Knapp CE, Metcalf EA, Mrig S, Sanchez‐Perez C, Douglas SP, Choquet P, Boscher ND. Precursors for Atmospheric Plasma-Enhanced Sintering: Low-Temperature Inkjet Printing of Conductive Copper.
ChemistryOpen 2018;
7:850-857. [PMID:
30402374 PMCID:
PMC6208189 DOI:
10.1002/open.201800131]
[Citation(s) in RCA: 12] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/04/2018] [Indexed: 11/10/2022] Open
Abstract
Bidentate diamine and amino-alcohol ligands have been used to form solid, water-soluble, and air-stable monomeric copper complexes of the type [Cu(NH2CH2CH(R)Y)2(NO3)2] (1, R=H, Y=NH2; 2, R=H, Y=OH; 3, R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single-crystal X-ray diffraction. Irrespective of their decomposition temperature, precursors 1-3 yield highly conductive copper features [1.5×10-6 Ω m (±5×10-7 Ω m)] upon atmospheric-pressure plasma-enhanced sintering.
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