Atomic layer deposition ultrathin film origami using focused ion beams

Recent Advances in Polymer Science and Fabrication Processes for Enhanced Microfluidic Applications: An Overview

This review explores significant advancements in polymer science and fabrication processes that have enhanced the performance and broadened the application scope of microfluidic devices. Microfluidics, essential in biotechnology, medicine, and chemical engineering, relies on precise fluid manipulation in micrometer-sized channels. Recent innovations in polymer materials, such as flexible, biocompatible, and structurally robust polymers, have been pivotal in developing advanced microfluidic systems. Techniques like replica molding, microcontact printing, solvent-assisted molding, injection molding, and 3D printing are examined, highlighting their advantages and recent developments. Additionally, the review discusses the diverse applications of polymer-based microfluidic devices in biomedical diagnostics, drug delivery, organ-on-chip models, environmental monitoring, and industrial processes. This paper also addresses future challenges, including enhancing chemical resistance, achieving multifunctionality, ensuring biocompatibility, and scaling up production. By overcoming these challenges, the potential for widespread adoption and impactful use of polymer-based microfluidic technologies can be realized.

Electron Beam Maneuvering of a Single Polymer Layer for Reversible 3D Self-Assembly

Reversible self-assembly that allows materials to switch between structural configurations has triggered innovation in various applications, especially for reconfigurable devices and robotics. However, reversible motion with nanoscale controllability remains challenging. This paper introduces a reversible self-assembly using stress generated by electron irradiation triggered degradation (shrinkage) of a single polymer layer. The peak position of the absorbed energy along the depth of a polymer layer can be modified by tuning the electron energy; the peak absorption location controls the position of the shrinkage generating stress along the depth of the polymer layer. The stress gradient can shift between the top and bottom surface of the polymer by repeatedly tuning the irradiation location at the nanoscale and the electron beam voltage, resulting in reversible motion. This reversible self-assembly process paves the path for the innovation of small-scale machines and reconfigurable functional devices.

Electron Irradiation Driven Nanohands for Sequential Origami

Sequence plays an important role in self-assembly of 3D complex structures, particularly for those with overlap, intersection, and asymmetry. However, it remains challenging to program the sequence of self-assembly, resulting in geometric and topological constrains. In this work, a nanoscale, programmable, self-assembly technique is reported, which uses electron irradiation as "hands" to manipulate the motion of nanostructures with the desired order. By assigning each single assembly step in a particular order, localized motion can be selectively triggered with perfect timing, making a component accurately integrate into the complex 3D structure without disturbing other parts of the assembly process. The features of localized motion, real-time monitoring, and surface patterning open the possibility for the further innovation of nanomachines, nanoscale test platforms, and advanced optical devices.

Bidirectional Self-Folding with Atomic Layer Deposition Nanofilms for Microscale Origami

Origami design principles are scale invariant and enable direct miniaturization of origami structures provided the sheets used for folding have equal thickness to length ratios. Recently, seminal steps have been taken to fabricate microscale origami using unidirectionally actuated sheets with nanoscale thickness. Here, we extend the full power of origami-inspired fabrication to nanoscale sheets by engineering bidirectional folding with 4 nm thick atomic layer deposition (ALD) SiN_x-SiO₂ bilayer films. Strain differentials within these bilayers result in bending, producing microscopic radii of curvature. We lithographically pattern these bilayers and localize the bending using rigid panels to fabricate a variety of complex micro-origami devices. Upon release, these devices self-fold according to prescribed patterns. Our approach combines planar semiconductor microfabrication methods with computerized origami design, making it easy to fabricate and deploy such microstructures en masse. These devices represent an important step forward in the fabrication and assembly of deployable micromechanical systems that can interact with and manipulate micro- and nanoscale environments.

Atomic Layer Deposition for Membranes, Metamaterials, and Mechanisms

Bending and folding techniques such as origami and kirigami enable the scale-invariant design of 3D structures, metamaterials, and robots from 2D starting materials. These design principles are especially valuable for small systems because most micro- and nanofabrication involves lithographic patterning of planar materials. Ultrathin films of inorganic materials serve as an ideal substrate for the fabrication of flexible microsystems because they possess high intrinsic strength, are not susceptible to plasticity, and are easily integrated into microfabrication processes. Here, atomic layer deposition (ALD) is employed to synthesize films down to 2 nm thickness to create membranes, metamaterials, and machines with micrometer-scale dimensions. Two materials are studied as model systems: ultrathin SiO₂ and Pt. In this thickness limit, ALD films of these materials behave elastically and can be fabricated with fJ-scale bending stiffnesses. Further, ALD membranes are utilized to design micrometer-scale mechanical metamaterials and magnetically actuated 3D devices. These results establish thin ALD films as a scalable basis for micrometer-scale actuators and robotics.

Metal oxide multilayer hard mask system for 3D nanofabrication

We demonstrate the preparation and exploitation of multilayer metal oxide hard masks for lithography and 3D nanofabrication. Atomic layer deposition (ALD) and focused ion beam (FIB) technologies are applied for mask deposition and mask patterning, respectively. A combination of ALD and FIB was used and a patterning procedure was developed to avoid the ion beam defects commonly met when using FIB alone for microfabrication. ALD grown Al₂O₃/Ta₂O₅/Al₂O₃ thin film stacks were FIB milled with 30 keV gallium ions and chemically etched in 5% tetramethylammonium hydroxide at 50 °C. With metal evaporation, multilayers consisting of amorphous oxides Al₂O₃ and Ta₂O₅ can be tailored for use in 2D lift-off processing, in preparation of embedded sub-100 nm metal lines and for multilevel electrical contacts. Good pattern transfer was achieved by lift-off process from the 2D hard mask for micro- and nano-scaled fabrication. As a demonstration of the applicability of this method to 3D structures, self-supporting 3D Ta₂O₅ masks were made from a film stack on gold particles. Finally, thin film resistors were fabricated by utilizing controlled stiction of suspended Ta₂O₅ structures.