Modeling and experimental performance analysis of a novel heating system and its application to glass hot embossing technology

Modeling and Experiments on Temperature and Electrical Conductivity Characteristics in High-Temperature Heating of Carbide-Bonded Graphene Coating on Silicon

A novel non-isothermal glass hot embossing system utilizes a silicon mold core coated with a three-dimensional carbide-bonded graphene (CBG) coating, which acts as a thin-film resistance heater. The temperature of the system significantly influences the electrical conductivity properties of silicon with a CBG coating. Through simulations and experiments, it has been established that the electrical conductivity of silicon with a CBG coating gradually increases at lower temperatures and rapidly rises as the temperature further increases. The CBG coating predominantly affects electrical conductivity until 400 °C, after which silicon becomes the dominant factor. Furthermore, the dimensions of CBG-coated silicon and the reduction of CBG coating also affect the rate and outcome of conductivity changes. These findings provide valuable insights for detecting CBG-coated silicon during the embossing process, improving efficiency, and predicting the mold core's service life, thus enhancing the accuracy of optical lens production.

Microfluidic Organ-on-A-chip: A Guide to Biomaterial Choice and Fabrication

Organ-on-A-chip (OoAC) devices are miniaturized, functional, in vitro constructs that aim to recapitulate the in vivo physiology of an organ using different cell types and extracellular matrix, while maintaining the chemical and mechanical properties of the surrounding microenvironments. From an end-point perspective, the success of a microfluidic OoAC relies mainly on the type of biomaterial and the fabrication strategy employed. Certain biomaterials, such as PDMS (polydimethylsiloxane), are preferred over others due to their ease of fabrication and proven success in modelling complex organ systems. However, the inherent nature of human microtissues to respond differently to surrounding stimulations has led to the combination of biomaterials ranging from simple PDMS chips to 3D-printed polymers coated with natural and synthetic materials, including hydrogels. In addition, recent advances in 3D printing and bioprinting techniques have led to the powerful combination of utilizing these materials to develop microfluidic OoAC devices. In this narrative review, we evaluate the different materials used to fabricate microfluidic OoAC devices while outlining their pros and cons in different organ systems. A note on combining the advances made in additive manufacturing (AM) techniques for the microfabrication of these complex systems is also discussed.

A Comprehensive Review of Micro/Nano Precision Glass Molding Molds and Their Fabrication Methods

Micro/nano-precision glass molding (MNPGM) is an efficient approach for manufacturing micro/nanostructured glass components with intricate geometry and a high-quality optical finish. In MNPGM, the mold, which directly imprints the desired pattern on the glass substrate, is a key component. To date, a wide variety of mold inserts have been utilized in MNPGM. The aim of this article is to review the latest advances in molds for MNPGM and their fabrication methods. Surface finishing is specifically addressed because molded glass is usually intended for optical applications in which the surface roughness should be lower than the wavelength of incident light to avoid scattering loss. The use of molds for a wide range of molding temperatures is also discussed in detail. Finally, a series of tables summarizing the mold fabrication methods, mold patterns and their dimensions, anti-adhesion coatings, molding conditions, molding methods, surface roughness values, glass substrates and their glass transition temperatures, and associated applications are presented. This review is intended as a roadmap for those interested in the glass molding field.

Evaluation of Warpage and Residual Stress of Precision Glass Micro-Optics Heated by Carbide-Bonded Graphene Coating in Hot Embossing Process

A newly developed hot embossing technique which uses the localized rapid heating of a thin carbide-bonded graphene (CBG) coating, greatly reduces the energy consumption and promotes the fabrication efficiency. However, because of the non-isothermal heat transfer process, significant geometric deviation and residual stress could be introduced. In this paper, we successfully facilitate the CBG-heating-based hot embossing into the fabrication of microlens array on inorganic glass N-BK7 substrate, where the forming temperature is as high as 800 °C. The embossed microlens array has high replication fidelity, but an obvious geometric warpage along the glass substrate also arises. Thermo-mechanical coupled finite element modelling of the embossing process is conducted and verified by the experimental results. Based on trial and error simulations, an appropriate compensation curvature is determined and adopted to modify the geometrical design of the silicon wafer mold. The warpage of the re-embossed microlens array is significantly decreased using the compensated mold, which demonstrates the feasibility of the simulation-oriented compensation scheme. Our work would contribute to improving the quality of optics embossed by this innovative CBG-heating-based hot embossing technique.

Theoretical and Experimental Study on Hot-Embossing of Glass-Microprism Array without Online Cooling Process

Optical glass-microprism arrays are generally embossed at high temperatures, so an online cooling process is needed to remove thermal stress, but this make the cycle long and its equipment expensive. Therefore, the hot-embossing of a glass-microprism array at a low strain rate with reasonable embossing parameters was studied, aiming at reducing thermal stress and realizing its rapid microforming without online cooling process. First, the flow-field, strain-rate, and deformation behavior of glass microforming were simulated. Then, the low-cost microforming control device was designed, and the silicon carbide (SiC) die-core microgroove array was microground by the grinding-wheel microtip. Lastly, the effect of the process parameters on forming rate was studied. Results showed that the appropriate embossing parameters led to a low strain rate; then, the trapezoidal glass-microprism array could be formed without an online cooling process. The standard deviation of the theoretical and experimental forming rates was only 7%, and forming rate increased with increasing embossing temperature, embossing force, and holding duration, but cracks and adhesion occurred at a high embossing temperature and embossing force. The highest experimental forming rate reached 66.56% with embossing temperature of 630 °C, embossing force of 0.335 N, and holding duration of 12 min.