Anomalous plasmon hybridization in nanoantennas near interfaces

Reconfigurable terahertz metamaterials: From fundamental principles to advanced 6G applications

Terahertz (THz) electromagnetic spectrum ranging from 0.1THz to 10THz has become critical for sixth generation (6G) applications, such as high-speed communication, fingerprint chemical sensing, non-destructive biosensing, and bioimaging. However, the limited response of naturally existing materials THz waves has induced a gap in the electromagnetic spectrum, where a lack of THz functional devices using natural materials has occurred in this gap. Metamaterials, artificially composed structures that can engineer the electromagnetic properties to manipulate the waves, have enabled the development of many THz devices, known as "metadevices". Besides, the tunability of THz metadevices can be achieved by tunable structures using microelectromechanical system (MEMS) technologies, as well as tunable materials including phase change materials (PCMs), electro-optical materials (EOMs), and thermo-optical materials (TOMs). Leveraging various tuning mechanisms together with metamaterials, tremendous research works have demonstrated reconfigurable functional THz devices, playing an important role to fill the THz gap toward the 6G applications. This review introduces reconfigurable metadevices from fundamental principles of metamaterial resonant system to the design mechanisms of functional THz metamaterial devices and their related applications. Moreover, we provide perspectives on the future development of THz photonic devices for state-of-the-art applications.

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy

As one of the most effective surface-enhanced infrared absorption (SEIRA) techniques, metal-insulator-metal structured metamaterial perfect absorbers possess an ultrahigh sensitivity and selectivity in molecular infrared fingerprint detection. However, most of the localized electromagnetic fields (i.e., hotspots) are confined in the dielectric layer, hindering the interaction between analytes and hotspots. By replacing the dielectric layer with the nanofluidic channel, we develop a sapphire (Al₂O₃)-based mid-infrared (MIR) hybrid nanofluidic-SEIRA (HN-SEIRA) platform for liquid sensors with the aid of a low-temperature interfacial heterogeneous sapphire wafer direct bonding technique. The robust atomic bonding interface is confirmed by transmission electron microscope observation. We also establish a design methodology for the HN-SEIRA sensor using coupled-mode theory to carry out the loss engineering and experimentally validate its feasibility through the accurate nanogap control. Thanks to the capillary force, liquid analytes can be driven into sensing hotspots without external actuation systems. Besides, we demonstrate an in situ real-time dynamic monitoring process for the acetone molecular diffusion in deionized water. A small concentration change of 0.29% is distinguished and an ultrahigh sensitivity (0.8364 pmol^-1 %) is achieved. With the aid of IR fingerprint absorption, our HN-SEIRA platform brings the selectivity of liquid molecules with similar refractive indexes. It also resolves water absorption issues in traditional IR liquid sensors thanks to the sub-nm long light path. Considering the wide transparency window of Al₂O₃ in MIR (up to 5.2 μm), the HN-SEIRA platform covers more IR absorption range for liquid sensing compared to fused glass commonly used in micro/nanofluidics. Leveraging the aforementioned advantages, our work provides insights into developing a MIR real-time liquid sensing platform with intrinsic IR fingerprint selectivity, label-free ultrahigh sensitivity, and ultralow analyte volume, demonstrating a way toward quantitative molecule identification and dynamic analysis for the chemical and biological reaction processes.

Progress of infrared guided-wave nanophotonic sensors and devices

Nanophotonics, manipulating light-matter interactions at the nanoscale, is an appealing technology for diversified biochemical and physical sensing applications. Guided-wave nanophotonics paves the way to miniaturize the sensors and realize on-chip integration of various photonic components, so as to realize chip-scale sensing systems for the future realization of the Internet of Things which requires the deployment of numerous sensor nodes. Starting from the popular CMOS-compatible silicon nanophotonics in the infrared, many infrared guided-wave nanophotonic sensors have been developed, showing the advantages of high sensitivity, low limit of detection, low crosstalk, strong detection multiplexing capability, immunity to electromagnetic interference, small footprint and low cost. In this review, we provide an overview of the recent progress of research on infrared guided-wave nanophotonic sensors. The sensor configurations, sensing mechanisms, sensing performances, performance improvement strategies, and system integrations are described. Future development directions are also proposed to overcome current technological obstacles toward industrialization.