Laboratory implementation of X-ray diffraction/scattering computed tomography

X-ray Diffraction Computed Nanotomography Applied to Solve the Structure of Hierarchically Phase-Separated Metallic Glass

The structure of matter at the nanoscale, in particular that of amorphous metallic alloys, is of vital importance for functionalization. With the availability of synchrotron radiation, it is now possible to visualize the internal features of metallic samples without physically destroying them. Methods based on computed tomography have recently been employed to explore the local features. Tomographic reconstruction, while it is relatively uncomplicated for crystalline materials, may generate undesired artifacts when applied to featureless amorphous or nanostructured metallic alloys. In this study we show that X-ray diffraction computed nanotomography can provide accurate details of the internal structure of a metallic glass. We demonstrate the power of the method by applying it to a hierarchically phase-separated amorphous sample with a small volume fraction of crystalline inclusions, focusing the X-ray beam to 500 nm and ensuring a sub-micrometer 2D resolution via the number of scans.

X-ray Diffraction Mapping for Cultural Heritage Science: a Review of Experimental Configurations and Applications

X-ray diffraction (XRD) mapping consists in the acquisition of XRD patterns at each pixel (or voxel) of an area (or volume). The spatial resolution ranges from the micrometer (μXRD) to the millimeter (MA-XRD) scale, making the technique relevant for tiny samples up to large objects. Although XRD is primarily used for the identification of different materials in (complex) mixtures, additional information regarding the crystallite size, their orientation, and their in-depth distribution can also be obtained. Through mapping, these different types of information can be located on the studied sample/object. Cultural heritage objects are usually highly heterogeneous, and contain both original and later (degradation, conservation) materials. Their structural characterization is required both to determine ancient manufacturing processes and to evaluate their conservation state. Together with other mapping techniques, XRD mapping is increasingly used for these purposes. Here, the authors review applications as well as the various configurations for XRD mapping (synchrotron/laboratory X-ray source, poly-/monochromatic beam, micro/macro beam, 2D/3D, transmission/reflection mode). On-going hardware and software developments will further establish the technique as a key tool in heritage science.

Subpixel resolution in CdTe Timepix3 pixel detectors

Timepix3 (256 × 256 pixels with a pitch of 55 µm) is a hybrid-pixel-detector readout chip that implements a data-driven architecture and is capable of simultaneous time-of-arrival (ToA) and energy (ToT: time-over-threshold) measurements. The ToA information allows the unambiguous identification of pixel clusters belonging to the same X-ray interaction, which allows for full one-by-one detection of photons. The weighted mean of the pixel clusters can be used to measure the subpixel position of an X-ray interaction. An experiment was performed at the European Synchrotron Radiation Facility in Grenoble, France, using a 5 µm × 5 µm pencil beam to scan a CdTe-ADVAPIX-Timepix3 pixel (55 µm × 55 µm) at 8 × 8 matrix positions with a step size of 5 µm. The head-on scan was carried out at four monochromatic energies: 24, 35, 70 and 120 keV. The subpixel position of every single photon in the beam was constructed using the weighted average of the charge spread of single interactions. Then the subpixel position of the total beam was found by calculating the mean position of all photons. This was carried out for all points in the 8 × 8 matrix of beam positions within a single pixel. The optimum conditions for the subpixel measurements are presented with regards to the cluster sizes and beam subpixel position, and the improvement of this technique is evaluated (using the charge sharing of each individual photon to achieve subpixel resolution) versus alternative techniques which compare the intensity ratio between pixels. The best result is achieved at 120 keV, where a beam step of 4.4 µm ± 0.86 µm was measured.