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Kim SS, Yong SK, Kim W, Kang S, Park HW, Yoon KJ, Sheen DS, Lee S, Hwang CS. Review of Semiconductor Flash Memory Devices for Material and Process Issues. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2200659. [PMID: 35305277 DOI: 10.1002/adma.202200659] [Citation(s) in RCA: 14] [Impact Index Per Article: 14.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/21/2022] [Revised: 03/13/2022] [Indexed: 06/14/2023]
Abstract
Vertically integrated NAND (V-NAND) flash memory is the main data storage in modern handheld electronic devices, widening its share even in the data centers where installation and operation costs are critical. While the conventional scaling rule has been applied down to the design rule of ≈15 nm (year 2013), the current method of increasing device density is stacking up layers. Currently, 176-layer-stacked V-NAND flash memory is available on the market. Nonetheless, increasing the layers invokes several challenges, such as film stress management and deep contact hole etching. Also, there should be an upper bound for the attainable stacking layers (400-500) due to the total allowable chip thickness, which will be reached within 6-7 years. This review summarizes the current status and critical challenges of charge-trap-based flash memory devices, with a focus on the material (floating-gate vs charge-trap-layer), array-level circuit architecture (NOR vs NAND), physical integration structure (2D vs 3D), and cell-level programming technique (single vs multiple levels). Current efforts to improve fabrication processes and device performances using new materials are also introduced. The review suggests directions for future storage devices based on the ionic mechanism, which may overcome the inherent problems of flash memory devices.
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Affiliation(s)
- Seung Soo Kim
- Department of Materials Science and Engineering and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea
- Samsung Electronics, Hwaseong, Gyeonggi-do, 18448, Republic of Korea
| | - Soo Kyeom Yong
- Department of Materials Science and Engineering and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea
- Samsung Electronics, Hwaseong, Gyeonggi-do, 18448, Republic of Korea
| | - Whayoung Kim
- Department of Materials Science and Engineering and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea
- SK Hynix Inc., Icheon, Gyeonggi-do, 17336, Republic of Korea
| | - Sukin Kang
- Department of Materials Science and Engineering and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea
| | - Hyeon Woo Park
- Department of Materials Science and Engineering and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea
| | | | - Dong Sun Sheen
- SK Hynix Inc., Icheon, Gyeonggi-do, 17336, Republic of Korea
| | - Seho Lee
- SK Hynix Inc., Icheon, Gyeonggi-do, 17336, Republic of Korea
| | - Cheol Seong Hwang
- Department of Materials Science and Engineering and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea
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Garg N, Balafrej I, Stewart TC, Portal JM, Bocquet M, Querlioz D, Drouin D, Rouat J, Beilliard Y, Alibart F. Voltage-dependent synaptic plasticity: Unsupervised probabilistic Hebbian plasticity rule based on neurons membrane potential. Front Neurosci 2022; 16:983950. [PMID: 36340782 PMCID: PMC9634260 DOI: 10.3389/fnins.2022.983950] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/01/2022] [Accepted: 09/05/2022] [Indexed: 11/27/2022] Open
Abstract
This study proposes voltage-dependent-synaptic plasticity (VDSP), a novel brain-inspired unsupervised local learning rule for the online implementation of Hebb’s plasticity mechanism on neuromorphic hardware. The proposed VDSP learning rule updates the synaptic conductance on the spike of the postsynaptic neuron only, which reduces by a factor of two the number of updates with respect to standard spike timing dependent plasticity (STDP). This update is dependent on the membrane potential of the presynaptic neuron, which is readily available as part of neuron implementation and hence does not require additional memory for storage. Moreover, the update is also regularized on synaptic weight and prevents explosion or vanishing of weights on repeated stimulation. Rigorous mathematical analysis is performed to draw an equivalence between VDSP and STDP. To validate the system-level performance of VDSP, we train a single-layer spiking neural network (SNN) for the recognition of handwritten digits. We report 85.01 ± 0.76% (Mean ± SD) accuracy for a network of 100 output neurons on the MNIST dataset. The performance improves when scaling the network size (89.93 ± 0.41% for 400 output neurons, 90.56 ± 0.27 for 500 neurons), which validates the applicability of the proposed learning rule for spatial pattern recognition tasks. Future work will consider more complicated tasks. Interestingly, the learning rule better adapts than STDP to the frequency of input signal and does not require hand-tuning of hyperparameters.
