Durable, Low-Cost, and Efficient Heat Spreader Design from Scrap Aramid Fibers and Hexagonal Boron Nitride

Aramid, chemically known as para phenylene terephthalamide or PPD-T, has been widely used in the reinforcement of telecommunication cables, rubber materials (transmission belts, pneumatic belts), ballistic clothing, and frictional materials primarily due to their high tensile resistance, high elastic modulus, and excellent thermal stability (−80–200 °C). These unique properties of aramid originate from its chemical structure, which consists of relatively rigid polymer chains linked by benzene rings and amide bonds (-CO-NH-). Here, in this work inspired by these properties, a heat spreader called Thermal Interface Material (TIM) is developed by synthesizing a resin from scrap aramid fibers. When hexagonal boron nitride (h-BN) as filler is introduced into the as-synthesized aramid resin to form a thin film of thermal sheet (50 μm), an in-plane thermal conductivity as high as 32.973 W/mK is achieved due to the firmly stacked and symmetric arrangement of the h-BN in the resin matrix. Moreover, the influence of h-BN platelet size is studied by fabricating thermal sheets with three different sizes of h-BN (6–7.5 μm, 15–21 μm, and 30–35 μm) in the aramid resin. The results of the study show that as platelet size increases, thermal conductivity increases significantly. Since the resin reported herein is developed out of scrap aramid fibers, the cost involved in the manufacture of the thermal sheet will be greatly lower. As the thermal sheet is designed with h-BN rather than graphene or carbonaceous materials, this high heat spreading sheet can be employed for 5G antenna modules where properties like a low dielectric constant and high electrical insulation are mandated.

Epoxy/melamine polyphosphate modified silicon carbide composites: Thermal conductivity and flame retardancy analyses

Silicon carbide (SiC) was modified by melamine polyphosphate (MPP)-modified silicone to form SiC-MPP, then incorporated into epoxy resin (EP) for developing thermally resistant composites, which showed thermal conductivity and flame retardancy performance. The EP/SiC-MPP composites were prepared by blending and cured under 60°C for 2 h and 150°C for 8 h. The grafting degree of SiC-MPP was analyzed using Fourier transform Infrared, scanning electron microscope, and thermogravimetric measurements. The flame retardancy of the EP/SiC-MPP composites was studied by UL-94 vertical combustion and cone calorimetry test. The results showed that for EP/SiC-MPP containing 20 wt%, the UL-94 was case V1. Also compared to pure epoxy, the peak heat release rate (PHRR) of composites was reduced from 800 to 304 kW·m−2. The thermal conductivity of EP/SiC-M20 composites was 0.53 W·m−1·K−1, almost 2.5-fold higher than pure epoxy (0.21 W·m−1·K−1). The as-prepared EP/SiC-MPP composites exhibited enhanced flame retardancy and thermal conductivity. Based on analyses performed, these composites took credit-related applications.

Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride

To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics model of h-BN/epoxy composites was established, and the thermal conductivity, volume resistivity, glass transition temperature, and microstructure parameters of h-BN/epoxy composites were obtained. When the h-BN content is 40 phr, the thermal conductivity of h-BN/epoxy composite is increased by 138% compared to pure EP, and the glass transition temperature is increased by 76 K. At the same time, doping h-BN will reduce the insulation performance of EP. However, the lowest volume resistivity of h-BN/epoxy composite is still 1.43 × 1015 Ω·cm, and the EP composite still has good insulation performance. The fraction free volume and mean square displacement of EP decrease with the doping of h-BN, which indicates that h-BN can hinder the movement of molecular segments of EP, which is the reason for the increase in glass transition temperature.

Highly thermally conductive boron nitride@UHMWPE composites with segregated structure

Highly thermally conductive boron nitride (BN)@ultra-high molecular weight polyethylene (UHMWPE) composites with the segregated structure were fabricated by powder mixing and hot pressing. Scanning electron microscopy and polarizing optical microscopy were used to analyze the dispersion of BN particles in the UHMWPE matrix. The morphology observation shows that BN particles are selectively located at the interfaces of UHMWPE particles and form continuous thermally conductive networks after the compression molding process. As a result, the thermal conductivity of the BN@UHMWPE composite increases to 3.37 W m−1 K−1 with 38.3 vol% BN, which is seven times larger than that of the pure UHMWPE. Furthermore, the incorporation of BN also influences the crystallinity and thermal properties of UHMWPE.