Growth of a Surface-Tethered, All-Carbon Backboned Fluoropolymer by Photoactivated Molecular Layer Deposition

The synthesis of an all-carbon backboned fluoropolymer using photoactivated molecular layer deposition (pMLD) is developed. pMLD is a vapor-phase, layer-by-layer, organic thin film synthesis method utilizing UV light, allowing for the creation of materials previously unavailable via thermal MLD. The carbon backbone is achieved by reacting an iodine-containing fluorocarbon monomer (1,4-diiodooctafluorobutane) and a diene monomer (1,5-hexadiene) under UV irradiation in a step-growth polymerization sequence. The polymerization occurs with a growth rate of 1.3 Å/cycle, forming a copolymer containing hydrocarbon and fluorocarbon segments. X-ray photoelectron spectroscopy (XPS) was used to confirm the formation of new carbon-carbon bonds and quantify the final film composition. In situ XPS thermal annealing experiments confirm the film stability up to 400 °C. The ability to pattern the fluoropolymer on a surface is demonstrated using a photomask, suggesting that these films could be incorporated into photolithographic processes. Together, these results demonstrate that pMLD can be used to synthesize carbon backboned films with photopatterning ability, expanding the available chemistries and potential applications of MLD polymers.

Polyarylene ether nitrile and boron nitride composites: coating with sulfonated polyarylene ether nitrile

Boron nitride (BN) coated with sulfonated poly-arylene ether nitrile (SPEN) (BN@SPEN) was used as additive to enhance the thermal conductivity of polyarylene ether nitrile. BN@SPEN was prepared by coating BN micro-platelets with SPEN through ultrasonic technology combined with the post-treatment bonding process. The prepared BN@SPEN was characterized by FTIR, TGA, SEM and TEM, which confirmed the successful coating of BN micro-platelets. The obtained BN@SPEN was introduced into the PEN matrix to prepare composite films by a solution casting method. The compatibility between BN and PEN matrix was studied by using SEM observation and rheology measurement. Furthermore, thermal conductivity of BN@SPEN/PEN films were carefully characterized. Thermal conductivity of BN@SPEN/PEN films was increased to 0.69 W/(m⋅K) at 20 wt% content of BN@SPEN, having 138% increment comparing with pure PEN.