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Zhao B, Huang N, Dai S, Zhou P. Study of Prefabricated Crack Propagation on Monocrystalline Silicon Surfaces for Grinding Damage Analysis. MATERIALS (BASEL, SWITZERLAND) 2024; 17:3852. [PMID: 39124516 PMCID: PMC11313162 DOI: 10.3390/ma17153852] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/23/2024] [Revised: 07/22/2024] [Accepted: 08/01/2024] [Indexed: 08/12/2024]
Abstract
Crack generation and propagation are critical aspects of grinding processes for hard and brittle materials. Despite extensive research, the impact of residual cracks from coarse grinding on the cracks generated during fine grinding remains unexplored. This study aims to bridge this gap by examining the propagation law of existing cracks under indentation using the extended finite element method. The results reveal that prefabricated cracks with depths less than the crack depth produced on an undamaged surface tend to extend further without surpassing the latter. Conversely, deeper prefabricated cracks do not exhibit significant expansion. A novel method combining indentation and prefabricated cracks with fracture strength tests is proposed to determine crack propagation. Silicon wafers with varying damaged surfaces are analyzed, and changes in fracture strength, measured by the ball-on-ring method, are utilized to determine crack propagation. The experimental results confirm the proposed crack evolution law, validated by damage assessments across different grinding processes, which is suitable for crack damage. The findings demonstrate that residual cracks from coarse grinding are negligible in predicting the maximum crack depth during fine grinding. This research provides a crucial foundation for optimizing the wafer thinning process in 3D stacked chip manufacturing, establishing that changes in fracture strength are a reliable indicator of crack propagation feasibility.
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Affiliation(s)
| | | | | | - Ping Zhou
- State Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of Technology, Dalian 116024, China; (B.Z.); (N.H.); (S.D.)
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Shao Q, Duan S, Fu L, Lyu B, Zhao P, Yuan J. Shear Thickening Polishing of Quartz Glass. MICROMACHINES 2021; 12:mi12080956. [PMID: 34442578 PMCID: PMC8397942 DOI: 10.3390/mi12080956] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 07/10/2021] [Revised: 08/01/2021] [Accepted: 08/10/2021] [Indexed: 11/16/2022]
Abstract
Quartz glass is a typical optical material. In this research, colloidal silica (SiO2) and colloidal cerium oxide (CeO2) are used as abrasive grains to polish quartz glass in the shear thickening polishing (STP) process. The STP method employs the shear-thickening mechanism of non-Newtonian power-law fluid to achieve high-efficiency and high-quality polishing. The different performance in material removal and surface roughness between SiO2 and CeO2 slurries was analyzed. The influence of the main factors including polishing speed, abrasive concentration, and pH value on the MRR, workpiece surface roughness, and the surface topography was discussed. Two different slurries can both achieve fine quartz surface in shear thickening polishing with the polishing speed 100 rpm, and pH value 8. The quartz glass surface roughness Ra decreases from 120 ± 10 to 2.3 nm in 14 minutes' polishing with 8 wt% 80 nm SiO2 slurry, and the MRR reaches 121.6 nm/min. The quartz glass surface roughness Ra decreases from 120 ± 10 to 2.1 nm in 12 minutes polishing by 6 wt% 100 nm CeO2 slurry and the MRR reaches 126.2 nm/min.
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Affiliation(s)
- Qi Shao
- College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China; (Q.S.); (S.D.); (L.F.); (P.Z.); (J.Y.)
- Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China
| | - Shixiang Duan
- College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China; (Q.S.); (S.D.); (L.F.); (P.Z.); (J.Y.)
- Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China
| | - Lin Fu
- College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China; (Q.S.); (S.D.); (L.F.); (P.Z.); (J.Y.)
- Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China
| | - Binghai Lyu
- College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China; (Q.S.); (S.D.); (L.F.); (P.Z.); (J.Y.)
- Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China
- Correspondence:
| | - Ping Zhao
- College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China; (Q.S.); (S.D.); (L.F.); (P.Z.); (J.Y.)
- Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China
| | - Julong Yuan
- College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China; (Q.S.); (S.D.); (L.F.); (P.Z.); (J.Y.)
- Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Zhejiang University of Technology, Hangzhou 310014, China
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Mosavat M, Rahimi A. Simulation and experimental study on the effect of abrasive size, rotational speed, and machining gap during ultra-precision polishing of monocrystalline silicon. Colloids Surf A Physicochem Eng Asp 2019. [DOI: 10.1016/j.colsurfa.2019.05.005] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
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