New fluorinated poly(pyridine amide)s derived from 2,6-bis(4-iodophenyl)-4-(4-trifluoromethylphenyl)pyridine by C–N coupling reaction

2,6-Bis(4-iodophenyl)-4-(4-trifluoromethylphenyl)pyridine, as a new aromatic diiodide compound, was synthesized through a one-pot protocol by the sequential diazotization-iodination of 2,6-bis(4-aminophenyl)-4-(4-trifluoromethylphenyl)pyridine with KI/NaNO2/ p-TsOH in acetonitrile at room temperature. A number of new aromatic fluorinated poly(pyridine amide)s containing 2,6-diphenyl-4-(4-trifluoromethylphenyl)pyridine units were prepared via a Pd(PPh3)2Cl2 catalyzed carbonylation polymerization of this diiodide, diamines and carbon monoxide in DMAc in the presence of PPh3 and 1,8-diazabicyclo[5,4,0]-7-undecene. These new polyamides with inherent viscosities of 0.63–0.72 dL/g were amorphous and easily soluble in amide type aprotic solvents such as NMP, DMAc, DMF and dimethyl sulfoxide at room temperature. Thermal analysis data up to 800°C in nitrogen showed their high thermal behavior with 5% weight loss temperature of 428–498°C and char yield of 62–69%. Their limiting oxygen index of 42.3–45.1 showed that the resulting poly(pyridine amide)s could be classified as “self-extinguishing polymers”. Also, their thin films exhibited high optical transparency with a cut-off wavelength of 324–373 nm.

Synthesis and characterization of new aromatic copoly(ether amide)s bearing 4-trifluoromethylphenyl-2,6-diphenylpyridyl moieties in the main chain

A series of new aromatic fluorinated copoly(ether amide)s containing 4-(4-trifluoromethylphenyl)-2,6-diphenylpyridyl moiety with high molecular weight were prepared by a low-temperature solution polycondensation of terephthaloyl chloride with 4-(4-trifluoromethylphenyl)-2,6-bis(4-aminophenyl)pyridine and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene with various mole ratios of the two monomers ranged from 20/80 to 80/20. All polymers were amorphous and soluble in common organic solvents such as N-methyl-2-pyrrolidone, N,N-dimethylacetamide and tetrahydrofuran at room temperature or upon heating at 70oC, and could be solution cast into transparent, tough, and flexible films with tensile strengths of 66.9–80.2 MPa, tensile moduli of 1.84–2.03 GPa, and elongations at break of 11.8–20.7%. These new polyamides displayed good thermal stability with gradually increasing of glass temperatures of 259–285oC as an increase of the 4-(4-trifluoromethylphenyl)-2,6-diphenylpyridyl component, the temperature at 10% weight loss of 476–505oC, and the residue of 55–61% at 750oC in nitrogen. They also exhibited low dielectric constants of 3.11–3.38 (1 MHz), low moisture absorption in the range of 1.43–1.75%, and high transparency with an UV–vis absorption cut-off wavelength in the 350–368 nm range.

Novel soluble and heat-resistant polyamides derived from 4-(4-diphenylphosphino) phenyl-2,6-bis(4-aminophenyl)pyridine and various aromatic dicarboxylic acids

New diamine, 4-(4-diphenylphosphino)phenyl-2,6-bis(4-aminophenyl)pyridine, was prepared, and the related polyamides (PAs) bearing 2,6-diphenylpyridyl units and pendant diphenylphosphinophenyl groups were synthesized by direct polycondensation of this diamine and various aromatic diacids in N-methyl-2-pyrrolidinone (NMP) using triphenyl phosphite and pyridine as condensing agents. The resulting PAs with inherent viscosities of 0.78–1.06 dL g−1 are readily soluble in polar aprotic solvents such as NMP, N, N-dimethylacetamide, and dimethylsulfoxide as well as less polar solvents such as m-cresol and pyridine. All the PAs are amorphous and could be solution-cast into transparent, flexible, and tough films, which have tensile strengths of 68.2–88.8 MPa, tensile moduli of 1.9–2.4 GPa, and elongations at break of 5.4–10.3%. These polymer films also exhibit high optical transparence with the UV cutoff wavelength in the 361–412 nm range. These PAs display glass transition temperatures of 316–332°C, 10% mass loss temperatures of 524–553°C, and more than 48% residues at 800°C in nitrogen, respectively. Their high char yields and good limited oxygen index values ranging from 39 to 44 indicate the prepared PAs show good thermal stability and flame-retardant property.