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Noureddine Y, Kraff O, Ladd ME, Wrede KH, Chen B, Quick HH, Schaefers G, Bitz AK. In vitro and in silico assessment of RF-induced heating around intracranial aneurysm clips at 7 Tesla. Magn Reson Med 2017; 79:568-581. [DOI: 10.1002/mrm.26650] [Citation(s) in RCA: 17] [Impact Index Per Article: 2.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/28/2016] [Revised: 01/11/2017] [Accepted: 01/26/2017] [Indexed: 11/12/2022]
Affiliation(s)
- Yacine Noureddine
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
- MR:comp GmbH, MR Safety Testing Laboratory; Gelsenkirchen Germany
| | - Oliver Kraff
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
| | - Mark E. Ladd
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
- Division of Medical Physics in Radiology (E020); German Cancer Research Center (DKFZ); Heidelberg Germany
| | - Karsten H. Wrede
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
- Department of Neurosurgery; University Hospital Essen; Essen Germany
| | - Bixia Chen
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
- Department of Neurosurgery; University Hospital Essen; Essen Germany
| | - Harald H. Quick
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
- High Field and Hybrid MR Imaging; University Hospital Essen; Essen Germany
| | - Gregor Schaefers
- MR:comp GmbH, MR Safety Testing Laboratory; Gelsenkirchen Germany
- MRI-STaR-Magnetic Resonance Institute for Safety, Technology and Research GmbH; Gelsenkirchen Germany
| | - Andreas K. Bitz
- Erwin L. Hahn Institute for Magnetic Resonance Imaging; University Duisburg-Essen; Essen Germany
- Division of Medical Physics in Radiology (E020); German Cancer Research Center (DKFZ); Heidelberg Germany
- Faculty of Electrical Engineering and Information Technology; FH Aachen-University of Applied Sciences; Aachen NRW Germany
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