Micromachining of a piezocomposite transducer using a copper vapor laser

Micromachined High Frequency 1-3 Piezocomposite Transducer Using Picosecond Laser

In this article, a PZT/Epoxy 1-3 piezoelectric composite based on picosecond laser etching technology is developed for the fabrication of high-frequency ultrasonic transducer. The design, fabrication, theoretical analysis, and performance of the piezocomposite and transducer are presented and discussed. According to the test results, the area of the PZT pillar is [Formula: see text], the average width of the kerf is [Formula: see text], and the thickness of the piezocomposite is [Formula: see text]. The fabricated 1-3 piezocomposite has a resonant frequency of 46.5 MHz, a parallel resonant frequency of 65 MHz, and an electromechanical coupling coefficient of 0.73. According to the wires phantom imaging, its imaging resolution can reach [Formula: see text]. This study shows that the proposed picosecond laser micromachining technique can be applied in the fabrication of high frequency 1-3 piezocomposite and transducer.

A 30-MHz, 3-D Imaging, Forward-Looking Miniature Endoscope Based on a 128-Element Relaxor Array

This work describes the design, fabrication, and characterization of a 128-element crossed electrode array in a miniature endoscopic form factor for real-time 3-D imaging. Crossed electrode arrays address some of the key challenges surrounding probe fabrication for 3-D ultrasound imaging by reducing the number of elements required (2N compared with N²). However, there remain practical challenges in packaging a high-frequency crossed electrode array into an endoscopic form factor. A process has been developed that uses a thinly diced strip of flex circuit to bring the back-side connections to common bond surface, which allows the final size of the endoscope to measure only [Formula: see text] mm. An electrostrictive ceramic composite design was developed for the crossed electrode array. A laser dicing system was used to cut the 1-3 composite as well as etch the array electrode pattern. A single quarter wavelength Parylene matching layer made was vacuum deposited to finish the array. The electrical impedance magnitude of array elements on resonance was measured to be 49 Ω with a phase angle of -55.5°. The finished array elements produced pulses with -6-dB two-way bandwidth of 60% with a 34-MHz center frequency. The average measured electrical crosstalk on the nearest neighboring element and next to nearest neighboring element was -37 and -29 dB, respectively. One- and two-way pulse measurements were completed to confirm the pulse polarity and fast switching speed. Preliminary 3-D images were generated of a wire phantom using the previously described simultaneous azimuth and Fresnel elevation (SAFE) compounding imaging technique.

Development of 40-MHz Ultrasonic Transducers via Soft Mold Process

This paper reports on the fabrication of 1-3 piezocomposites for ultrasonic transducers with operating frequencies up to 40 MHz based on recent developments of the soft mold technique. Compared to the established dice-and-fill technique, the soft mold process allows for the manufacturing of 1-3 piezocomposites with higher variability of pillar design and distribution as well as smaller structural size. Consequently, spurious modes generated by the lateral composite layout can be pushed to higher frequencies, which allows for increased operating frequency. Different designs of circular piezoceramic pillars in hexagonal arrangement with decreasing diameters and spacings have been developed and characterized in order to shift spurious modes to frequencies approximately twice the desired working frequency. The influence of the lateral composite layout on resonance modes is investigated by analyzing the produced transducers with respect to their electrical impedance spectra. Experimental results are explained in detail and compared to modeled data. Results show that by downsizing pillar diameter from 30 to [Formula: see text] and pitch from 40 to [Formula: see text], the first spurious mode could be shifted from ~42 to ~78 MHz. Thereby, the soft mold process proves to be suitable for the fabrication of 40-MHz ultrasonic transducers based on 1-3 piezocomposites.

Micromachining techniques in developing high-frequency piezoelectric composite ultrasonic array transducers

Several micromachining techniques for the fabrication of high-frequency piezoelectric composite ultrasonic array transducers are described in this paper. A variety of different techniques are used in patterning the active piezoelectric material, attaching backing material to the transducer, and assembling an electronic interconnection board for transmission and reception from the array. To establish the feasibility of the process flow, a hybrid test ultrasound array transducer consisting of a 2-D array having an 8 × 8 element pattern and a 5-element annular array was designed, fabricated, and assessed. The arrays are designed for a center frequency of ~60 MHz. The 2-D array elements are 105 × 105 μm in size with 5-μm kerfs between elements. The annular array surrounds the square 2-D array and provides the option of transmitting from the annular array and receiving with the 2-D array. Each annular array element has an area of 0.71 mm(2) with a 16-μm kerf between elements. The active piezoelectric material is (1 - x) Pb(Mg1/3Nb2/3)O3-xPbTiO3 (PMN-PT)/epoxy 1-3 composite with a PMN-PT pillar lateral dimension of 8 μm and an average gap width of ~4 μm, which was produced by deep reactive ion etching (DRIE) dry etching techniques. A novel electric interconnection strategy for high-density, small-size array elements was proposed. After assembly, the array transducer was tested and characterized. The capacitance, pulse-echo responses, and crosstalk were measured for each array element. The desired center frequency of ~60 MHz was achieved and the -6-dB bandwidth of the received signal was ~50%. At the center frequency, the crosstalk between adjacent 2-D array elements was about -33 dB. The techniques described herein can be used to build larger arrays containing smaller elements.

