Enhanced ablation efficiency using GHz bursts in micromachining fused silica

In-Volume Glass Modification Using a Femtosecond Laser: Comparison Between Repetitive Single-Pulse, MHz Burst, and GHz Burst Regimes

In this study, we report, for the first time, to the best of our knowledge, on in-volume glass modifications produced by GHz bursts of femtosecond pulses. We compare three distinct methods of energy deposition in glass, i.e., the single-pulse, MHz burst, and GHz burst regimes, and evaluate the resulting modifications. Specifically, we investigate in-volume modifications produced by each regime under varying parameters such as the pulse/burst energy, the scanning velocity, and the number of pulses in the burst, with the aim of establishing welding process windows for both sodalime and fused silica.

Bessel Beam Femtosecond Laser Interaction with Fused Silica Before and After Chemical Etching: Comparison of Single Pulse, MHz-Burst, and GHz-Burst

We investigate the elongated modifications resulting from a Bessel beam-shaped femtosecond laser in fused silica under three different operation modes, i.e., the single-pulse, MHz-burst, and GHz-burst regimes. The single-pulse and MHz-burst regimes show rather similar behavior in glass, featuring elongated and slightly tapered modifications. Subsequent etching with Potassium Hydroxide exhibits an etching rate and selectivity of up to 606 μm/h and 2103:1 in single-pulse operation and up to 322 μm/h and 2230:1 in the MHz-burst regime, respectively. Interestingly, in the GHz-burst mode, modification by a single burst of 50 pulses forms a taper-free hole without any etching. This constitutes a significant result paving the way for chemical-free, on-the-fly drilling of high aspect-ratio holes in glass.

Ultrafast laser bursts welding glass and metal with solder paste to create an ultra-large molten pool

A novel, to our knowledge, method is proposed for the welding of glass and metal with a large gap filled with solder paste using ultrafast laser bursts. The addition of solder paste enables a reliable glass-metal connection even at gaps of hundreds of microns, while the position of the glass can be flexibly adjusted. By ultrafast laser bursts, the volume of the molten pool increases significantly, and the height of the molten pool reaches approximately 350 µm, which is more than an order of magnitude higher than that of conventional ultrafast lasers (10-20 µm). Cross-sectional analysis of the welded region shows that extensive material mixing and element diffusion occur, and stable connections are achieved at multiple interfaces. An analysis of the interaction between the ultrafast laser bursts and the material, as well as the mixing of multiple materials during the welding process, leads to a clear welding mechanism.

Supercontinuum generation in bulk solid-state material with bursts of femtosecond laser pulses

We report on experimental and numerical investigation of burst-mode supercontinuum generation in sapphire crystal. The experiments were performed using bursts consisting of two 190 fs, 1030 nm pulses with intra-burst repetition rates of 62.5 MHz and 2.5 GHz from an amplified 1 MHz Yb:KGW laser and revealed higher filamentation and supercontinuum generation threshold for the second pulse in the burst, which increases with the increase of intra-burst repetition rate. The experimental results were quantitatively reproduced numerically, using a developed model, which accounted for altered material response due to residual excitations remaining after propagation of the first pulse. The simulation results unveiled that residual free electron plasma and self-trapped excitons contribute to elevated densities of free electron plasma generated by the second pulse in the burst and so stronger plasma defocusing, significantly affecting its nonlinear propagation dynamics. The presented results identify the fundamental and practical issues for supercontinuum generation in solid-state materials using femtosecond pulse bursts with very high intra-burst repetition rates, which may also apply to the case of single pulses at very high repetition rate, where residual material excitations become relevant and should be accounted for.

Laser processing of silicon with GHz burst pumped third harmonics for precise microfabrication

Femtosecond laser processing has proved to be a valuable tool for various microfabrication applications. In order to further increase the quality and efficiency of femtosecond laser processing, processing with GHz burst mode lasers has gained attention in recent years, where packets of high-repetition rate pulses are used instead of single pulses at the fundamental repetition rate. However, the use of burst-pulses has mainly been limited to the fundamental wavelength of powerful regenerative amplifier systems, often near 1 micrometer wavelength. In this study, we explore the characteristics and potential benefits of further wavelength conversion of burst-pulses emitted at the near-infrared to the ultraviolet region via direct third-harmonic generation. We construct an in-line process evaluation setup with a chromatic confocal sensor, and evaluate the ablation characteristics of the burst-pumped and non-burst processing of silicon. We observe that burst-mode processing has significantly reduced surface roughness and debris, resulting in high-quality laser processing. To demonstrate the utility of such burst-pumped UV processing, we show the successful milling of a spherical structure enabled by in-line surface profile feedback, while similar processing with non-burst conditions did not work. We believe such results show the strong potential of burst laser sources for use in accurate microfabrication of structures with micrometer-scale resolution.

