Extrusion 3D Printing of Intrinsically Fluorescent Thermoplastic Polyimide: Revealing an Undisclosed Potential

Thermoplastic polyimides (TPIs) are promising lightweight materials for replacing metal components in aerospace, rocketry, and automotive industries. Key TPI attributes include low density, thermal stability, mechanical strength, inherent flame retardancy, and intrinsic fluorescence under UV light. The application of advanced manufacturing techniques, especially 3D printing, could significantly broaden the use of TPIs; however, challenges in melt-processing this class of polymer represent a barrier. This study explored the processability, 3D-printing and hence mechanical, and fluorescence properties of TPI coupons, demonstrating their suitability for advanced 3D-printing applications. Moreover, the study successfully 3D-printed a functional impeller for an overhead stirrer, effectively replacing its metallic counterpart. Defects were shown to be readily detectable under UV light. A thorough analysis of TPI processing examining its rheological, morphological, and thermal properties is presented. Extruded TPI filaments were 3D-printed into test coupons with different infill geometries to examine the effect of tool path on mechanical performance. The fluorescence properties of the 3D-printed TPI coupons were evaluated to highlight their potential to produce intricately shaped thermally stable, fluorescence-based sensors.

Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

A series of oligomers based on the mixture of thioetherdiphthalic anhydride isomers and 4,4′-oxydianiline with 4-phenylethynylphthalic anhydride as reactive endcapping reagent were prepared. The calculated molecular weights were in the range of 1150–5070 g mol−1 with different degrees of polymerization ( n = 1, 3, 5, 7, and 9). The effect of molecular weight of the aromatic oligomers on their processability and solubility as well as the thermal and mechanical properties of the thermal-cured polyimides (PIs) was systematically investigated. The typical oligomer (Oligo-1) could be melted at temperatures of 289–334°C to yield stable molten fluid with melt viscosity below 1.0 Pa s. The melt viscosity of the oligomers increased with the increasing molecular weight. After thermally curing at 370°C, the thermoset PIs exhibited good thermal properties. The glass transition temperatures of oligomers measured by differential scanning calorimetry were in the range of 286–326°C, and the temperature of 5% weight loss was higher than 524°C. The cured films also showed good mechanical properties with tensile strength above 72 MPa and modulus more than 2.5 GPa.

Synthesis and properties of electroactive aromatic polyimides with methyl- or trifluoromethyl-protecting triphenylamine units

Two series of new redox-active aromatic polyimides with methyl- (–CH3) or trifluoromethyl (–CF3)-protecting triphenylamine moieties were prepared from 4,4′-diamino-4″-methyltriphenylamine and 4,4′-diamino-4″-(trifluoromethyl)triphenylamine with aromatic tetracarboxylic dianhydrides via the conventional two-step polycondensation technique. Flexible and strong polyimide films could be obtained via the thermal curing of their precursor poly(amic acid) films or direct solution cast from some organosoluble polyimides. The polyimides showed high glass-transition temperatures between 269°C and 312°C, and they did not show significant decomposition before 500°C in air or under nitrogen atmosphere. Cyclic voltammograms of the polyimide films on the indium–tin oxide-coated glass substrate exhibited a pair of reversible redox waves with half-wave oxidation potentials of 1.08–1.10 V (for the –CH3 series) and 1.23–1.26 V (vs. silver/silver chloride; for the –CF3 series) in acetonitrile solution. The polyimide films showed anodic electrochromism from pale yellow neutral state to purplish blue (for the –CH3 series) and chrome yellow (for the –CF3 series) when oxidized.

