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For: Hariharaputhiran M, Ramarajan S, Li Y, Babu S, Babu S. Mechanism of Cu removal during CMP in H2O2-glycine based slurries. ACTA ACUST UNITED AC 2011. [DOI: 10.1557/proc-566-129] [Citation(s) in RCA: 10] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/13/2022]

For:	Hariharaputhiran M, Ramarajan S, Li Y, Babu S, Babu S. Mechanism of Cu removal during CMP in H2O2-glycine based slurries. ACTA ACUST UNITED AC 2011. [DOI: 10.1557/proc-566-129] [Citation(s) in RCA: 10] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/13/2022]

Number	Cited by Other Article(s)
1	Removal of Shallow and Deep Scratches and Pits from Polished Copper Films. ACTA ACUST UNITED AC 2003. [DOI: 10.1149/1.1602333] [Citation(s) in RCA: 9] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse

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Cited by Other Article(s)

Removal of Shallow and Deep Scratches and Pits from Polished Copper Films. ACTA ACUST UNITED AC 2003. [DOI: 10.1149/1.1602333] [Citation(s) in RCA: 9] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]