Statistical physics of grain-boundary engineering

The microstructure and creep behavior of cold rolled udimet 188 sheet

Udimet 188 was subjected to thermomechanical processing (TMP) in an attempt to understand the effects of cold-rolling deformation on the microstructure and tensile-creep behavior. Commercially available sheet was cold rolled to varying amounts of deformation (between 5-35% reduction in sheet thickness) followed by a solution treatment at 1,464 K (1,191 °C) for 1 h and subsequent air cooling. This sequence was repeated four times to induce a high-volume fraction of low-energy grain boundaries. The resultant microstructure was characterized using electron backscattered diffraction. The effect of the TMP treatment on the high-temperature [1,033-1,088 K (760-815 °C)] creep behavior was evaluated. The measured creep stress exponents (6.0-6.8) suggested that dislocation creep was dominant at 1,033 K (760 °C) for stresses ranging between 100-220 MPa. For stresses ranging between 25-100 MPa at 1,033 K (760 °C), the stress exponents (2.3-2.8) suggested grain boundary sliding was dominant. A significant amount of grain boundary cracking was observed both on the surface and subsurface of deformed samples. To assess the mechanisms of crack nucleation, in situ scanning electron microscopy was performed during the elevated-temperature tensile-creep deformation. Cracking occurred preferentially along general high-angle grain boundaries (GHAB) and less than 25% of the cracks were found on low-angle grain boundaries (LAB) and coincident site lattice boundaries (CSLB). Creep rupture experiments were performed at T = 1,088 K (815 °C) and σ = 165 MPa and the greatest average time-to-rupture was exhibited by the TMP sheet with the greatest fraction of LAB+CSLB. However, a clear correlation was not exhibited between the grain boundary character distribution and the minimum creep rates. The findings of this work suggest that although grain boundary engineering may be possible for this alloy, simply relating the fraction of grain boundary types to the creep resistance is not sufficient.

Correlation-space description of the percolation transition in composite microstructures

We explore the percolation threshold shift as short-range correlations are introduced and systematically varied in binary composites. Two complementary representations of the correlations are developed in terms of the distribution of phase bonds or, alternatively, using a set of appropriate short-range order parameters. In either case, systematic exploration of the correlation space reveals a boundary that separates percolating from nonpercolating structures and permits empirical equations that identify the location of the threshold for systems of arbitrary short-range correlation states. Two- and three-dimensional site lattices with two-body correlations, as well as a two-dimensional hexagonal bond network with three-body correlations, are explored. The approach presented here should be generalizable to more complex correlation states, including higher-order and longer-range correlations.

Percolation of diffusional creep: a new universality class

We study the percolation aspects of diffusional "Coble" creep on heterogeneous grain boundary networks, assuming free grain boundary sliding. A novel percolation threshold is obtained for the honeycomb lattice when two representative types of grain boundaries are randomly distributed, p(cc)=0.5416+/-0.0036. The creep viscosity diverges near the percolation threshold with power-law exponents t=1.69+/-0.09 and s=1.88+/-0.12, different from the standard conduction and rigidity percolation exponents. The moments of both the force and flux distributions all conform to finite-size scaling at p(cc), but with new exponents. These new scaling behaviors seen in the creeping system are proposed to arise from the unique coupling of both force and flux balances in the network.