Highly soluble phenylethynyl-endcapped imide oligomers derived from thioetherdiphthalic anhydride isomers

Novel imide oligomers (calculated molecular weights: 1250–5000 g mol−1) based on the mixture of thioetherdiphthalic anhydride isomers ( m-TDPA) with 2-phenyl-4,4′-diaminodiphenyl ether ( p-ODA) in the presence of 4-phenylethynylphthalic anhydride (PEPA) as reactive endcapping agent were prepared. Then pyromellitic dianhydride (PMDA) was introduced to the polymerization of m-TDPA/ p-ODA (mole m-TDPA:molePMDA = 1:1). The effect of molecular weights and polymer chemical structures of the aromatic oligomers on their processability and solubility as well as the thermal and mechanical properties of the thermal-cured polyimides (PIs) was systematically investigated. All the oligomers showed good solubility (more than 30 wt%) in N-methyl-2-pyrrolidone and very low melt viscosities. The minimum melt viscosities of Oligo-5 was 61.5 Pa s at 321°C. The melt viscosity of the oligomers increased with the increase of molecular weight. After thermally curing at 370°C for 1 h, the thermoset PIs exhibited good thermal properties. The glass transition temperatures of oligomers measured by differential scanning calorimetry were in the range of 264–337°C, and the temperature of 5% weight loss was higher than 505°C. The cured films also demonstrated good mechanical properties with tensile strength and modulus greater than 52 MPa and 2.9 GPa, respectively.

Synthesis and crosslinking study of isomeric poly(thioether ether imide)s containing pendant nitrile and terminal phthalonitrile groups

Upon crosslinking, phthalonitrile-terminated polyimide PN-PI (a–d) films exhibited better solvent resistance, and greater thermal and mechanical properties than PI (a–d) films.

Preparation, characterization, and properties of poly(thioether imide)s from isomeric bis(chlorophthalimide)s and bisthiophenols

A series of isomeric poly(thioether imide)s (PTIs) containing thioether linkages were prepared by aromatic nucleophilic substitution reaction of isomeric bis(chlorophthalimide)s (BCPIs) and bisthiophenols. The glass transition temperatures ( Tgs) of the isomeric PTIs were 190–264°C, the 5% weight loss temperature ( T5%) reached up to 441–508°C under nitrogen and 472–520°C in air atmospheres, respectively. It was found that the Tg values of the PTIs from three isomeric BCPIs with the same bisthiophenol increased in the order of 4,4′-BCPI < 3,4′-BCPI < 3,3′-BCPI, while the T5% values gradually decreased in the order of 4,4′-BCPI > 3,4′-BCPI > 3,3′-BCPI. Flexible films that could be cast from the polymer solutions exhibited good mechanical properties with tensile strengths of 91–121 MPa, elongations at break of 8–12%, and tensile moduli of 2.2–2.6 GPa. The minimum melt viscosity of isomeric PTIs decreased with increasing the content of asymmetric 3,4′-substituted phthalimide unit, and the PTI (2c) showed the lowest melt viscosity about 760 Pa·s at 264°C among these isomeric polymers.

Preparation, characterization, and properties of poly(thioether ether imide)s from isomeric bis(chlorophthalimide)s and bis(4-mercaptophenyl) ether

A series of isomeric poly(thioether ether imide)s (PTEIs) containing both thioether and ether linkages were prepared by aromatic nucleophilic substitution reaction of isomeric bis(chlorophthalimide)s (BCPIs) with bis(4-mercaptophenyl) ether (BMPE). The inherent viscosities of synthesized polymers were found in the range of 0.41–0.86 dL g−1 in N-methyl-2-pyrrolidone at 30°C. The glass transition temperature ( Tg) of the isomeric PTEIs were 210–242°C and increased by increasing the content of 3-substituted phthalimide unit in the polymer backbone. The 5% weight loss temperature values reached up to 525–539°C under nitrogen and 523–534°C in air atmospheres, respectively, which indicated this kind of polyimide possessed excellent thermal stability. Flexible films could be cast from the polymer solution. The PTEI films exhibited moderate mechanical properties with tensile strengths of 106–127 MPa, elongations at break of 8.6–11.5%, and tensile moduli of 2.2–2.8 GPa, respectively. Dynamic mechanical thermal analysis results illustrated that the storage moduli ( E′) of PTEI (a–e) almost completely maintained at about 2.3 GPa before reaching the corresponding Tg. It is noted that the minimum melt viscosity of isomeric PTEIs (a′–e′) decreased by increasing the content of unsymmetrical 3,4′-substituted phthalimide unit in the polymer main chain.