Nagella SR, Ha CS. Structural Designs of Transparent Polyimide Films with Low Dielectric Properties and Low Water Absorption: A Review.
NANOMATERIALS (BASEL, SWITZERLAND) 2023;
13:2090. [PMID:
37513100 PMCID:
PMC10386762 DOI:
10.3390/nano13142090]
[Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/15/2023] [Revised: 07/08/2023] [Accepted: 07/12/2023] [Indexed: 07/30/2023]
Abstract
The rapid development of communication networks (5G and 6G) that rely on high-speed devices requiring fast and high-quality intra- and inter-terminal signal transmission media has led to a steady increase in the need for high-performance, low-dielectric-constant (Dk) (<2.5) materials. Consequently, low-dielectric polymeric materials, particularly polyimides (PIs), are very attractive materials that are capable of meeting the requirements of high-performance terminal devices that transmit broadband high-frequency signals. However, such a PI needs to be properly designed with appropriate properties, including a low Dk, low dielectric loss (Df), and low water absorptivity. PI materials are broadly used in various fields owing to their superior property/processibility combinations. This review summarizes the structural designs of PIs with low Dk and Df values, low water-absorbing capacity, and high optical transparency intended for communication applications. Furthermore, we characterize structure-property relationships for various PI types and finally propose structural modifications required to obtain useful values of the abovementioned parameters.
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