Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm² chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

Integrated wide-angle scanner based on translating a curved mirror of acylindrical shape

A wide angle microscanning architecture is presented in which the angular deflection is achieved by displacing the principle axis of a curved silicon micromirror of acylindrical shape, with respect to the incident beam optical axis. The micromirror curvature is designed to overcome the possible deformation of the scanned beam spot size during scanning. In the presented architecture, the optical axis of the beam lays in-plane with respect to the substrate opening the door for a completely integrated and self-aligned miniaturized scanner. A micro-optical bench scanning device, based on translating a 200 μm focal length micromirror by an electrostatic comb-drive actuator, is implemented on a silicon chip. The microelectromechanical system has a resonance frequency of 329 Hz and a quality factor of 22. A single-mode optical fiber is used as the optical source and inserted into a micromachined groove fabricated and lithographically aligned with the microbench. Optical deflection angles up to 110 degrees are demonstrated.