Vyas A, Wang K, Li Q, Saleem AM, Bylund M, Andersson R, Desmaris V, Smith A, Lundgren P, Enoksson P. Impact of electrode geometry and thickness on planar on-chip microsupercapacitors.
RSC Adv 2020;
10:31435-31441. [PMID:
35520639 PMCID:
PMC9056406 DOI:
10.1039/d0ra05488g]
[Citation(s) in RCA: 5] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/22/2020] [Accepted: 08/19/2020] [Indexed: 11/21/2022] Open
Abstract
We report an assessment of the influence of both finger geometry and vertically-oriented carbon nanofiber lengths in planar micro-supercapacitors. Increasing the finger number leads to an up-scaling in areal power densities, which increases with scan rate. Growing the nanofibers longer, however, does not lead to a proportional growth in capacitance, proposedly related to limited ion penetration of the electrode.
We present an in-depth analysis of the impact of geometry and carbon nanofiber thickness on CMOS compatible microsupercapacitor performance.![]()
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