Impact of Random Dopant Fluctuations on the Electronic Properties of In(x)Ga(1-x)N/GaN Axial Nanowire Heterostructures

We study the electronic properties of axial In(x)Ga(1-x)N/GaN nanowire heterostructures with randomly placed ionized donors. Our simulations are based on an eight-band k·p model and indicate large variations of both the ground state transition energy and the spatial distribution of the electron and hole charge density. We show that these variations are intrinsic to nanostructures containing ionized donors and that the presence of donors has important consequences for all nanowire-based light-emitting devices including single-photon emitters required for quantum computing and quantum cryptography.

A reliable method for the counting and control of single ions for single-dopant controlled devices

By 2016, transistor device size will be just 10 nm. However, a transistor that is doped at a typical concentration of 10(18) atoms cm(-3) has only one dopant atom in the active channel region. Therefore, it can be predicted that conventional doping methods such as ion implantation and thermal diffusion will not be available ten years from now. We have been developing a single-ion implantation (SII) method that enables us to implant dopant ions one-by-one into semiconductors until the desired number is reached. Here we report a simple but reliable method to control the number of single-dopant atoms by detecting the change in drain current induced by single-ion implantation. The drain current decreases in a stepwise fashion as a result of the clusters of displaced Si atoms created by every single-ion incidence. This result indicates that the single-ion detection method we have developed is capable of detecting single-ion incidence with 100% efficiency. Our method potentially could pave the way to future single-atom devices, including a solid-state quantum computer.

Enhancing semiconductor device performance using ordered dopant arrays

As the size of semiconductor devices continues to shrink, the normally random distribution of the individual dopant atoms within the semiconductor becomes a critical factor in determining device performance--homogeneity can no longer be assumed. Here we report the fabrication of semiconductor devices in which both the number and position of the dopant atoms are precisely controlled. To achieve this, we make use of a recently developed single-ion implantation technique, which enables us to implant dopant ions one-by-one into a fine semiconductor region until the desired number is reached. Electrical measurements of the resulting transistors reveal that device-to-device fluctuations in the threshold voltage (Vth; the turn-on voltage of the device) are less for those structures with ordered dopant arrays than for those with conventional random doping. We also find that the devices with ordered dopant arrays exhibit a shift in Vth, relative to the undoped semiconductor, that is twice that for a random dopant distribution (- 0.4 V versus -0.2 V); we attribute this to the uniformity of electrostatic potential in the conducting channel region due to the ordered distribution of dopant atoms. Our results therefore serve to highlight the improvements in device performance that can be achieved through atomic-scale control of the doping process. Furthermore, ordered dopant arrays of this type may enhance the prospects for realizing silicon-based solid-state quantum computers.