• Reference Citation Analysis
  • v
  • v
  • Find an Article
Find an Article PDF (4600961)   Today's Articles (6112)   Subscriber (49361)
For:  [Subscribe] [Scholar Register]
Number Cited by Other Article(s)
1
Luan E, Shoman H, Ratner DM, Cheung KC, Chrostowski L. Silicon Photonic Biosensors Using Label-Free Detection. SENSORS 2018;18:s18103519. [PMID: 30340405 PMCID: PMC6210424 DOI: 10.3390/s18103519] [Citation(s) in RCA: 108] [Impact Index Per Article: 18.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/07/2018] [Revised: 10/09/2018] [Accepted: 10/15/2018] [Indexed: 11/24/2022]
2
Mastrangeli M, Zhou Q, Sariola V, Lambert P. Surface tension-driven self-alignment. SOFT MATTER 2017;13:304-327. [PMID: 27905611 DOI: 10.1039/c6sm02078j] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/07/2023]
3
Ben Bakir B, Descos A, Olivier N, Bordel D, Grosse P, Augendre E, Fulbert L, Fedeli JM. Electrically driven hybrid Si/III-V Fabry-Pérot lasers based on adiabatic mode transformers. OPTICS EXPRESS 2011;19:10317-10325. [PMID: 21643289 DOI: 10.1364/oe.19.010317] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/30/2023]
4
Chu KM, Choi WK, Ko YC, Lee JH, Park HH, Jeon DY. Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump. ACTA ACUST UNITED AC 2007. [DOI: 10.1109/tadvp.2006.890209] [Citation(s) in RCA: 10] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/10/2022]
5
Avital A, Zussman E. Fluidic Assembly of Optical Components. ACTA ACUST UNITED AC 2006. [DOI: 10.1109/tadvp.2006.884810] [Citation(s) in RCA: 13] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/05/2022]
6
Morris C, Stauth S, Parviz B. Self-assembly for microscale and nanoscale packaging: steps toward self-packaging. ACTA ACUST UNITED AC 2005. [DOI: 10.1109/tadvp.2005.858454] [Citation(s) in RCA: 94] [Impact Index Per Article: 4.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]
PrevPage 1 of 1 1Next
© 2004-2024 Baishideng Publishing Group Inc. All rights reserved. 7041 Koll Center Parkway, Suite 160, Pleasanton, CA 94566, USA