Qi Y, Li Y, Wang W. Electrochemical Reduction and Preparation of Cu-Se Thermoelectric Thin Film in Solutions with PEG.
NANOMATERIALS (BASEL, SWITZERLAND) 2022;
12:3169. [PMID:
36144957 PMCID:
PMC9501112 DOI:
10.3390/nano12183169]
[Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 08/17/2022] [Revised: 09/03/2022] [Accepted: 09/09/2022] [Indexed: 06/16/2023]
Abstract
Investigation of Cu(II) and Se(IV) electrochemical reduction processes in solutions with poly(ethylene glycol) (PEG) provides important theoretical guidance for the preparation of Cu-Se alloy films with stronger thermoelectric properties. The results reveal that PEG adsorbing on the electrode surface does not affect the electrochemical reduction mechanism of Cu(II), Se(IV), and Cu(II)-Se(IV), but inhibits the electrochemical reduction rates. The surface morphology and composition change with a negative shift in the deposition potentials. The Cu-Se alloy film, which was prepared at 0.04 V, was α-Cu2Se as-deposited and P-type thermoelectric material after annealing. The highest thermoelectric properties were as follows: Seebeck coefficient (α) was +106 μV·K-1 and 1.89 times of Cu-Se alloy film electrodeposited in Cu(II)-Se(IV) binary solution without PEG; resistivity (ρ) was 2.12 × 10-3 Ω·cm, and the calculated power factor (PF) was 5.3 μW·cm-1K-2 and 4.07 times that without PEG.
Collapse