Investigation on reliability of red micro-light emitting diodes with atomic layer deposition passivation layers

Performance comparison of flip-chip blue-light microLEDs with various passivation

In this study, arrays of μLEDs in four different sizes (5 × 5 μm2, 10 × 10 μm2, 25 × 25 μm2, 50 × 50 μm2) were fabricated using a flip-chip bonding process. Two passivation processes were investigated with one involving a single layer of SiO2 deposited using plasma-enhanced chemical vapor deposition (PECVD) and the other incorporating Al2O3 deposited by atomic layer deposition (ALD) beneath the SiO2 layer. Owing to superior coverage and protection, the double-layers passivation process resulted in a three-order lower leakage current of μLEDs in the 5 μm chip-sized μLED arrays. Furthermore, higher light output power of μLEDs was observed in each chip-sized μLED array with double layers passivation. Particularly, the highest EQE value 21.9% of μLEDs array with 5 μm × 5 μm chip size was achieved with the double-layers passivation. The EQE value of μLEDs array was improved by 4.4 times by introducing the double-layers passivation as compared with that of μLEDs array with single layer passivation. Finally, more uniform light emission patterns were observed in the μLEDs with 5 μm × 5 μm chip size fabricated by double-layer passivation process using ImageJ software.

Study on different isolation technology on the performance of blue micro-LEDs array applications

In this study, a 3 × 3 blue micro-LED array with a pixel size of 10 × 10 μm2 and a pitch of 15 μm was fabricated on an epilayer grown on a sapphire substrate using metalorganic chemical vapor deposition technology. The fabrication process involved photolithography, wet and dry etching, E-beam evaporation, and ion implantation technology. Arsenic multi-energy implantation was utilized to replace the mesa etching for electrical isolation, where the implantation depth increased with the average energy. Different ion depth profiles had varying effects on electrical properties, such as forward current and leakage currents, potentially causing damage to the n-GaN layer and increasing the series resistance of the LEDs. As the implantation depth increased, the light output power and peak external quantum efficiency of the LEDs also increased, improving from 5.33 to 9.82%. However, the efficiency droop also increased from 46.3 to 48.6%.

III-nitride m-plane violet narrow ridge edge-emitting laser diodes with sidewall passivation using atomic layer deposition

A novel deep-ridge laser structure with atomic-layer deposition (ALD) sidewall passivation was proposed that enhances the optical characteristics of 8-µm ridge width III-nitride violet lasers on freestanding m-plane GaN substrates. The internal loss was determined using the variable stripe length method, where the laser structure with ALD sidewall passivation showed lower internal loss compared to the conventional shallow-ridge laser design. ALD sidewall passivation plays a critical role in device improvements; compared to the lasers without ALD sidewall passivation, the lasers with ALD sidewall passivation yield improved optoelectrical performance and longer lifetime under continuous-wave operation at high current density. This work demonstrates the importance of ALD sidewall passivation to laser performance, which enables high energy efficiency.

Investigations on the high performance of InGaN red micro-LEDs with single quantum well for visible light communication applications

In this study, we have demonstrated the potential of InGaN-based red micro-LEDs with single quantum well (SQW) structure for visible light communication applications. Our findings indicate the SQW sample has a better crystal quality, with high-purity emission, a narrower full width at half maximum, and higher internal quantum efficiency, compared to InGaN red micro-LED with a double quantum wells (DQWs) structure. The InGaN red micro-LED with SQW structure exhibits a higher maximum external quantum efficiency of 5.95% and experiences less blueshift as the current density increases when compared to the DQWs device. Furthermore, the SQW device has a superior modulation bandwidth of 424 MHz with a data transmission rate of 800 Mbit/s at an injection current density of 2000 A/cm². These results demonstrate that InGaN-based SQW red micro-LEDs hold great promise for realizing full-color micro-display and visible light communication applications.

High uniformity red µ-LED array with a current efficiency of 2.6 cd/A and ns-level response time

This paper demonstrates an AlGaInP-based 620-nm red micro-light-emitting-diode (µ-LED) array and studies the enhancement effect of the surface treatments using (NH₄)₂Sx solutions by comparing the characteristics of µ-LED arrays with and without the (NH₄)₂Sx treatment. Furthermore, our µ-LED array demonstrates a measurement of the current efficiency (2.6 cd/A), which improves the light output uniformity. Also, we apply a setup for measuring the response time at the fast ns-level to analyze the effect of passivation in AlGaInP-based µ-LED arrays.

Structural and optical analyses for InGaN-based red micro-LED

This study presents a comprehensive analysis of the structural and optical properties of an InGaN-based red micro-LED with a high density of V-shaped pits, offering insights for enhancing emission efficiency. The presence of V-shaped pits is considered advantageous in reducing non-radiative recombination. Furthermore, to systematically investigate the properties of localized states, we conducted temperature-dependent photoluminescence (PL). The results of PL measurements indicate that deep localization in the red double quantum wells can limit carrier escape and improve radiation efficiency. Through a detailed analysis of these results, we extensively investigated the direct impact of epitaxial growth on the efficiency of InGaN red micro-LEDs, thereby laying the foundation for improving efficiency in InGaN-based red micro-LEDs.

