Transfer mechanisms for lean implementation with OHS integration in the garment industry

Integrating X-reality and lean into end-of-life aircraft parts disassembly sequence planning: a critical review and research agenda

In parallel with the fast growth of the second-hand aviation market, the importance of promoting remanufacturing analytics has increased. However, end-of-life (EoL) aircraft parts remanufacturing operations are still underdeveloped. Disassembly, the most challenging and central activity in remanufacturing, directly affects the EoL product recovery's profitability and sustainability. Disassembly sequence planning (DSP) devises ordered and purposeful parting for all potentially recoverable components before physical separations. However, the complexities and uncertainties of the EoL conditions engender unpredictable DSP decision inputs. The EoL DSP needs emergent evidence of cost-effective solutions in view of Industry 4.0 (I4.0) implications and stakeholders' benefits. Among the I4.0 technologies, X-reality (XR) particularly hits the mainstream as a cognitive and visual tool consisting of virtual reality, augmented reality, and mixed reality. Recently, with the advance of I4.0 phenomenon, lean management has been theorized and tested through complementary collaboration. Since the research of integrating lean and XR into the EoL DSP is underexplored in literature, XR and lean are investigated as assistive enablers in the DSP. This study has a two-fold purpose: (1) identifying the key concepts of DSP, I4.0, XR, and lean, and extending the literature by reviewing the previous efforts of EoL aircraft remanufacturing, XR-assisted DSP, and XR-lean applications; (2) proposing "Smart Disassembly Sequence Planning (SDSP)" as a new EoL decision-support agenda after analyzing relational advantages and evolving adaptability. The barriers and limitations are highlighted from the recent associated topics, concrete academic information for developing digitalized disassembly analytics is provided, and new trends are added for future disassembly research.