Electroplated Functional Materials with 3D Nanostructures Defined by Advanced Optical Lithography and Their Emerging Applications

Nanoparticle Assembly: From Self-Organization to Controlled Micropatterning for Enhanced Functionalities

Nanoparticles form long-range micropatterns via self-assembly or directed self-assembly with superior mechanical, electrical, optical, magnetic, chemical, and other functional properties for broad applications, such as structural supports, thermal exchangers, optoelectronics, microelectronics, and robotics. The precisely defined particle assembly at the nanoscale with simultaneously scalable patterning at the microscale is indispensable for enabling functionality and improving the performance of devices. This article provides a comprehensive review of nanoparticle assembly formed primarily via the balance of forces at the nanoscale (e.g., van der Waals, colloidal, capillary, convection, and chemical forces) and nanoparticle-template interactions (e.g., physical confinement, chemical functionalization, additive layer-upon-layer). The review commences with a general overview of nanoparticle self-assembly, with the state-of-the-art literature review and motivation. It subsequently reviews the recent progress in nanoparticle assembly without the presence of surface templates. Manufacturing techniques for surface template fabrication and their influence on nanoparticle assembly efficiency and effectiveness are then explored. The primary focus is the spatial organization and orientational preference of nanoparticles on non-templated and pre-templated surfaces in a controlled manner. Moreover, the article discusses broad applications of micropatterned surfaces, encompassing various fields. Finally, the review concludes with a summary of manufacturing methods, their limitations, and future trends in nanoparticle assembly.

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Benzotriazole (BTA) is an important compound that demonstrates the strongest anticorrosion properties of copper and plays a role as a leveler and an additive to the electroplating bath for control of the roughness and corrosion resistance of the electrodeposited copper layer. In this paper, we combined cyclic voltammetry (CV), time-of-flight secondary-ion mass spectrometry (TOF-SIMS), surface enhanced Raman spectroscopy (SERS), and atomic force microscopy (AFM) to study the interaction of BTA with copper surfaces at varied concentrations with and without the presence of chloride ions. We identified the most relevant molecular copper and its complex forms with BTA on the copper electrodeposited layer. BTA is adsorbed and incorporated into the copper surface in monomeric, dimeric, trimeric, tetrameric, and pentameric forms, inhibiting the copper electrodeposition. The addition of chloride ions diminishes the inhibiting properties of BTA. The Cu-BTA-Cl complexes were identified in the forms C12H8N6Cu2Cl- and C6H4N3CuCl-. Coadsorption of chloride ions and BTA molecules depends on their concentration and applied potential. Chloride ions are replaced by BTA molecules. BTA and chloride ions, depending on their concentration and applied potential, control the copper nucleation processes at the micro- and nanoscales. We compared the abilities and limitations of TOF-SIMS and SERS for studies of the interactions of benzotriazole with copper and chloride ions at the molecular level.

Influence of Bath Hydrodynamics on the Micromechanical Properties of Electrodeposited Nickel-Cobalt Alloys

The influence of bath hydrodynamics on the resultant micromechanical properties of electrodeposited nickel-cobalt alloy system is investigated. The bath hydrodynamics realized by magnetic stirring is simulated using COMSOL Multiphysics and a region of minimum variation in velocity within the electrolytic cell is determined and validated experimentally. Nickel-cobalt alloy and nickel coating samples are deposited galvanostatically (50 mA/cm²) with varying bath velocity (0 to 42 cm/s). The surface morphology of samples gradually changed from granular (fractal dimension 2.97) to more planar (fractal dimension 2.15) growth type, and the according average roughness decreased from 207.5 nm to 11 nm on increasing the electrolyte velocity from 0 to 42 cm/s for nickel-cobalt alloys; a similar trend was also found in the case of nickel coatings. The calculated grain size from the X-ray diffractograms decreased from 31 nm to 12 nm and from 69 nm to 26 nm as function of increasing velocity (up to 42 cm/s) for nickel-cobalt and nickel coatings, respectively. Consecutively, the measured Vickers microhardness values increased by 43% (i.e., from 393 HV0.01 to 692 HV0.01) and by 33% (i.e., from 255 HV0.01 to 381 HV0.01) for nickel-cobalt and nickel coatings, respectively, which fits well with the Hall–Petch relation.