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Handschuh-Wang S, Wang T, Gancarz T, Liu X, Wang B, He B, Dickey MD, Wimmer GW, Stadler FJ. The Liquid Metal Age: A Transition From Hg to Ga. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024:e2408466. [PMID: 39295483 DOI: 10.1002/adma.202408466] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/14/2024] [Revised: 08/25/2024] [Indexed: 09/21/2024]
Abstract
This review offers an illuminating journey through the historical evolution and modern-day applications of liquid metals, presenting a comprehensive view of their significance in diverse fields. Tracing the trajectory from mercury applications to contemporary innovations, the paper explores their pivotal role in industry and research. The analysis spans electrical switches, mechanical applications, electrodes, chemical synthesis, energy storage, thermal transport, electronics, and biomedicine. Each section examines the intricacies of liquid metal integration, elucidating their contributions to technological advancements and societal progress. Moreover, the review critically appraises the challenges and prospects inherent in liquid metal applications, addressing issues of recycling, corrosion management, device stability, economic feasibility, translational hurdles, and market dynamics. By delving into these complexities, the paper advances scholarly understanding and offers actionable insights for researchers, engineers, and policymakers. It aims to catalyze innovation, foster interdisciplinary collaboration, and promote liquid metal-enabled solutions for societal needs. Through its comprehensive analysis and forward-looking perspective, this review serves as a guide for navigating the landscape of liquid metal applications, bridging historical legacies with contemporary challenges, and highlighting the transformative potential of liquid metals in shaping future technologies.
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Affiliation(s)
- Stephan Handschuh-Wang
- College of New Materials and New Energies, Shenzhen Technology University, Shenzhen, 518118, China
| | - Tao Wang
- Advanced Materials Group Co., LTD, Fusionopolis Link #06-07, Nexus One-North, Singapore, 138543, Singapore
| | - Tomasz Gancarz
- Institute of Metallurgy and Materials Science, Polish Academy of Sciences, ul. Reymonta 25, Krakow, 30-059, Poland
| | - Xiaorui Liu
- College of New Materials and New Energies, Shenzhen Technology University, Shenzhen, 518118, China
| | - Ben Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen, 518055, China
| | - Bin He
- College of New Materials and New Energies, Shenzhen Technology University, Shenzhen, 518118, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, NC State University, Raleigh, NC, 27695, USA
| | - Georg W Wimmer
- College of New Materials and New Energies, Shenzhen Technology University, Shenzhen, 518118, China
| | - Florian J Stadler
- Interdisciplinary Research Center for Refining & Advanced Chemicals, King Fahd University of Petroleum and Minerals, Dhahran, 31261, Saudi Arabia
- Department of Chemical Engineering, King Fahd University of Petroleum and Minerals, Dhahran, Kingdom of Saudi Arabia
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Kim M, Lim H, Ko SH. Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2205795. [PMID: 36642850 PMCID: PMC9951389 DOI: 10.1002/advs.202205795] [Citation(s) in RCA: 18] [Impact Index Per Article: 18.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/06/2022] [Revised: 11/27/2022] [Indexed: 05/28/2023]
Abstract
Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.
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Affiliation(s)
- Minwoo Kim
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
| | - Hyungjun Lim
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
- Department of Mechanical EngineeringPohang University of Science and Technology77 Chungam‐ro, Nam‐guPohang37673South Korea
| | - Seung Hwan Ko
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
- Institute of Advanced Machinery and Design/Institute of Engineering ResearchSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
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Babu S, Dousti B, Lee GS, Lee JB. Conversion of Polymer Surfaces into Nonwetting Substrates for Liquid Metal Applications. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2021; 37:8139-8147. [PMID: 34180680 DOI: 10.1021/acs.langmuir.1c00689] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/13/2023]
Abstract
Liquid metal-based applications are limited by the wetting nature of polymers toward surface-oxidized gallium-based liquid metals. This work demonstrates that a 120 s CF4/O2 plasma treatment of polymer surfaces-such as poly(dimethylsiloxane) (PDMS), SU8, S1813, and polyimide-converts these previously wetting surfaces to nonwetting surfaces for gallium-based liquid metals. Static and advancing contact angles of all plasma-treated surfaces are >150°, and receding contact angles are >140°, with contact angle hysteresis in the range of 8.2-10.7°, collectively indicating lyophobic behavior. This lyophobic behavior is attributed to the plasma simultaneously fluorinating the surface while creating sub-micron scale roughness. X-ray photoelectron spectroscopy (XPS) results show a large presence of fluorine at the surface, indicating fluorination of surface methyl groups, while atomic force microscopy (AFM) results show that plasma-treated surfaces have an order of magnitude greater surface roughness than pristine surfaces, indicating a Cassie-Baxter state, which suggests that surface roughness is the primary cause of the nonwetting property, with surface chemistry making a smaller contribution. Solid surface free energy values for all plasma-treated surfaces were found to be generally lower than the pristine surfaces, indicating that this process can be used to make similar classes of polymers nonwetting to gallium-based liquid metals.
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Affiliation(s)
- Sachin Babu
- Department of Electrical and Computer Engineering, University of Texas at Dallas, 800 West Campbell Road, Richardson, Texas 75080, United States
| | - Behnoush Dousti
- Department of Electrical and Computer Engineering, University of Texas at Dallas, 800 West Campbell Road, Richardson, Texas 75080, United States
| | - Gil Sik Lee
- Department of Electrical and Computer Engineering, University of Texas at Dallas, 800 West Campbell Road, Richardson, Texas 75080, United States
| | - Jeong-Bong Lee
- Department of Electrical and Computer Engineering, University of Texas at Dallas, 800 West Campbell Road, Richardson, Texas 75080, United States
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