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Lin N, Wang S, Li Y, Wang B, Shi S, He Y, Zhang W, Yu Y, Zhang Y, Zhang X, Wong K, Wang S, Chen X, Jiang H, Zhang X, Lin P, Xu X, Qi X, Wang Z, Shang D, Liu Q, Liu M. Resistive memory-based zero-shot liquid state machine for multimodal event data learning. NATURE COMPUTATIONAL SCIENCE 2025; 5:37-47. [PMID: 39789264 DOI: 10.1038/s43588-024-00751-z] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/20/2023] [Accepted: 11/25/2024] [Indexed: 01/12/2025]
Abstract
The human brain is a complex spiking neural network (SNN) capable of learning multimodal signals in a zero-shot manner by generalizing existing knowledge. Remarkably, it maintains minimal power consumption through event-based signal propagation. However, replicating the human brain in neuromorphic hardware presents both hardware and software challenges. Hardware limitations, such as the slowdown of Moore's law and Von Neumann bottleneck, hinder the efficiency of digital computers. In addition, SNNs are characterized by their software training complexities. Here, to this end, we propose a hardware-software co-design on a 40 nm 256 kB in-memory computing macro that physically integrates a fixed and random liquid state machine SNN encoder with trainable artificial neural network projections. We showcase the zero-shot learning of multimodal events on the N-MNIST and N-TIDIGITS datasets, including visual and audio data association, as well as neural and visual data alignment for brain-machine interfaces. Our co-design achieves classification accuracy comparable to fully optimized software models, resulting in a 152.83- and 393.07-fold reduction in training costs compared with state-of-the-art spiking recurrent neural network-based contrastive learning and prototypical networks, and a 23.34- and 160-fold improvement in energy efficiency compared with cutting-edge digital hardware, respectively. These proof-of-principle prototypes demonstrate zero-shot multimodal events learning capability for emerging efficient and compact neuromorphic hardware.
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Affiliation(s)
- Ning Lin
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
- The School of Microelectronics, Southern University of Science and Technology, Shenzhen, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Shaocong Wang
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Yi Li
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
| | - Bo Wang
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Shuhui Shi
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Yangu He
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Woyu Zhang
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
- University of Chinese Academy of Sciences, Beijing, China
| | - Yifei Yu
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Yue Zhang
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Xinyuan Zhang
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Kwunhang Wong
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Songqi Wang
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China
| | - Xiaoming Chen
- Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
| | - Hao Jiang
- Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Xumeng Zhang
- Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Peng Lin
- College of Computer Science and Technology, Zhejiang University, Hangzhou, China
| | - Xiaoxin Xu
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
- University of Chinese Academy of Sciences, Beijing, China
| | - Xiaojuan Qi
- Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, China
| | - Zhongrui Wang
- The School of Microelectronics, Southern University of Science and Technology, Shenzhen, China.
- ACCESS - AI Chip Center for Emerging Smart Systems, InnoHK Centers, Hong Kong Science Park, Hong Kong, China.
| | - Dashan Shang
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China.
- University of Chinese Academy of Sciences, Beijing, China.
| | - Qi Liu
- Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Ming Liu
- Key Lab of Fabrication Technologies for Integrated Circuits and Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
- Frontier Institute of Chip and System, Fudan University, Shanghai, China
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