• Reference Citation Analysis
  • v
  • v
  • Find an Article
Find an Article PDF (4618546)   Today's Articles (21)   Subscriber (49402)
For:  [Subscribe] [Scholar Register]
Number Cited by Other Article(s)
1
Kishi H, Tanaka S, Nakashima Y, Saruwatari T. Self-assembled three-dimensional structure of epoxy/polyethersulphone/silver adhesives with electrical conductivity. POLYMER 2016. [DOI: 10.1016/j.polymer.2015.11.043] [Citation(s) in RCA: 27] [Impact Index Per Article: 3.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]
2
Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach. ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING 2014. [DOI: 10.1007/s13369-014-1167-7] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
3
Madan D, Wang Z, Chen A, Wright PK, Evans JW. High-performance dispenser printed MA p-type Bi(0.5)Sb(1.5)Te(3) flexible thermoelectric generators for powering wireless sensor networks. ACS APPLIED MATERIALS & INTERFACES 2013;5:11872-11876. [PMID: 24160841 DOI: 10.1021/am403568t] [Citation(s) in RCA: 18] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/02/2023]
4
Gao H, Liu L, Luo YF, Jia DM, Wang F, Liu KH. Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives. INT J POLYM MATER PO 2011. [DOI: 10.1080/00914037.2010.531818] [Citation(s) in RCA: 9] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
5
Yu Tao, Yanping Xia, Hui Wang, Fanghong Gong, Haiping Wu, Guoliang Tao. Novel Isotropical Conductive Adhesives for Electronic Packaging Application. ACTA ACUST UNITED AC 2009. [DOI: 10.1109/tadvp.2009.2018141] [Citation(s) in RCA: 27] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/05/2022]
6
Kyoung-Sik Moon, Jiali Wu, Wong C. Improved stability of contact resistance of low melting point alloy incorporated isotropically conductive adhesives. ACTA ACUST UNITED AC 2003. [DOI: 10.1109/tcapt.2003.815101] [Citation(s) in RCA: 19] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/05/2022]
PrevPage 1 of 1 1Next
© 2004-2024 Baishideng Publishing Group Inc. All rights reserved. 7041 Koll Center Parkway, Suite 160, Pleasanton, CA 94566, USA