Li D, Cheng W, Cui X, Chen D, Fei C, Yang Y. Echo Signal Receiving and Data Conversion Integrated Circuits for Portable High-Frequency Ultrasonic Imaging System.
IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS, AND FREQUENCY CONTROL 2022;
69:1980-1993. [PMID:
35320097 DOI:
10.1109/tuffc.2022.3161293]
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Abstract
Ultrasonic imaging has become a very promising technology, and it has been widely applied in biomedicine, geology, and other fields due to its advantages of safety, nondamaging, and real time. Especially, the portable high-frequency (>20 MHz) ultrasonic imaging system (UIS) has been generally used in biomedical detection and diagnosis. In the complex actual environment, the effect of integrated circuits (ICs) on the performance of portable high-frequency UIS is obvious. In the echo signal transmission link, the analog front end (AFE) and the analog-to-digital converter (ADC) are the two most critical modules, where AFE is used to receive and preprocess the analog ultrasonic echo signals and ADC to convert the analog signals from the AFE output to digital. The structure and performance of the ICs integrated into terminal equipment and in-probe for the portable high-frequency UIS are introduced and discussed. Some typical commercial ICs are also summarized. Based on the requirements and challenges of portable high-frequency UIS, the future development directions of ICs mainly include high integration, ultralow power consumption, high speed, and high precision, which can provide valuable reference and advice for the design of AFE and ADC for portable high-frequency UIS.
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