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Cao X, Wen J, Wei C, Liu X, He G. Preparation and properties of adhesive-free double-sided flexible copper clad laminate with outstanding adhesion strength. HIGH PERFORM POLYM 2021. [DOI: 10.1177/0954008320988761] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
Abstract
In this paper, the synthesized thermoplastic polyimide (TPI) precursor is coated on both surfaces of the surface-treated polyimide (PI) base film, and the TPI/PI/TPI multilayer films is obtained by thermal imidization. The mechanical properties, heat resistance, water absorption of the multilayer film and the interface between the TPI and the PI base film were investigated in detail. Then, multilayer film-2 (MF-2) with excellent comprehensive performance and the two copper foils were pressed together to prepare a double-sided flexible copper clad laminate (FCCL) by thermal lamination method, and the properties of FCCL were studied in detail. The results show that the FCCL has a high peel strength of 1.22 N/mm, passed a solder bath test of 288°C, and the surface condition was good under hot-pressing temperature of 360°C, hot-pressing pressure of 15 MPa and hot-pressing time of 60 s. In addition, the SEM and EDS spectra of the stripped copper foil confirmed that the TPI layer was immersed into the interstitial space of the Cu nodules, forming a strong physical bite with the copper foil. The current work provides a promising solution for the design and fabrication of multilayer printed circuit boards with excellent performance.
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Affiliation(s)
- Xianwu Cao
- South China University of Technology, Guangzhou, China
- National Engineering Research Center of Novel Equipment for Polymer Processing, South China University of Technology, Guangzhou, China
- The Key Laboratory of Polymer Processing Engineering of Ministry of Education, South China University of Technology, Guangzhou, China
| | - Jiangwei Wen
- South China University of Technology, Guangzhou, China
- National Engineering Research Center of Novel Equipment for Polymer Processing, South China University of Technology, Guangzhou, China
- The Key Laboratory of Polymer Processing Engineering of Ministry of Education, South China University of Technology, Guangzhou, China
| | - Chuang Wei
- South China University of Technology, Guangzhou, China
- National Engineering Research Center of Novel Equipment for Polymer Processing, South China University of Technology, Guangzhou, China
- The Key Laboratory of Polymer Processing Engineering of Ministry of Education, South China University of Technology, Guangzhou, China
| | - Xin Liu
- South China University of Technology, Guangzhou, China
- National Engineering Research Center of Novel Equipment for Polymer Processing, South China University of Technology, Guangzhou, China
- The Key Laboratory of Polymer Processing Engineering of Ministry of Education, South China University of Technology, Guangzhou, China
| | - Guangjian He
- South China University of Technology, Guangzhou, China
- National Engineering Research Center of Novel Equipment for Polymer Processing, South China University of Technology, Guangzhou, China
- The Key Laboratory of Polymer Processing Engineering of Ministry of Education, South China University of Technology, Guangzhou, China
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Shao T, Gong Y, Chen X, Chen L. Preparation and characterization of modified self-crosslinking fluorocarbon acrylate latex. CHEMICAL PAPERS 2021. [DOI: 10.1007/s11696-020-01350-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/23/2022]
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Erkmen B, Bayram G. Improvement in mechanical, electrical, and shape memory properties of the polystyrene‐based carbon
fiber‐reinforced
polymer composites containing carbon nanotubes. J Appl Polym Sci 2021. [DOI: 10.1002/app.50541] [Citation(s) in RCA: 4] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/29/2023]
Affiliation(s)
- Berrak Erkmen
- Department of Chemical Engineering Middle East Technical University Ankara Turkey
| | - Goknur Bayram
- Department of Chemical Engineering Middle East Technical University Ankara Turkey
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