Microwave synthesis of branched silver nanowires and their use as fillers for high thermal conductivity polymer composites

Beyond homogeneous dispersion: oriented conductive fillers for high κ nanocomposites

Rational design of structures for regulating the thermal conductivities (κ) of materials is critical to many components and products employed in electrical, electronic, energy, construction, aerospace, and medical applications. As such, considerable efforts have been devoted to developing polymer composites with tailored conducting filler architectures and thermal conduits for highly improved κ. This paper is dedicated to overviewing recent advances in this area to offer perspectives for the next level of future development. The limitations of conventional particulate-filled composites and the issue of percolation are discussed. In view of different directions of heat dissipation in polymer composites for different end applications, various approaches for designing the micro- and macroscopic structures of thermally conductive networks in the polymer matrix are highlighted. Methodological approaches devised to significantly ameliorate thermal conduction are categorized with respect to the pathways of heat dissipation. Future prospects for the development of thermally conductive polymer composites with modulated thermal conduction pathways are highlighted.

Enhancing Thermal Transport in Silicone Composites via Bridging Liquid Metal Fillers with Reactive Metal Co-Fillers and Matrix Viscosity Tuning

Polymer matrix composites containing room temperature liquid metal (LM) microdroplets offer a unique set of thermo-mechanical characteristics that makes them attractive candidates for high performance thermal interface materials. However, to achieve the desired level of the composite thermal conductivity, effective bridging of such fillers into interconnected percolation networks needs to be induced. Thermal percolation of the LM microdroplets requires two physical barriers to be overcome. First, the LM microdroplets must directly contact each other through the polymer matrix. Second, the native oxide shell on the LM microdroplet must also be ruptured. In this work, we demonstrate that both physical barriers can be penetrated to induce ample bridging of the LM microdroplets and thereby achieve higher thermal conductivity composites. We accomplish this through a synergistic combination of solid silver and LM fillers, tuning of the silicone oil "matrix" viscosity, and sample compression. We selected silver as the solid additive because it rapidly alloys with gallium to form microscale needles that could act as additional paths that aid in connecting the LM droplets. We systematically explore the impact of the composition (filler type, volume fraction, and matrix oil viscosity) and applied pressure on the thermal conductivity and multiscale structure of these composites. We reveal the microscopic mechanism underlying the macroscopic experimental trends and also identify an optimal composition of the multiphase Ag-LM-Silicone oil composite for thermal applications. The identified design knobs offer path for developing tunable LM-based polymer composites for microelectronics cooling, biomedical applications, and flexible electronics.

Multifunctional Metallic Nanowires in Advanced Building Applications

Metallic nanowires (NWs) have attracted great attention in the frontiers of nanomaterial science due to their extraordinary properties, such as high thermal and electrical conductivity, high aspect ratio, good mechanical flexibility, and excellent optical transparency. The metallic NWs and their nanocomposites, as a promising alternative for conventional building materials, have been extensively studied recently, but review works on these novel versatile nanostructures and their various uses in the building and construction industry are still lacking. We present a comprehensive review on current state-of-the-art research and progress regarding multifunctional metallic NWs and their specific building applications, including thermal energy storage (TES), thermal transport, electrochromic windows (ECW), as well as photovoltaic (PV) cells. The nanosynthesis techniques and nanocharacterization of silver nanowires (AgNWs) and copper nanowires (CuNWs) are overviewed and compared with each other. In addition, the fundamentals of different NWs for advanced building applications are introduced. Further discussion is presented on the improved performance of base materials by using these nanostructures, highlighting the key factors exhibiting their superior performance. Finally, the key benefits and limitations of metallic NWs for new generation building materials are obtained.

Inorganic-Organic Hybrid Janus Fillers for Improving the Thermal Conductivity of Polymer Composites

Janus fillers represent a combination of inorganic thermally conductive silver nanoparticles and organic polystyrene brushes on one entity but different sides. They are of practical importance for polymer composites with high thermal conductivity because of the improved dispersion and reduced interfacial heat resistance. Moreover, benefiting from the sheetlike structure and single-side deposition of inorganic particles, Janus fillers tend to align such that the heat pathway is constructed in the composite films, when fabricated by layer-by-layer doctor blading. As a result, the in-plane thermal conductivity of the polymer composite is as high as 4.57 W m^-1 K^-1, with only 10 vol % Janus filler loading.

Synthesis and modelling of the mechanical properties of Ag, Au and Cu nanowires

The recent interest to nanotechnology aims not only at device miniaturisation, but also at understanding the effects of quantised structure in materials of reduced dimensions, which exhibit different properties from their bulk counterparts. In particular, quantised metal nanowires made of silver, gold or copper have attracted much attention owing to their unique intrinsic and extrinsic length-dependent mechanical properties. Here we review the current state of art and developments in these nanowires from synthesis to mechanical properties, which make them leading contenders for next-generation nanoelectromechanical systems. We also present theories of interatomic interaction in metallic nanowires, as well as challenges in their synthesis and simulation.

In Situ Alloying of Thermally Conductive Polymer Composites by Combining Liquid and Solid Metal Microadditives

Room-temperature liquid metals (LMs) are attractive candidates for thermal interface materials (TIMs) because of their moderately high thermal conductivity and liquid nature, which allow them to conform well to mating surfaces with little thermal resistance. However, gallium-based LMs may be of concern due to the gallium-driven degradation of many metal microelectronic components. We present a three-component composite with LM, copper (Cu) microparticles, and a polymer matrix, as a cheaper, noncorrosive solution. The solid copper particles alloy with the gallium in the LM, in situ and at room temperature, immobilizing the LM and eliminating any corrosion issues of nearby components. Investigation of the structure-property-process relationship of the three-component composites reveals that the method and degree of additive blending dramatically alter the resulting thermal transport properties. In particular, microdispersion of any combination of the LM and Cu additives results in a large number of interfaces and a thermal conductivity below 2 W m^-1 K^-1. In contrast, a shorter blending procedure of premixed LM and Cu particle colloid into the polymer matrix yields a composite with polydispersed filler and effective intrinsic thermal conductivities of up to 17 W m^-1 K^-1 (effective thermal conductivity of up to 10 W m^-1 K^-1). The LM-Cu colloid alloying into CuGa₂ provides a limited, but practical, time frame to cast the uncured composite into the desired shape, space, or void before the composite stiffens and cures with permanent characteristics.