Fundamental Considerations and Analysis of the Energy Distribution in Laser Turning with Ultrashort Laser Pulses

This article discusses the process of the laser turning of rotational symmetric, cylindrical components using ultrashort laser pulses with respect to the geometrical conditions and the resulting energy distribution during the laser turning process. As a result, process predictions and potential process optimizations are feasible. Particular attention is drawn to the laser spot formation on the cylindrical surface of the work piece in conjunction with the positioning of the laser beam relative to the rotation axis of the specimen. Based on fundamental calculations and experimental results, an optimum processing strategy is discussed, whereat the use of a trepanning optic in the laser turning process and the forming of a particular surface structure is additionally being issued.

Comparative Study of Percussion Drilling in Glasses with a Femtosecond Laser in Single Pulse, MHz-Burst, and GHz-Burst Regimes and Optimization of the Hole Aspect Ratio

In this contribution, we present a comparative study on top-down drilling in sodalime glass, with a femtosecond laser operating in single-pulse, MHz-burst and GHz-burst modes, respectively. We investigate the hole depth, drilling rate, and hole morphology for these three regimes while keeping the same experimental conditions. We demonstrate that, for both burst regimes, the burst length has to be adapted for optimizing the hole depth. In the GHz-burst regime, the lower the ablation rate the longer the holes. The three drilling regimes lead to different hole morphologies, where the GHz-burst mode results in the best hole quality featuring glossy inner walls and an almost cylindrical morphology. Furthermore, we obtain crack-free holes, the deepest measuring 3.7 mm in length and 25 µm in entrance diameter corresponding to an aspect ratio of 150, which is the highest aspect ratio reported thus far with femtosecond GHz-burst drilling to the best of our knowledge.

Bessel Beam Dielectrics Cutting with Femtosecond Laser in GHz-Burst Mode

We report, for the first time to the best of our knowledge, Bessel beam dielectrics cutting with a femtosecond laser in GHz-burst mode. The non-diffractive beam shaping is based on the use of an axicon and allows for cutting glasses up to 1 mm thickness with an excellent cutting quality. Moreover, we present a comparison of the cutting results with the state-of-the-art method, consisting of short MHz-bursts of femtosecond pulses. We further illustrate the influence of the laser beam parameters such as the burst energy and the pitch between consecutive Bessel beams on the machining quality of the cutting plane and provide process windows for both regimes.

Advances in Femtosecond Laser GHz-Burst Drilling of Glasses: Influence of Burst Shape and Duration

The femtosecond GHz-burst mode laser processing has attracted much attention in the last few years. Very recently, the first percussion drilling results obtained in glasses using this new regime were reported. In this study, we present our latest results on top-down drilling in glasses, focusing specifically on the influence of burst duration and shape on the hole drilling rate and the quality of the drilled holes, wherein holes of very high quality with a smooth and glossy inner surface can be obtained. We show that a decreasing energy repartition of the pulses within the burst can increase the drilling rate, but the holes saturate at lower depths and present lower quality than holes drilled with an increasing or flat energy distribution. Moreover, we give an insight into the phenomena that may occur during drilling as a function of the burst shape.

30 W-average-power femtosecond NIR laser operating in a flexible GHz-burst-regime

Laser sources which produce GHz bursts of ultrashort pulses attract a lot of attention by demonstrating superior performance in material processing. Flexibility of the laser source in a selection of parameters for custom application is highly preferable. In this work, we demonstrate a very versatile method for burst formation using the active fiber loop (AFL). It allows forming GHz bursts containing from 2 up to approximately 2200 pulses in a burst (1000 ns burst width) with identical pulse separation and any predefined intra-burst pulse repetition rate (PRR). The burst pre-shaping by the amplification conditions in the AFL and by the modulation of transmission of the acousto-optic modulator was demonstrated. Industrial-grade ultrafast laser system was able to operate in the single-pulse and GHz-burst regimes. The laser system delivered high-quality 368 fs duration (FWHM) pulses of 15.3 µJ pulse energy and 30.6 W average output power at 2 MHz PRR in the single-pulse regime. In the GHz-burst operation regime, bursts of 2.2 GHz intra-burst repetition rate were formed and amplified to more than 30 W average output power with a burst energy up to 135 µJ at a burst repetition rate of 200 kHz. The sub-picosecond duration of pulses was obtained in the GHz-burst regime at different burst widths.

Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials

We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser pulse durations in the pico- and femtosecond regime, laser pulse repetition rates up to 400 kHz and laser fluences up to 11.5 J/cm2 are applied to optimize the quality of microvias, as being evaluated by the generated taper, the extension of glass fiber protrusions and damage of inner lying copper layers using materialography. The results are discussed in terms of the ablation threshold for FR-4 and copper, heat accumulation and pulse shielding effects as a result of pulse to pulse interactions. As a specific result, using a laser pulse duration of 2 ps appears beneficial, resulting in small glass fiber protrusions and high precision in the stopping process at inner copper layer. If laser pulse repetition rates larger than 100 kHz are applied, we find that the processing quality can be increased by heat accumulation effects.

Percussion drilling in glasses and process dynamics with femtosecond laser GHz-bursts

We report for the first time to our knowledge on top-down percussion drilling of high-quality deep holes in different glasses with femtosecond laser pulses in GHz-burst mode. We reveal the dynamics of the percussion drilling process by pump-probe shadowgraphy and thermal camera imaging demonstrating that the drilling process in GHz-burst mode is fundamentally different from single-pulse processing and confirming the presence of thermal accumulation. Moreover, we show a comparison to drilling by femtosecond single-pulses containing an equal laser fluence in sodalime, alkali-free alumina-borosilicate, fused silica, and sapphire.

High-power nonlinear amplification of an ultrafast electro-optic frequency comb with flexible GHz repetition rate

We report on an all-fiber 200 W widely tunable GHz electro-optic (EO) frequency comb operating in the nonlinear regime. The EO comb pulses at 1030 nm are initially pre-compressed to sub-2 ps, then power amplified to 2.5 W, and finally boosted to 200 W in a newly designed large-mode-area, Yb-doped photonic crystal fiber. Continuously tunable across 12-18 GHz, the picosecond pulses experience nonlinear propagation in the last amplifier, leading to output pulses compressible down to several hundreds of femtoseconds. To push our system deeper into nonlinear amplification regime, the pulse repetition rate is further reduced to 2 GHz, enabling significant spectral broadening at 200 W. Characterization reveals sub-200 fs duration after compression. The present EO-comb seeded nonlinear amplification system opens a new route to the development of high-power, tunable GHz-repetition-rate, femtosecond fiber lasers.

Ultrashort pulsed laser backside ablation of fused silica

We report on the fabrication of rectangular microchannels with vertical sidewalls in fused silica by laser backside ablation. A 515 nm femtosecond laser is focused by an objective with a NA of 0.5 through the sample on the glass/air interface, allowing processing from the backside into the bulk material. Experimental investigations reveal a logarithmically increasing depth of the channels with an increasing number of scans, while keeping the focal position fixed. A certain number of scans has to be applied to generate rectangular shaped channels while their depth can be controlled by the applied fluence from 2.64 µm to 13.46 µm and a corresponding ablation roughness R_a between 0.20 µm and 0.33 µm. The channel width can be set directly via the number of parallel ablated lines demonstrated in a range from 10 µm to 50 µm. By adjusting the focal position after each scan the channel depth can be extended to 49.77 µm while maintaining a rectangular channel geometry. Finally, concentric rings are ablated to demonstrate the flexibility of the direct writing process.

Electro-optic comb pumped optical parametric oscillator with flexible repetition rate at GHz level

We present a gigahertz (GHz)-repetition-rate optical parametric oscillator (OPO) pumped by an electro-optic comb at 1.03 µm, delivering sub-picosecond signal pulses across 1.5-1.7 µm from a MgO-doped periodically poled LiNbO₃ crystal. Using a pump power of 5 W at 14.2 GHz repetition rate, 378 mW of signal power is obtained at 1.52 µm from a subharmonic cavity, corresponding to a signal extraction efficiency of 7.6%. By cascading a Mach-Zehnder modulator, the pump pulse repetition rate can be divided by any integer number from one to 14, allowing the OPO to operate with a flexible repetition rate from 1 to 14.2 GHz. A strategy leading to quasi-continuous repetition rate tunability of the OPO is also discussed.