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Tang H, Li Y, Liao S, Liu H, Qiao Y, Zhou J. Multifunctional Conductive Hydrogel Interface for Bioelectronic Recording and Stimulation. Adv Healthc Mater 2024; 13:e2400562. [PMID: 38773929 DOI: 10.1002/adhm.202400562] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/14/2024] [Revised: 05/11/2024] [Indexed: 05/24/2024]
Abstract
The past few decades have witnessed the rapid advancement and broad applications of flexible bioelectronics, in wearable and implantable electronics, brain-computer interfaces, neural science and technology, clinical diagnosis, treatment, etc. It is noteworthy that soft and elastic conductive hydrogels, owing to their multiple similarities with biological tissues in terms of mechanics, electronics, water-rich, and biological functions, have successfully bridged the gap between rigid electronics and soft biology. Multifunctional hydrogel bioelectronics, emerging as a new generation of promising material candidates, have authentically established highly compatible and reliable, high-quality bioelectronic interfaces, particularly in bioelectronic recording and stimulation. This review summarizes the material basis and design principles involved in constructing hydrogel bioelectronic interfaces, and systematically discusses the fundamental mechanism and unique advantages in bioelectrical interfacing with the biological surface. Furthermore, an overview of the state-of-the-art manufacturing strategies for hydrogel bioelectronic interfaces with enhanced biocompatibility and integration with the biological system is presented. This review finally exemplifies the unprecedented advancement and impetus toward bioelectronic recording and stimulation, especially in implantable and integrated hydrogel bioelectronic systems, and concludes with a perspective expectation for hydrogel bioelectronics in clinical and biomedical applications.
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Affiliation(s)
- Hao Tang
- School of Biomedical Engineering, Shenzhen Campus of Sun Yat-sen University, No. 66, Gongchang Road, Guangming District, Shenzhen, 518107, P. R. China
- Key Laboratory of Sensing Technology and Biomedical Instruments of Guangdong Province, School of Biomedical Engineering, Sun Yat-sen University, Guangzhou, 510275, P. R. China
| | - Yuanfang Li
- School of Biomedical Engineering, Shenzhen Campus of Sun Yat-sen University, No. 66, Gongchang Road, Guangming District, Shenzhen, 518107, P. R. China
- Key Laboratory of Sensing Technology and Biomedical Instruments of Guangdong Province, School of Biomedical Engineering, Sun Yat-sen University, Guangzhou, 510275, P. R. China
| | - Shufei Liao
- School of Biomedical Engineering, Shenzhen Campus of Sun Yat-sen University, No. 66, Gongchang Road, Guangming District, Shenzhen, 518107, P. R. China
- Key Laboratory of Sensing Technology and Biomedical Instruments of Guangdong Province, School of Biomedical Engineering, Sun Yat-sen University, Guangzhou, 510275, P. R. China
| | - Houfang Liu
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China
| | - Yancong Qiao
- School of Biomedical Engineering, Shenzhen Campus of Sun Yat-sen University, No. 66, Gongchang Road, Guangming District, Shenzhen, 518107, P. R. China
- Key Laboratory of Sensing Technology and Biomedical Instruments of Guangdong Province, School of Biomedical Engineering, Sun Yat-sen University, Guangzhou, 510275, P. R. China
| | - Jianhua Zhou
- School of Biomedical Engineering, Shenzhen Campus of Sun Yat-sen University, No. 66, Gongchang Road, Guangming District, Shenzhen, 518107, P. R. China
- Key Laboratory of Sensing Technology and Biomedical Instruments of Guangdong Province, School of Biomedical Engineering, Sun Yat-sen University, Guangzhou, 510275, P. R. China
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Xiang Z, Wang H, Zhao P, Fa X, Wan J, Wang Y, Xu C, Yao S, Zhao W, Zhang H, Han M. Hard Magnetic Graphene Nanocomposite for Multimodal, Reconfigurable Soft Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2308575. [PMID: 38153331 DOI: 10.1002/adma.202308575] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/23/2023] [Revised: 11/20/2023] [Indexed: 12/29/2023]
Abstract
Soft electronics provide effective means for continuous monitoring of a diverse set of biophysical and biochemical signals from the human body. However, the sensitivities, functions, spatial distributions, and many other features of such sensors remain fixed after deployment and cannot be adjusted on demand. Here, laser-induced porous graphene is exploited as the sensing material, and dope it with permanent magnetic particles to create hard magnetic graphene nanocomposite (HMGN) that can self-assemble onto a flexible carrying substrate through magnetic force, in a reversible and reconfigurable manner. A set of soft electronics in HMGN exhibits enhanced performances in the measurements of electrophysiological signals, temperature, and concentrations of metabolites. All these flexible HMGN sensors can adhere to a carrying substrate at any position and in any spatial arrangement, to allow for wearable sensing with customizable sensitivity, modality, and spatial coverage. The HMGN represents a promising material for constructing soft electronics that can be reconfigured for various applications.
