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Wang X, Han Y, Fei H, Lin H, Zhang M, Liu X, Cao B, Yang Y, Chen Z, Xiao L. Design of wavelength division multiplexing devices based on tunable edge states of valley photonic crystals. OPTICS EXPRESS 2023; 31:13933-13942. [PMID: 37157268 DOI: 10.1364/oe.484575] [Citation(s) in RCA: 3] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/10/2023]
Abstract
Wavelength division multiplexing (WDM) devices are key photonic integrated circuit (PIC) elements. Conventional WDM devices based on silicon waveguides and photonic crystals have limited transmittance due to the high loss introduced by the strong backward scattering from defects. In addition, it is challenging to reduce the footprint of those devices. Here we theoretically demonstrate a WDM device in the telecommunication range based on all-dielectric silicon topological valley photonic crystal (VPC) structures. We tune its effective refractive index by tuning the physical parameters of the lattice in the silicon substrate, which can continuously tune the operating wavelength range of the topological edge states, which allows the designing of WDM devices with different channels. The WDM device has two channels (1475 nm-1530 nm and 1583 nm-1637 nm), with contrast ratios of 29.6 dB and 35.3 dB, respectively. We demonstrated highly efficient devices for multiplexing and demultiplexing in a WDM system. The principle of manipulating the working bandwidth of the topological edge states can be generally applied in designing different integratable photonic devices. Thus, it will find broad applications.
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Tan M, Xu J, Liu S, Feng J, Zhang H, Yao C, Chen S, Guo H, Han G, Wen Z, Chen B, He Y, Zheng X, Ming D, Tu Y, Fu Q, Qi N, Li D, Geng L, Wen S, Yang F, He H, Liu F, Xue H, Wang Y, Qiu C, Mi G, Li Y, Chang T, Lai M, Zhang L, Hao Q, Qin M. Co-packaged optics (CPO): status, challenges, and solutions. FRONTIERS OF OPTOELECTRONICS 2023; 16:1. [PMID: 36939942 PMCID: PMC10027985 DOI: 10.1007/s12200-022-00055-y] [Citation(s) in RCA: 3] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 06/09/2022] [Accepted: 08/22/2022] [Indexed: 06/18/2023]
Abstract
Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.
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Affiliation(s)
- Min Tan
- School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China.
- Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, 430074, China.
| | - Jiang Xu
- Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China.
- HKUST Fok Ying Tung Research Institute, Guangzhou, 511462, China.
- The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511462, China.
| | - Siyang Liu
- Chongqing United Micro-Electronics Center (CUMEC), Chongqing, 401332, China
| | - Junbo Feng
- Chongqing United Micro-Electronics Center (CUMEC), Chongqing, 401332, China.
| | - Hua Zhang
- Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, 266000, China.
| | - Chaonan Yao
- Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, 266000, China
| | - Shixi Chen
- Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
| | - Hangyu Guo
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Gengshi Han
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Zhanhao Wen
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Bao Chen
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Yu He
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Xuqiang Zheng
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
| | - Da Ming
- School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Yaowen Tu
- School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Qiang Fu
- School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Nan Qi
- State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China
| | - Dan Li
- School of Microelectronics, Xi'an Jiaotong University, Xi'an, 710049, China.
| | - Li Geng
- School of Microelectronics, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Song Wen
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Fenghe Yang
- Zhangjiang Laboratory, Shanghai, 201210, China
| | - Huimin He
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Fengman Liu
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
| | - Haiyun Xue
- Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
| | - Yuhang Wang
- School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Ciyuan Qiu
- The State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
| | - Guangcan Mi
- Huawei Technologies Co., Ltd., Shenzhen, 440307, China
| | - Yanbo Li
- Huawei Technologies Co., Ltd., Shenzhen, 440307, China
| | - Tianhai Chang
- Huawei Technologies Co., Ltd., Shenzhen, 440307, China.
| | - Mingche Lai
- College of Computer, National University of Defense Technology, Changsha, 410073, China
| | - Luo Zhang
- College of Computer, National University of Defense Technology, Changsha, 410073, China.
| | - Qinfen Hao
- Institute of Computing Technology, Chinese Academy of Sciences, Beijing, 100086, China.
| | - Mengyuan Qin
- Institute of Computing Technology, Chinese Academy of Sciences, Beijing, 100086, China
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Huang Z, Tian Y, Liu Y, Luo H, Long X, Yu C. Optical performance monitoring using SOI-based spectral analysis. OPTICS EXPRESS 2022; 30:6397-6412. [PMID: 35209579 DOI: 10.1364/oe.451269] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/16/2021] [Accepted: 02/03/2022] [Indexed: 06/14/2023]
Abstract
A novel optical performance monitoring (OPM) method based on Fourier transform spectrum analysis (FTSA) is designed for optical signal-to-noise ratio (OSNR) monitoring, modulation format and baud rate recognition in the presence of fiber nonlinearities. The interference intensities, which reflect spectral features of signals, are obtained by exploiting the FTSA consisting of two-stage Mach-Zehnder interferometer (MZI) arrays. Then, the mapping between the OPM parameters and modulated interference intensity (MII) is characterized using neural networks without prior knowledge of the configuration of the communication network. Results show that optical performance parameters are monitored simultaneously. Meanwhile, the accuracy of modulation format and baud rate recognition is 94.8% and most (over 86%) OSNR monitoring errors are less than ±1 dB under complex transmission conditions in presence of frequency offset and delay jitter. Besides, the FTSA can be fabricated on a silicon on insulator (SOI) platform with a large fabrication tolerance, and it has broad working bandwidth to support the full optical communication band. Therefore, the proposed OPM method is capable of integration and miniaturization, which can be ubiquitously applied in network intermediate nodes to support the construction of smart optical networks.
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