The influence of polymerization conditions on color stability of three indirect composite materials

Depth of cure, water absorption, and solubility of indirect composites polymerized by light-emitting diode laboratory units

This study investigated the usefulness of a dental laboratory polymerization unit with light-emitting diode (LED) as a light source. The depth of cure (n=15), water absorption and solubility (n=9) of two indirect composite materials (Cesead N and Solidex Hardura) were evaluated by five dental laboratory polymerization units (LED Cure Master, Twinkle LED, α-Light V, α-Light II, and Hyper LII). Statistical analysis was performed by one-way ANOVA and Tukey test or non-parametric tests. Comparison of light sources for curing depth showed that metal halide had the highest value, followed by the LED group with similar values, and halogen lamps with the lowest value. The water absorption and solubility of the composite specimens polymerized with the three LED laboratory polymerization units were within the ISO recommended limit.

Effect of thione primers on adhesive bonding between an indirect composite material and Ag-Pd-Cu-Au alloy

The current study evaluated the effect of primers on the shear bond strength of an indirect composite material joined to a silverpalladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell). Disk specimens were cast from the alloy and were air-abraded with alumina. Eight metal primers were applied to the alloy surface. A light-polymerized indirect composite material (Solidex) was bonded to the alloy. Shear bond strength was determined both before and after the application of thermocycling. Two groups primed with Metaltite (thione) and M. L. Primer (sulfide) showed the greatest post-thermocycling bond strength (8.8 and 6.5 MPa). The results of the X-ray photoelectron spectroscopic (XPS) analysis suggested that the thione monomer (MTU-6) in the Metaltite primer was strongly adsorbed onto the Ag-Pd-Cu-Au alloy surface even after repeated cleaning with acetone. The application of either the thione (MTU-6) or sulfide primer is effective for enhancing the bonding between a composite material and Ag-Pd-Cu-Au alloy.