z, Yin F, Wang C, Li Z, Liu H. Magnetic field-controlled spin-dependent thermoelectric current in a single-molecule magnet transistor. JOURNAL OF PHYSICS. CONDENSED MATTER : AN INSTITUTE OF PHYSICS JOURNAL 2021; 33:235302. [PMID: 33784643 DOI: 10.1088/1361-648x/abf385] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/14/2021] [Accepted: 03/30/2021] [Indexed: 06/12/2023]
Abstract
Control of the charge, spin, and heat currents in thermoelectric devices is an interesting research field that is currently experiencing a burst of activity. In this work, a new type of spin-current generator is proposed that consists of a single-molecule magnet sandwiched between a pair of nonmagnetic electrodes. By applying an external magnetic field, this tunneling junction can generate a 100% spin-polarized current via thermoelectric effects, and the flow direction and spin polarization can be changed by adjusting the gate voltage or magnetic field. Moreover, regardless of whether the external magnetic field exists, the thermoelectric current is always highly spin polarized and can be switched by using different gate voltage windows. This molecular electrical device can be realized with current technologies and may have practical use in spin caloritronics and quantum information processing.
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Affiliation(s)
- Zhengzhong Zhang
- Faculty of Mathematics and Physics, Huaiyin Institute of Technology, Huaian 223003, People's Republic of China
| | - Fan Yin
- Faculty of Mathematics and Physics, Huaiyin Institute of Technology, Huaian 223003, People's Republic of China
| | - Chao Wang
- Faculty of Mathematics and Physics, Huaiyin Institute of Technology, Huaian 223003, People's Republic of China
| | - Zhongwen Li
- Faculty of Mathematics and Physics, Huaiyin Institute of Technology, Huaian 223003, People's Republic of China
| | - Hao Liu
- Faculty of Mathematics and Physics, Huaiyin Institute of Technology, Huaian 223003, People's Republic of China
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Li L, Liu Y, Teng J, Long S, Guo Q, Zhang M, Wu Y, Yu G, Liu Q, Lv H, Liu M. Anisotropic Magnetoresistance of Nano-conductive Filament in Co/HfO 2/Pt Resistive Switching Memory. NANOSCALE RESEARCH LETTERS 2017; 12:210. [PMID: 28335585 PMCID: PMC5362562 DOI: 10.1186/s11671-017-1983-2] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/29/2016] [Accepted: 03/06/2017] [Indexed: 06/01/2023]
Abstract
Conductive bridge random access memory (CBRAM) has been extensively studied as a next-generation non-volatile memory. The conductive filament (CF) shows rich physical effects such as conductance quantization and magnetic effect. But so far, the study of filaments is not very sufficient. In this work, Co/HfO2/Pt CBRAM device with magnetic CF was designed and fabricated. By electrical manipulation with a partial-RESET method, we controlled the size of ferromagnetic metal filament. The resistance-temperature characteristics of the ON-state after various partial-RESET behaviors have been studied. Using two kinds of magnetic measurement methods, we measured the anisotropic magnetoresistance (AMR) of the CF at different temperatures to reflect the magnetic structure characteristics. By rotating the direction of the magnetic field and by sweeping the magnitude, we obtained the spatial direction as well as the easy-axis of the CF. The results indicate that the easy-axis of the CF is along the direction perpendicular to the top electrode plane. The maximum magnetoresistance was found to appear when the angle between the direction of magnetic field and that of the electric current in the CF is about 30°, and this angle varies slightly with temperature, indicating that the current is tilted.
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Affiliation(s)
- Leilei Li
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Yang Liu
- Nanoscale Physics & Devices Laboratory, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190, China
| | - Jiao Teng
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China.
| | - Shibing Long
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
- University of Chinese Academy of Sciences, Beijing, 100049, China.
- Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing, 210023, China.
| | - Qixun Guo
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China
| | - Meiyun Zhang
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
- Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing, 210023, China
| | - Yu Wu
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China
| | - Guanghua Yu
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China
| | - Qi Liu
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
- Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing, 210023, China
| | - Hangbing Lv
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
- Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing, 210023, China
| | - Ming Liu
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
- Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing, 210023, China
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Li Y, Long S, Liu Y, Hu C, Teng J, Liu Q, Lv H, Suñé J, Liu M. Conductance Quantization in Resistive Random Access Memory. NANOSCALE RESEARCH LETTERS 2015; 10:420. [PMID: 26501832 PMCID: PMC4623080 DOI: 10.1186/s11671-015-1118-6] [Citation(s) in RCA: 18] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/13/2015] [Accepted: 10/12/2015] [Indexed: 06/02/2023]
Abstract
The intrinsic scaling-down ability, simple metal-insulator-metal (MIM) sandwich structure, excellent performances, and complementary metal-oxide-semiconductor (CMOS) technology-compatible fabrication processes make resistive random access memory (RRAM) one of the most promising candidates for the next-generation memory. The RRAM device also exhibits rich electrical, thermal, magnetic, and optical effects, in close correlation with the abundant resistive switching (RS) materials, metal-oxide interface, and multiple RS mechanisms including the formation/rupture of nanoscale to atomic-sized conductive filament (CF) incorporated in RS layer. Conductance quantization effect has been observed in the atomic-sized CF in RRAM, which provides a good opportunity to deeply investigate the RS mechanism in mesoscopic dimension. In this review paper, the operating principles of RRAM are introduced first, followed by the summarization of the basic conductance quantization phenomenon in RRAM and the related RS mechanisms, device structures, and material system. Then, we discuss the theory and modeling of quantum transport in RRAM. Finally, we present the opportunities and challenges in quantized RRAM devices and our views on the future prospects.
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Affiliation(s)
- Yang Li
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
- Lab of Nanofabrication and Novel Device Integration, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
| | - Shibing Long
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
- Lab of Nanofabrication and Novel Device Integration, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
| | - Yang Liu
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China.
| | - Chen Hu
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China.
| | - Jiao Teng
- Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China.
| | - Qi Liu
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
- Lab of Nanofabrication and Novel Device Integration, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
| | - Hangbing Lv
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
- Lab of Nanofabrication and Novel Device Integration, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
| | - Jordi Suñé
- Departament d'Enginyeria Electrònica, Universitat Autònoma de Barcelona, Bellaterra, 08193, Spain.
| | - Ming Liu
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
- Lab of Nanofabrication and Novel Device Integration, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
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