A Compact and Low-Cost MEMS Loudspeaker for Digital Hearing Aids

Review of Recent Development of MEMS Speakers

Facilitated by microelectromechanical systems (MEMS) technology, MEMS speakers or microspeakers have been rapidly developed during the past decade to meet the requirements of the flourishing audio market. With advantages of a small footprint, low cost, and easy assembly, MEMS speakers are drawing extensive attention for potential applications in hearing instruments, portable electronics, and the Internet of Things (IoT). MEMS speakers based on different transduction mechanisms, including piezoelectric, electrodynamic, electrostatic, and thermoacoustic actuation, have been developed and significant progresses have been made in commercialization in the last few years. In this article, the principle and modeling of each MEMS speaker type is briefly introduced first. Then, the development of MEMS speakers is reviewed with key specifications of state-of-the-art MEMS speakers summarized. The advantages and challenges of all four types of MEMS speakers are compared and discussed. New approaches to improve sound pressure levels (SPLs) of MEMS speakers are also proposed. Finally, the remaining challenges and outlook of MEMS speakers are given.

Virtual Loudspeaker Effect of Graphene-Based Hybrid Material To Improve Low-Frequency Acoustic Performance

Closed-box loudspeaker systems (CBLSSs) are compact and simple air-suspension loudspeaker systems, and their low-frequency responses are determined by two fundamental parameters: resonance frequency and total damping. Recently, electronic devices have come to require more compact designs, so the volumes of loudspeaker should be reduced. However, a small loudspeaker cannot retain sufficient acoustic space, resulting in poor low-frequency acoustic performance. Herein, we investigated acoustic characterization of the CBLSS with different filling materials such as thermally expanded graphene oxide (TEGO), activated carbon, graphene platelets, and melamine foam (MF). Upon the powder-based test, the resonance frequency of the loudspeaker decreased and resulted in a volume increasing effect inside of the loudspeaker. The TEGO shows almost double volume increase rate, compared to other particle-based filling materials. Employing hybrid filling material that consists of TEGO in an MF cage (TEGO@MF), the volume increase rate of the novel loudspeaker was over 24% at 300 cc. Because of the high adsorptive characteristics and thermal properties of TEGO, the acoustic performance in the low-frequency domain was clearly enhanced, despite the reduced mass loading. Furthermore, these properties were observed to be highly effective for enhancing the low-frequency acoustic performance of the larger loudspeaker, achieving a volume increase rate of 49.5% in a 700 cc enclosure.

A point acoustic device based on aluminum nanowires

A point Electrical Thermal Acoustic (ETA) device based on aluminum nanowire contacts is designed and fabricated. Interdigitated structural aluminum nanowires are released from the substrate by Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE). By releasing the interdigitated structure, the nanowires contact each other at approximately 1 mm above the wafer, forming a Point Contact Structure (PCS). It is found that the PCS acoustic device realizes high efficiency when a biased AC signal is applied. The PCS acoustic device reaches a sound pressure level as high as 67 dB at a distance of 1 cm with 74 mW AC input. The power spectrum is flat, ranging from 2 kHz to 20 kHz with a less than ±3 dB fluctuation. The highest normalized Sound Pressure Level (SPL) of the point contact structure acoustic device is 18 dB higher than the suspended aluminum wire acoustic device. Comparisons between the PCS acoustic device and the Suspended Aluminum Nanowire (SAN) acoustic device illustrate that the PCS acoustic device has a flatter power spectrum within the 20 kHz range, and enhances the SPL at a lower frequency. Enhancing the response at lower frequencies is extremely useful, which may enable earphone and loudspeaker applications within the frequency range of the human ear with the help of pulse density modulation.

A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations

This paper presents a capacitive tactile sensor fabricated in a standard CMOS process. Both of the sensor and readout circuits are integrated on a single chip by a TSMC 0.35 μm CMOS MEMS technology. In order to improve the sensitivity, a T-shaped protrusion is proposed and implemented. This sensor comprises the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few post-processing steps. By a nano-indenter, the measured spring constant of the T-shaped structure is 2.19 kNewton/m. Fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction are utilized to compensate process variations and improve the accuracy of the readout circuits. The measured displacement-to-voltage transductance is 7.15 mV/nm, and the sensitivity is 3.26 mV/μNewton. The overall power dissipation is 132.8 μW.

Magnetostrictive microelectromechanical loudspeaker

A microelectromechnical-loudspeaker based on the magnetostrictive effect is presented. The membrane consists of a comb structure of monomorph bending cantilevers with an area of about 16 mm(2). Prototypes generate a sound pressure level (SPL) of up to 102 dB at 450 Hz with a total harmonic distortion of 2% inside a 2 cm(3) measurement volume. The fabrication process of the device as well as a coupled simulation model to calculate its sound pressure is introduced. The model reproduces the measurements and is employed to further optimize the loudspeaker membrane. As a result, a computed maximum SPL of 106 dB has been achieved with a -6 dB frequency range extending from 100 Hz to 2.6 kHz.

Miniaturized passive hydrogel check valve for hydrocephalus treatment

Improvements in cerebrospinal fluid (CSF) draining techniques for treatment of hydrocephalus are urgently sought after to substitute for current CSF shunts that are plagued by high failure rates. The passive check valve aims to restore near natural CSF draining operations while mitigating possible failure mechanisms caused by finite leakage or low resilience that frequently constrain practical implementation of miniaturized valves. A simple hydrogel diaphragm structures core passive valve operations and enforce valve sealing properties to substantially lower reverse flow leakage. Experimental measurements demonstrate realization of targeted cracking pressures (PT ≈ 20-110 mmH2O) and operation at -800 <; ΔP <; 600 mmH2O without observable degradation or leakage.