Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites

Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) and 1-methyl-1-phenylsilacyclobutane (1-MPSCB), respectively. The low dielectric constant (low-k) siloxane/carbosilane hybrid benzocyclobutene resin composites, P(4-MB-co-1-MP)/BCB-POSS and P(4-MB-co-1-MP)/DVS-BCB, were prepared. The curing processes of the composites were assessed via Fourier-transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects on dielectric properties and heat resistance of those composites with different proportion of BCB-POSS and DVS-BCB were investigated using an impedance analyzer and thermogravimetric analyzer (TGA), respectively. The thermal curing of composites could be carried out by ring-opening polymerization (ROP) of the BCB four-member rings of BCB-POSS or DVS-BCB and those of P(4-MB-co-1-MP). With increasing the proportion of BCB-POSS to 30%, the 5% weight loss temperature (T_5%) of P(4-MB-co-1-MP)/BCB-POSS composites was raised visibly, whereas the dielectric constant (k) was decreased owing to the introduction of nanopores into POSS. For P(4-MB-co-1-MP)/DVS-BCB composites, the T_5% and k were slightly raised with increasing the proportion of DVS-BCB. The above results indicated that the BCB-POSS showed advantages over conventional fillers to simultaneously improve thermostability and decrease k.

Biorenewable rosin derived benzocyclobutene resin: a thermosetting material with good hydrophobicity and low dielectric constant

Development of bio-based polymers has been promoted by the growing concerns about the long-term sustainability and negative environmental footprint of petroleum-based polymer materials. A new monomer containing benzocyclobutene and allyl units has been developed by using rosin as the feedstock. The structure of the monomer was characterized by elemental analysis, MS, FT-IR and NMR spectroscopy. The monomer could be converted to the polymer via thermal ring-opening polymerization which was characterized via FT-IR, thermogravimetric analysis (TGA), atom force microscopy (AFM) and so on. The polymer showed good dielectric properties and hydrophobicity with an average dielectric constant of 2.51 in a range of frequencies from 0.1 to 18 MHz and a water contact angle of 106°. In addition, the polymer with other comprehensive performances exhibited a 5% weight loss temperature of 406 °C, a surface roughness (R a) of 0.658 nm in a 5.0 × 5.0 μm2 area, hardness and Young's modulus of 0.283 and 3.542 GPa, and storage modulus of 11.46 GPa at 30 °C. These data suggest that the polymer may have potential application in electronics and microelectronics.

Flame–retarded epoxy resin with high glass transition temperature cured by DOPO-containing H-benzimidazole

A halogen-free flame retardant of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide-containing H-benzimidazole (DHBI) was synthesized and subsequently used as co-curing agent of 4,4′-diamino-diphenylmethane for diglycidyl ether of bisphenol-A. The structure of DHBI was characterized by Fourier transform infrared (FTIR) spectroscopy, proton, carbon 13 and phosphorus-31 nuclear magnetic resonance, and mass spectroscopy. A series of cured epoxy resins (EPs) were prepared and their flame retardancy, thermal stability, flexibility, and dielectric properties were investigated. The resulting cured EP (EP-10) with 7.45 wt% of DHBI successfully achieved UL 94 V-0 rate with limited oxygen index of 35.6% and without dropping phenomenon. Compared with the cured pristine EP (EP-00), the glass transition temperature of EP-10 was increased by 6.9°C, accompanied with an enhancement of flexible strength by 13.1 MPa and a decrement of dielectric constant by 0.3 at the testing frequency of 1 MHz.

A curing system of benzoxazine with amine: reactivity, reaction mechanism and material properties

In addition to providing an acceleration effect on curing, suitable amines react with benzoxazine to form desired structures and improve the materials properties of the cured resins.