Effect of highly thermally conductive Ag@BN on the thermal and mechanical properties of phthalonitrile resins

Ag@BN/phthalonitrile resin composites were prepared using highly thermally conductive BN modified by Ag plating. The effects of different contents of Ag@BN particles on the dynamic mechanical properties, thermal stability, and thermal conductivity of composites were examined. The results of Fourier-transform infrared spectroscopy, X-ray powder diffraction, scanning electron microscopy, and energy-dispersive X-ray spectroscopy analyses showed that Ag was successfully deposited on the surface of BN. The prepared Ag@BN was subjected to KH550 grafting treatment. With the increase in the content of Ag@BN/KH550, the storage modulus, thermal stability, and thermal conductivity of the composite increased. The storage modulus, decomposition temperature, and thermal conductivity of the Ag@BN/phthalonitrile composite with 20 wt.% Ag@BN/KH550 were 5.0 GPa, 539°C, and 0.80 W/(mK), respectively, which are 1.35, 1.18, and 3.33 times higher than those of pure resin, respectively. The compatibility and dispersibility of BN modified by Ag plating in phthalonitrile resin were effectively enhanced, thereby providing a potential candidate to be used at high-temperature devices with high thermal conductivity.

SiBCN ceramic precursor modified phthalonitrile resin with high thermal resistance

In order to expand the application of phenolic-type phthalonitrile resin in high-temperature fields, a series of organic–inorganic hybrid materials have been prepared via conventional blending and doping method. The chemical transformations were monitored by various measurements, while the curing behavior was evaluated by differential scanning calorimetry (DSC), and these new blends could be also cured under auto-catalytic process. The onset polymerization exothermic temperature shifted to lower temperatures (195.3°C). Later, the compatibility within the cured products was analyzed by using energy dispersive spectrometer (EDS) and scanning electron microscope (SEM), where no phase separation occurred between the ceramic domain and the phthalonitrile polymer. Upon curing, the thermal properties of the polymers were characterized by dynamic thermomechanical analysis (DMA) and thermogravimetric analysis (TGA), where enhanced heat resistance and thermal stability were discovered, The blends residual weight (Cy) value was 57.6% with 15 wt.% SiBCN at 1000°C. And when blended with SiBCN precursor, no peak or onset point could be observed in the temperature range (50 to 500°C), which indicated the glass transition temperature greater than 500°C. Additionally, the dielectric properties were evaluated. And when the content was 5 wt.%, the blends dielectric loss was 0.0043 and the permittivity was 4.31. The above results indicated that the introduction of ceramic precursors could enhance the thermal performance of phthalonitrile polymers, consequently the hybrid materials shown great potential in the application of higher temperature fields.