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Citation(s) in RCA

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For: Laakso MJO, Pagliano S, Shah U, Mårtensson GE, Stemme G, Niklaus F. Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses. Opt Express 2020;28:1394-1407. [PMID: 32121851 DOI: 10.1364/oe.377256] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/06/2019] [Accepted: 12/25/2019] [Indexed: 06/10/2023]
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1
Xiong S, Wang R, Tao H. Ultrafast laser micromachining the ultra-low expansion glass-ceramic: Optimization of processing parameters and physical mechanism. Ann Ital Chir 2021. [DOI: 10.1016/j.jeurceramsoc.2021.05.018] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
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