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Affiliation(s)
- Nikhil Garg
- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, Sherbrooke, QC, Canada
- Laboratoire Nanotechnologies Nanosystèmes (LN2)—CNRS UMI-3463, Université de Sherbrooke, Sherbrooke, QC, Canada
- Institute of Electronics, Microelectronics and Nanotechnology (IEMN), Université de Lille, Villeneuve-d’Ascq, France
- *Correspondence: Nikhil Garg,
| | - Ismael Balafrej
- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, Sherbrooke, QC, Canada
- Laboratoire Nanotechnologies Nanosystèmes (LN2)—CNRS UMI-3463, Université de Sherbrooke, Sherbrooke, QC, Canada
- NECOTIS Research Lab, Department of Electrical and Computer Engineering, University of Sherbrooke, Sherbrooke, QC, Canada
| | - Terrence C. Stewart
- National Research Council Canada, University of Waterloo Collaboration Centre, Waterloo, ON, Canada
| | - Jean-Michel Portal
- Aix-Marseille Université, Université de Toulon, CNRS, IM2NP, Marseille, France
| | - Marc Bocquet
- Institute of Electronics, Microelectronics and Nanotechnology (IEMN), Université de Lille, Villeneuve-d’Ascq, France
| | - Damien Querlioz
- Université Paris-Saclay, CNRS, Centre de Nanosciences et de Nanotechnologies, Palaiseau, France
| | - Dominique Drouin
- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, Sherbrooke, QC, Canada
- Laboratoire Nanotechnologies Nanosystèmes (LN2)—CNRS UMI-3463, Université de Sherbrooke, Sherbrooke, QC, Canada
| | - Jean Rouat
- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, Sherbrooke, QC, Canada
- Laboratoire Nanotechnologies Nanosystèmes (LN2)—CNRS UMI-3463, Université de Sherbrooke, Sherbrooke, QC, Canada
- NECOTIS Research Lab, Department of Electrical and Computer Engineering, University of Sherbrooke, Sherbrooke, QC, Canada
| | - Yann Beilliard
- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, Sherbrooke, QC, Canada
- Laboratoire Nanotechnologies Nanosystèmes (LN2)—CNRS UMI-3463, Université de Sherbrooke, Sherbrooke, QC, Canada
| | - Fabien Alibart
- Institut Interdisciplinaire d’Innovation Technologique (3IT), Université de Sherbrooke, Sherbrooke, QC, Canada
- Laboratoire Nanotechnologies Nanosystèmes (LN2)—CNRS UMI-3463, Université de Sherbrooke, Sherbrooke, QC, Canada
- Institute of Electronics, Microelectronics and Nanotechnology (IEMN), Université de Lille, Villeneuve-d’Ascq, France
- Fabien Alibart,
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Architecture and Process Integration Overview of 3D NAND Flash Technologies. APPLIED SCIENCES-BASEL 2021. [DOI: 10.3390/app11156703] [Citation(s) in RCA: 11] [Impact Index Per Article: 3.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/07/2023]
Abstract
In the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production. In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.
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Kwon D, Lim S, Bae JH, Lee ST, Kim H, Seo YT, Oh S, Kim J, Yeom K, Park BG, Lee JH. On-Chip Training Spiking Neural Networks Using Approximated Backpropagation With Analog Synaptic Devices. Front Neurosci 2020; 14:423. [PMID: 32733180 PMCID: PMC7358558 DOI: 10.3389/fnins.2020.00423] [Citation(s) in RCA: 21] [Impact Index Per Article: 5.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/02/2020] [Accepted: 04/07/2020] [Indexed: 12/02/2022] Open
Abstract
Hardware-based spiking neural networks (SNNs) inspired by a biological nervous system are regarded as an innovative computing system with very low power consumption and massively parallel operation. To train SNNs with supervision, we propose an efficient on-chip training scheme approximating backpropagation algorithm suitable for hardware implementation. We show that the accuracy of the proposed scheme for SNNs is close to that of conventional artificial neural networks (ANNs) by using the stochastic characteristics of neurons. In a hardware configuration, gated Schottky diodes (GSDs) are used as synaptic devices, which have a saturated current with respect to the input voltage. We design the SNN system by using the proposed on-chip training scheme with the GSDs, which can update their conductance in parallel to speed up the overall system. The performance of the on-chip training SNN system is validated through MNIST data set classification based on network size and total time step. The SNN systems achieve accuracy of 97.83% with 1 hidden layer and 98.44% with 4 hidden layers in fully connected neural networks. We then evaluate the effect of non-linearity and asymmetry of conductance response for long-term potentiation (LTP) and long-term depression (LTD) on the performance of the on-chip training SNN system. In addition, the impact of device variations on the performance of the on-chip training SNN system is evaluated.
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Affiliation(s)
- Dongseok Kwon
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Suhwan Lim
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Jong-Ho Bae
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Sung-Tae Lee
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Hyeongsu Kim
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Young-Tak Seo
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Seongbin Oh
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Jangsaeng Kim
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Kyuho Yeom
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Byung-Gook Park
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
| | - Jong-Ho Lee
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul, South Korea
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