Three-wavelength electronic speckle pattern interferometry with the Fourier-transform method for simultaneous measurement of microstructure-scale deformations in three dimensions

Online 3D Displacement Measurement Using Speckle Interferometer with a Single Illumination-Detection Path

Measurement systems for online nondestructive full-field three-dimensional (3D) displacement based on the single-shot and multiplexing techniques attract more and more interest, especially throughout the manufacturing industries. This paper proposes an accurate and easy-to-implement method based on an electronic speckle pattern interferometer (ESPI) with single illumination-detection path to realize the online nondestructive full-field 3D displacement measurement. The simple and compact optical system generates three different sensitivity vectors to enable the evaluation of the three orthogonal displacement components. By applying the spatial carrier phase-shifting technique, the desired information can be obtained in real time. The theoretical analysis and the measurement results have proven the feasibility of this ESPI system and quantified its relative measurement error.

Three-Dimensional Continuous Displacement Measurement with Temporal Speckle Pattern Interferometry

A speckle interferometer which can measure whole field three-dimensional displacements continuously and dynamically has been built. Three different wavelength lasers are used to produce the speckle interferograms of the two in-plane displacements (displacements in the x- and y-direction) and one out-of-plane displacement (displacement in the z-direction), respectively. One color CCD camera is employed to collect these mixed speckle interferograms simultaneously. The mixed interferograms are separated by the Red, Green and Blue channels of the color CCD camera, and then are processed by the wavelet transform technique to extract the phase information of the measured object. The preliminary experiment is carried out to demonstrate the performance of this new device.

Measurement of transient deformations using digital image correlation method and high-speed photography: application to dynamic fracture

The digital image correlation method is extended to the study of transient deformations such as the one associated with a rapid growth of cracks in materials. A newly introduced rotating mirror type, multichannel digital high-speed camera is used in the investigation. Details of calibrating the imaging system are first described, and the methodology to estimate and correct inherent misalignments in the optical channels are outlined. A series of benchmark experiments are used to determined the accuracy of the measured displacements. A 2%-6% pixel accuracy in displacement measurements is achieved. Subsequently, the method is used to study crack growth in edge cracked beams subjected to impact loading. Decorated speckle patterns in the crack tip vicinity at rates of 225,000 frames per second are registered. Two sets of images are recorded, one before the impact and another after the impact. Using the image correlation algorithms developed for this work, the entire crack tip deformation history, from the time of impact to complete fracture, is mapped. The crack opening displacements are then analyzed to obtain the history of failure characterization parameter, namely, the dynamic stress intensity factor. The measurements are independently verified successfully by a complementary numerical analysis of the problem.