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Affiliation(s)
- Zehua Xiang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China
| | - Haobin Wang
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China
| | - Pengcheng Zhao
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China
| | - Xinying Fa
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China
| | - Ji Wan
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China
| | - Yaozheng Wang
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China
| | - Chen Xu
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, China
| | - Shenglian Yao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China
| | - Wei Zhao
- Department of Cardiology and Institute of Vascular Medicine, Peking University Third Hospital, NHC Key Laboratory of Cardiovascular Molecular Biology and Regulatory Peptides, Key Laboratory of Molecular Cardiovascular Science, Ministry of Education, Beijing Key Laboratory of Cardiovascular Receptors Research, Beijing, 100191, China
| | - Haixia Zhang
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, 100871, China
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, China
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
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Li H, Tan P, Rao Y, Bhattacharya S, Wang Z, Kim S, Gangopadhyay S, Shi H, Jankovic M, Huh H, Li Z, Maharjan P, Wells J, Jeong H, Jia Y, Lu N. E-Tattoos: Toward Functional but Imperceptible Interfacing with Human Skin. Chem Rev 2024; 124:3220-3283. [PMID: 38465831 DOI: 10.1021/acs.chemrev.3c00626] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 03/12/2024]
Abstract
The human body continuously emits physiological and psychological information from head to toe. Wearable electronics capable of noninvasively and accurately digitizing this information without compromising user comfort or mobility have the potential to revolutionize telemedicine, mobile health, and both human-machine or human-metaverse interactions. However, state-of-the-art wearable electronics face limitations regarding wearability and functionality due to the mechanical incompatibility between conventional rigid, planar electronics and soft, curvy human skin surfaces. E-Tattoos, a unique type of wearable electronics, are defined by their ultrathin and skin-soft characteristics, which enable noninvasive and comfortable lamination on human skin surfaces without causing obstruction or even mechanical perception. This review article offers an exhaustive exploration of e-tattoos, accounting for their materials, structures, manufacturing processes, properties, functionalities, applications, and remaining challenges. We begin by summarizing the properties of human skin and their effects on signal transmission across the e-tattoo-skin interface. Following this is a discussion of the materials, structural designs, manufacturing, and skin attachment processes of e-tattoos. We classify e-tattoo functionalities into electrical, mechanical, optical, thermal, and chemical sensing, as well as wound healing and other treatments. After discussing energy harvesting and storage capabilities, we outline strategies for the system integration of wireless e-tattoos. In the end, we offer personal perspectives on the remaining challenges and future opportunities in the field.
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Affiliation(s)
- Hongbian Li
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Philip Tan
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Yifan Rao
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Sarnab Bhattacharya
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zheliang Wang
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Sangjun Kim
- Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Susmita Gangopadhyay
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Hongyang Shi
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Matija Jankovic
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Heeyong Huh
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhengjie Li
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Pukar Maharjan
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Jonathan Wells
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Hyoyoung Jeong
- Department of Electrical and Computer Engineering, University of California Davis, Davis, California 95616, United States
| | - Yaoyao Jia
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Department of Biomedical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
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Gong S, Lu Y, Yin J, Levin A, Cheng W. Materials-Driven Soft Wearable Bioelectronics for Connected Healthcare. Chem Rev 2024; 124:455-553. [PMID: 38174868 DOI: 10.1021/acs.chemrev.3c00502] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/05/2024]
Abstract
In the era of Internet-of-things, many things can stay connected; however, biological systems, including those necessary for human health, remain unable to stay connected to the global Internet due to the lack of soft conformal biosensors. The fundamental challenge lies in the fact that electronics and biology are distinct and incompatible, as they are based on different materials via different functioning principles. In particular, the human body is soft and curvilinear, yet electronics are typically rigid and planar. Recent advances in materials and materials design have generated tremendous opportunities to design soft wearable bioelectronics, which may bridge the gap, enabling the ultimate dream of connected healthcare for anyone, anytime, and anywhere. We begin with a review of the historical development of healthcare, indicating the significant trend of connected healthcare. This is followed by the focal point of discussion about new materials and materials design, particularly low-dimensional nanomaterials. We summarize material types and their attributes for designing soft bioelectronic sensors; we also cover their synthesis and fabrication methods, including top-down, bottom-up, and their combined approaches. Next, we discuss the wearable energy challenges and progress made to date. In addition to front-end wearable devices, we also describe back-end machine learning algorithms, artificial intelligence, telecommunication, and software. Afterward, we describe the integration of soft wearable bioelectronic systems which have been applied in various testbeds in real-world settings, including laboratories that are preclinical and clinical environments. Finally, we narrate the remaining challenges and opportunities in conjunction with our perspectives.
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Affiliation(s)
- Shu Gong
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Yan Lu
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Jialiang Yin
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Arie Levin
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
| | - Wenlong Cheng
- Department of Chemical & Biological Engineering, Monash University, Clayton, Victoria 3800, Australia
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Ershad F, Patel S, Yu C. Wearable bioelectronics fabricated in situ on skins. NPJ FLEXIBLE ELECTRONICS 2023; 7:32. [PMID: 38665149 PMCID: PMC11041641 DOI: 10.1038/s41528-023-00265-0] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 02/05/2023] [Accepted: 07/04/2023] [Indexed: 04/28/2024]
Abstract
In recent years, wearable bioelectronics has rapidly expanded for diagnosing, monitoring, and treating various pathological conditions from the skin surface. Although the devices are typically prefabricated as soft patches for general usage, there is a growing need for devices that are customized in situ to provide accurate data and precise treatment. In this perspective, the state-of-the-art in situ fabricated wearable bioelectronics are summarized, focusing primarily on Drawn-on-Skin (DoS) bioelectronics and other in situ fabrication methods. The advantages and limitations of these technologies are evaluated and potential future directions are suggested for the widespread adoption of these technologies in everyday life.
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Affiliation(s)
- Faheem Ershad
- Department of Biomedical Engineering, Pennsylvania State University, University Park, PA 16801 USA
| | - Shubham Patel
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16801 USA
| | - Cunjiang Yu
- Department of Biomedical Engineering, Pennsylvania State University, University Park, PA 16801 USA
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16801 USA
- Department of Materials Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, PA 16801 USA
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