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Xu Y, Xu D, Yu N, Liang B, Yang Z, Asif MS, Yan R, Liu M. Machine Learning Enhanced Optical Microscopy for the Rapid Morphology Characterization of Silver Nanoparticles. ACS APPLIED MATERIALS & INTERFACES 2023; 15:18244-18251. [PMID: 37010900 DOI: 10.1021/acsami.3c02448] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/19/2023]
Abstract
The rapid characterization of nanoparticles for morphological information such as size and shape is essential for material synthesis as they are the determining factors for the optical, mechanical, and chemical properties and related applications. In this paper, we report a computational imaging platform to characterize nanoparticle size and morphology under conventional optical microscopy. We established a machine learning model based on a series of images acquired by through-focus scanning optical microscopy (TSOM) on a conventional optical microscope. This model predicts the size of silver nanocubes with an estimation error below 5% on individual particles. At the ensemble level, the estimation error is 1.6% for the averaged size and 0.4 nm for the standard deviation. The method can also identify the tip morphology of silver nanowires from the mix of sharp-tip and blunt-tip samples at an accuracy of 82%. Furthermore, we demonstrated online monitoring for the evolution of the size distribution of nanoparticles during synthesis. This method can be potentially extended to more complicated nanomaterials such as anisotropic and dielectric nanoparticles.
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Affiliation(s)
- Yaodong Xu
- Materials Science and Engineering Program, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - Da Xu
- Department of Electrical and Computer Engineering, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - Ning Yu
- Chemical and Environmental Engineering, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - Boqun Liang
- Materials Science and Engineering Program, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - Zhaoxi Yang
- Chemical and Environmental Engineering, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - M Salman Asif
- Department of Electrical and Computer Engineering, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - Ruoxue Yan
- Materials Science and Engineering Program, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
- Chemical and Environmental Engineering, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
| | - Ming Liu
- Materials Science and Engineering Program, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
- Department of Electrical and Computer Engineering, University of California, Riverside, 900 University Ave., Riverside, California 92521, United States
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You X, Liu J, Li Y, Jiang Y, Liu J. 3D microscopy in industrial measurements. J Microsc 2023; 289:137-156. [PMID: 36427335 DOI: 10.1111/jmi.13161] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/05/2022] [Revised: 11/19/2022] [Accepted: 11/21/2022] [Indexed: 11/27/2022]
Abstract
Quality control is essential to ensure the performance and yield of microdevices in industrial processing and manufacturing. In particular, 3D microscopy can be considered as a separate branch of microscopic instruments and plays a pivotal role in monitoring processing quality. For industrial measurements, 3D microscopy is mainly used for both the inspection of critical dimensions to ensure the design performance and detection of defects for improving the yield of microdevices. However, with the progress of advanced manufacturing technology and the increasing demand for high-performance microdevices, 3D microscopy has ushered in new challenges and development opportunities, such as breakthroughs in diffraction limit, 3D characterisation and calibrations of critical dimensions, high-precision detection and physical property determination of defects, and application of artificial intelligence. In this review, we provide a comprehensive survey about the state of the art and challenges in 3D microscopy for industrial measurements, and provide development ideas for future research. By describing techniques and methods with their advantages and limitations, we provide guidance to researchers and developers about the most suitable technique available for their intended industrial measurements.
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Affiliation(s)
- Xiaoyu You
- Advanced Microscopy and Instrumentation Research Centre, Harbin Institute of Technology, Harbin, Heilongjiang, China.,State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Lab of Ultra-Precision Intelligent Instrumentation Ministry of Industry and Information Technology, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Laboratory of Microsystems and Microstructures Manufacturing Ministry of Education, Harbin Institute of Technology, Harbin, Heilongjiang, China
| | - Jing Liu
- Advanced Microscopy and Instrumentation Research Centre, Harbin Institute of Technology, Harbin, Heilongjiang, China.,State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Lab of Ultra-Precision Intelligent Instrumentation Ministry of Industry and Information Technology, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Laboratory of Microsystems and Microstructures Manufacturing Ministry of Education, Harbin Institute of Technology, Harbin, Heilongjiang, China
| | - Yifei Li
- Advanced Microscopy and Instrumentation Research Centre, Harbin Institute of Technology, Harbin, Heilongjiang, China.,State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Lab of Ultra-Precision Intelligent Instrumentation Ministry of Industry and Information Technology, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Laboratory of Microsystems and Microstructures Manufacturing Ministry of Education, Harbin Institute of Technology, Harbin, Heilongjiang, China
| | - Yong Jiang
- Advanced Microscopy and Instrumentation Research Centre, Harbin Institute of Technology, Harbin, Heilongjiang, China.,State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Lab of Ultra-Precision Intelligent Instrumentation Ministry of Industry and Information Technology, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Laboratory of Microsystems and Microstructures Manufacturing Ministry of Education, Harbin Institute of Technology, Harbin, Heilongjiang, China
| | - Jian Liu
- Advanced Microscopy and Instrumentation Research Centre, Harbin Institute of Technology, Harbin, Heilongjiang, China.,State Key Laboratory of Robotics and Systems, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Lab of Ultra-Precision Intelligent Instrumentation Ministry of Industry and Information Technology, Harbin Institute of Technology, Harbin, Heilongjiang, China.,Key Laboratory of Microsystems and Microstructures Manufacturing Ministry of Education, Harbin Institute of Technology, Harbin, Heilongjiang, China
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