Mechanism and elimination of bending effect in femtosecond laser deep-hole drilling

A Review of Femtosecond Laser Processing of Silicon Carbide

Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and modification, making them ideal for SiC processing. In this review, we aim to provide an overview of the process properties, progress, and applications by discussing the various methodologies involved in femtosecond laser processing of SiC. These methodologies encompass direct processing, composite processing, modification of the processing environment, beam shaping, etc. In addition, we have explored the myriad applications that arise from applying femtosecond laser processing to SiC. Furthermore, we highlight recent advancements, challenges, and future prospects in the field. This review provides as an important direction for exploring the progress of femtosecond laser micro/nano processing, in order to discuss the diversity of processes used for manufacturing SiC devices.

Femtosecond Laser Engraving of Deep Patterns in Steel and Sapphire

Femtosecond laser engraving offers appealing advantages compared to regular laser engraving such as higher precision and versatility. In particular, the inscription of deep patterns exhibits an increasing interest in industry. In this work, an optimization protocol based on constraining overlap ratio and scan number is demonstrated. The proposed method allows changing overlap ratio while maintaining depth in the same range, which reduces the sampling number. This study WAS applied to stainless steel 316 L and sapphire for engravings deeper than 100 μm. Results exhibit overall depths higher than threshold values and allowed to determine optimized engraving quality, for instance, roughness in steel can be reduced while maintaining depth and taper angle by reducing overlap ratio. The optimized laser parameters such as roughness and taper angle factors for sapphire were also found to be as follows: 200 kHz, 86% overlap and 12 J/cm2. As a demonstration, a logo engraving is illustrated at the end.

Experimental investigation of femtosecond laser through-hole drilling of stainless steel with and without transverse magnetic assistance

An experimental investigation of femtosecond laser through-hole drilling of stainless-steel 304 with and without transverse magnetic assistance was conducted. The characteristics of the through-hole geometry and sidewall as well as the chemical composition of the through-hole sidewall surface were analyzed. In addition, a theoretical analysis of magnetic-field-assisted femtosecond laser through-hole drilling is proposed. The results showed that transverse magnetic assistance could improve both the femtosecond laser through-hole drilling quality (through-hole geometry and sidewall characteristics) and efficiency. The primary reason is that transverse magnetic assistance changes the distribution of plasma and reduces the plasma density, which weakens the shielding effect of the plasma. However, compared with nanosecond laser drilling, the effect of the magnetic field on the femtosecond laser through-hole drilling was not obvious. A noticeable thermal effect appeared near the through-hole entrance at a pulse repetition rate of 500 kHz, and a heat affected zone and oxidation zone were produced, which is disadvantageous to laser drilling. This research has good prospects for industrial applications.

Influence of ambient gases on plasma dynamics of ultrafast laser-induced filamentation in sapphires

The atmospheric influence on picosecond laser-induced filamentation in sapphires was investigated under Ar, N₂ and O₂ conditions provided by a coaxial nozzle. The spatial and temporal evolution of the whole plasma was analyzed on a nanosecond time scale by a time-resolved intensified charge-coupled device (ICCD). The regulation of the filamentation in sapphires by the atmosphere can be attributed to the modulation of the laser energy by surface ablation plasma. The thermal conductivity of the ambient gas is found to be the key factor affecting the surface plasma through a physical model. Ambient gas with higher thermal conductivity can effectively reduce the surface plasma temperature and expansion volume due to higher heat exchange efficiency. It is helpful for reducing the scattering and absorption of the laser energy. Therefore, the longest filamentary track and plasma lifetime were obtained in O₂, which has higher thermal conductivity than Ar and N₂. It is essential to understand the influence mechanism of ambient gas on filamentation, especially by providing a reliable method to regulate the filamentation induced in solid media.

Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses

Holes through silicon substrates are used in silicon microsystems, for example in vertical electrical interconnects. In comparison to deep reactive ion etching, laser drilling is a versatile method for forming these holes, but laser drilling suffers from poor hole quality. In this article, water is used in the silicon drilling process to remove debris and the shape deformations of the holes. Water is introduced into the drilling process through the backside of the substrate to minimize negative effects to the drilling process. Drilling of inclined holes is also demonstrated. The inclined holes could find applications in radio frequency devices.

Non-diffraction-length, tunable, Bessel-like beams generation by spatially shaping a femtosecond laser beam for high-aspect-ratio micro-hole drilling

Bessel beams are advantageous in high aspect-ratio microhole drilling because of their immunity to diffraction. However, conventional methods of generating Bessel beams result in poor adjustability of the nondiffraction length. In this study, we theoretically describe and experimentally demonstrate the generation of Bessel-like beams (BLBs) with an adjustable nondiffraction length by using a phase-only spatial light modulator. In this method, nondiffraction lengths varying from 10 to 35 mm can be achieved by changing the designed phase profile (curvature). High-quality, high aspect ratio (560:1) and length-adjustable microholes can be drilled by spatially shaping a femtosecond laser beam.

Electrons dynamics control by shaping femtosecond laser pulses in micro/nanofabrication: modeling, method, measurement and application

During femtosecond laser fabrication, photons are mainly absorbed by electrons, and the subsequent energy transfer from electrons to ions is of picosecond order. Hence, lattice motion is negligible within the femtosecond pulse duration, whereas femtosecond photon-electron interactions dominate the entire fabrication process. Therefore, femtosecond laser fabrication must be improved by controlling localized transient electron dynamics, which poses a challenge for measuring and controlling at the electron level during fabrication processes. Pump-probe spectroscopy presents a viable solution, which can be used to observe electron dynamics during a chemical reaction. In fact, femtosecond pulse durations are shorter than many physical/chemical characteristic times, which permits manipulating, adjusting, or interfering with electron dynamics. Hence, we proposed to control localized transient electron dynamics by temporally or spatially shaping femtosecond pulses, and further to modify localized transient materials properties, and then to adjust material phase change, and eventually to implement a novel fabrication method. This review covers our progresses over the past decade regarding electrons dynamics control (EDC) by shaping femtosecond laser pulses in micro/nanomanufacturing: (1) Theoretical models were developed to prove EDC feasibility and reveal its mechanisms; (2) on the basis of the theoretical predictions, many experiments are conducted to validate our EDC-based femtosecond laser fabrication method. Seven examples are reported, which proves that the proposed method can significantly improve fabrication precision, quality, throughput and repeatability and effectively control micro/nanoscale structures; (3) a multiscale measurement system was proposed and developed to study the fundamentals of EDC from the femtosecond scale to the nanosecond scale and to the millisecond scale; and (4) As an example of practical applications, our method was employed to fabricate some key structures in one of the 16 Chinese National S&T Major Projects, for which electron dynamics were measured using our multiscale measurement system.