Microfabrication of electrode patterns for high-frequency ultrasound transducer arrays

High-frequency ultrasound is needed for medical imaging with high spatial resolution. A key issue in the development of ultrasound imaging arrays to operate at high frequencies (≥30 MHz) is the need for photolithographic patterning of array electrodes. To achieve this directly on 1-3 piezocomposite, the material requires not only planar, parallel, and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat, and vacuum. This paper reports, first, on the surface finishing of 1-3 piezocomposite materials by lapping and polishing. Excellent surface flatness has been obtained, with an average surface roughness of materials as low as 3 nm and step heights between ceramic/polymer of ∼80 nm. Subsequently, high-frequency array elements were patterned directly on top of these surfaces using a photolithography process. A 30-MHz linear array electrode pattern with 50-μm element pitch has been patterned on the lapped and polished surface of a high-frequency 1-3 piezocomposite. Excellent electrode edge definition and electrical contact to the composite were obtained. The composite has been lapped to a final thickness of ∼55 μm. Good adhesion of electrodes on the piezocomposite has been achieved and electrical impedance measurements have demonstrated their basic functionality. The array was then packaged, and acoustic pulse-echo measurements were performed. These results demonstrate that direct patterning of electrodes by photolithography on 1-3 piezocomposite is feasible for fabrication of high-frequency ultrasound arrays. Furthermore, this method is more conducive to mass production than other reported array fabrication techniques.

High-frequency (>50 MHz) medical ultrasound linear arrays fabricated from micromachined bulk PZT materials

This paper describes the development and characterization of a high-frequency (65-MHz) ultrasound transducer linear array. The array was built from bulk PZT which was etched using an optimized chlorine-based plasma dry-etching process. The median etch rate of 8 µ m/h yielded a good profile (wall) angle (>83°) and a reasonable processing time for etch depths up to 40 μm (which corresponds to a 50-MHz transducer). A backing layer with an acoustic impedance of 6 MRayl and a front-end polymer matching layer yielded a transducer bandwidth of 40%. The major parameters of the transducer have been characterized. The two-way insertion loss and crosstalk between adjacent channels at the center frequency are 26.5 and -25 dB, respectively.

Performance and characterization of new micromachined high-frequency linear arrays

A new approach for fabricating high frequency (> 20 MHz) linear array transducers, based on laser micromachining, has been developed. A 30 MHz, 64-element, 74-microm pitch, linear array design is presented. The performance of the device is demonstrated by comparing electrical and acoustic measurements with analytical, equivalent circuit, and finite-element analysis (FEA) simulations. All FEA results for array performance have been generated using one global set of material parameters. Each fabricated array has been integrated onto a flex circuit for ease of handling, and the flex has been integrated onto a custom printed circuit board test card for ease of testing. For a fully assembled array, with an acoustic lens, the center frequency was 28.7 MHz with a one-way -3 dB and -6 dB bandwidth of 59% and 83%, respectively, and a -20 dB pulse width of -99 ns. The per-element peak acoustic power, for a +/- 30 V single cycle pulse, measured at the 10 mm focal length of the lens was 590 kPa with a -6 dB directivity span of about 30 degrees. The worst-case total cross talk of the combined array and flex assembly is for nearest neighboring elements and was measured to have an average level -40 dB across the -6 dB bandwidth of the device. Any significant deviation from simulation can be explained through limitations in apparatus calibration and in device packaging.

Piezoelectric composites for sensor and actuator applications

In the last 25 years, piezoelectric ceramic-polymer composites have been conceptualized, prototyped, fabricated, and implemented in an array of applications encompassing medical imaging and military missions, among others. A detailed snapshot of the materials used, and a detailed account of the major innovative methods developed in making various piezoelectric ceramic-polymer composites are presented. The salient aspects of processing of such composites are summarized, and structure-processing-property relations are described using connectivity as the unifying central concept. Computer-aided design (CAD)-based fabrication methods, which result in composites whose structural complexity surpass that of composites obtained with traditional methods, are described to introduce the reader to novel concepts in processing of piezocomposites. A brief survey of some recent advances made in modeling of (0-3), (1-3), and (2-2) composites also is provided.

1-3 connectivity piezoelectric ceramic-polymer composite transducers made with viscous polymer processing for high frequency ultrasound

Potential applications of high frequency ultrasound exist because of the high spatial resolution consequent upon short wavelength. The frequencies of interest, typically from 25 MHz upwards, are easily supported by modern instrumentation but the capabilities of ultrasonic transducers have not kept pace and the transducers in high frequency commercial ultrasonic systems are still made with single-phase crystal, ceramic or piezopolymer materials. Despite potential performance advantages, the 1-3 connectivity piezoelectric ceramic-polymer composite materials now widely used at lower ultrasonic frequencies have not been adopted because of manufacturing difficulties. These difficulties are centred on fabrication of the 1-3 piezoceramic bristle-block comprising tall, thin pillars upstanding from a supporting stock. Fabrication techniques which have been explored already include injection moulding, mechanical dicing, and laser machining. Here, we describe an alternative technique based on viscous polymer processing (VPP) to produce net shape ceramic bristle-blocks. VPP produces green-state ceramic with rheological properties suitable for embossing. We outline how this can be created then report on our work to fabricate PZT bristle-blocks with lateral pillar dimensions of the order of 50 microm and height-to-width ratios of the order of 10. These have been backfilled with low pre-cure viscosity polymer and made into complete 1-3 piezocomposite transducer elements. We outline the performance of the transducers in terms of electrical impedance and pulse-echo behaviour and show that it corresponds well with computer modelling. We conclude that VPP is a promising technique to allow the established advantages of piezocomposite material to be exploited at higher frequencies than have been possible so far.