Recent Advances in Micro-LEDs Having Yellow-Green to Red Emission Wavelengths for Visible Light Communications

Visible light communication (VLC), which will primarily support high-speed internet connectivity in the contemporary world, has progressively come to be recognized as a significant alternative and reinforcement in the wireless communication area. VLC has become more popular recently because of its many advantages over conventional radio frequencies, including a higher transmission rate, high bandwidth, low power consumption, fewer health risks, and reduced interference. Due to its high-bandwidth characteristics and potential to be used for both illumination and communications, micro-light-emitting diodes (micro-LEDs) have drawn a lot of attention for their use in VLC applications. In this review, a detailed overview of micro-LEDs that have long emission wavelengths for VLC is presented, along with their related challenges and future prospects. The VLC performance of micro-LEDs is influenced by a number of factors, including the quantum-confined Stark effect (QCSE), size-dependent effect, and droop effect, which are discussed in the following sections. When these elements are combined, it has a major impact on the performance of micro-LEDs in terms of their modulation bandwidth, wavelength shift, full-width at half maximum (FWHM), light output power, and efficiency. The possible challenges faced in the use of micro-LEDs were analyzed through a simulation conducted using Crosslight Apsys software and the results were compared with the previous reported results. We also provide a brief overview of the phenomena, underlying theories, and potential possible solutions to these issues. Furthermore, we provide a brief discussion regarding micro-LEDs that have emission wavelengths ranging from yellow-green to red colors. We highlight the notable bandwidth enhancement for this paradigm and anticipate some exciting new research directions. Overall, this review paper provides a brief overview of the performance of VLC-based systems based on micro-LEDs and some of their possible applications.

Increase in the efficiency of III-nitride micro LEDs by atomic layer deposition

The effect of atomic-layer deposition (ALD) sidewall passivation on the enhancement of the electrical and optical efficiency of micro-light-emitting diode (µ-LED) is investigated. Various blue light µ-LED devices (from 5 × 5 µm² to 100 × 100 µm²) with ALD-Al₂O₃ sidewall passivation were fabricated and exhibited lower leakage and better external quantum efficiency (EQE) comparing to samples without ALD-Al₂O₃ sidewall treatment. Furthermore, the EQE values of 5 × 5 and 10 × 10 µm² devices yielded an enhancement of 73.47% and 66.72% after ALD-Al₂O₃ sidewall treatments process, and the output power also boosted up 69.3% and 69.9%. The Shockley-Read-Hall recombination coefficient can be extracted by EQE data fitting, and the recombination reduction in the ALD samples can be observed. The extracted surface recombination velocities are 551.3 and 1026 cm/s for ALD and no-ALD samples, respectively.

Understanding the Sidewall Passivation Effects in AlGaInP/GaInP Micro-LED

The passivation effects of sulfur treatment and Al₂O₃ passivation for AlGaInP/GaInP red micro-light-emitting-diodes (LEDs) were investigated in terms of the external quantum efficiency (EQE) and the current density showing the peak EQE (J_{EQE, peak}). We systematically compared the electrical and optical characteristics of the micro-LEDs with and without passivation according to various sizes. Interestingly, our investigation indicated that simple electrical characteristics such as current density-voltage property are difficult to precisely reflect the minor change in electrical properties due to passivation when the device has the inherently low leakage current. Whereas the EQE was enhanced by 20% and J_{EQE, peak} was largely shifted to a lower current density region at the LED with a size of 15 × 15 μm². To examine the passivation effects, we carefully analyzed the EQE and J_{EQE, peak} with the ABC recombination model, and established the methodology to investigate the influence of a sidewall in micro-LEDs. As a result, we extracted the surface recombination velocity regarding the surface passivation, showing a nearly 14% reduction with the passivation.

On the mechanism of carrier recombination in downsized blue micro-LEDs

The mechanism of carrier recombination in downsized μ-LED chips from 100 × 100 to 10 × 10 μm² on emission performance was systemically investigated. All photolithography processes for defining the μ-LED pattern were achieved by using a laser direct writing technique. This maskless technology achieved the glass-mask-free process, which not only can improve the exposure accuracy but also save the development time. The multi-functional SiO₂ film as a passivation layer successfully reduced the leakage current density of μ-LED chips compared with the μ-LED chips without passivation layer. As decreasing the chip size to 10 × 10 μm², the smallest chip size exhibited the highest ideality factor, which indicated the main carrier recombination at the high-defect-density zone in μ-LED chip leading to the decreased emission performance. The blue-shift phenomenon in the electroluminescence spectrum with decreasing the μ-LED chip size was due to the carrier screening effect and the band filling effect. The 10 × 10 μm² μ-LED chip exhibited high EQE values in the high current density region with a less efficiency droop, and the max-EQE value was 18.8%. The luminance of 96 × 48 μ-LED array with the chip size of 20 × 20 μm² exhibited a high value of 516 nits at the voltage of 3 V.

Advanced Atomic Layer Deposition Technologies for Micro-LEDs and VCSELs

In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step coverage, the characteristics of atomic layer deposition ALD technology are used to solve this problem. ALD utilizes self-limiting interactions between the precursor gas and the substrate surface. When the reactive gas forms a single layer of chemical adsorbed on the substrate surface, no reaction occurs between them and the growth thickness can be controlled. At the Å level, it can provide good step coverage. In this study, recent research on the ALD passivation on micro-light-emitting diodes and vertical cavity surface emitting lasers was reviewed and compared. Several passivation methods were demonstrated to lead to enhanced light efficiency, reduced leakage, and improved reliability.